Patents by Inventor Ko-Chun Chen

Ko-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166756
    Abstract: Anti-CXCR2 antibodies that recognize CXCR2 and inhibit the activity of CXCR2, and the use of the anti-CXCR2 antibodies in the treatment of pancreatic cancer and leukemia.
    Type: Application
    Filed: April 25, 2022
    Publication date: May 23, 2024
    Applicant: KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Li-Tzong Chen, Wen-Chun Hung, Ko-Jiunn Liu
  • Patent number: 11654703
    Abstract: A movable paper guide structure of a label printer includes: a paper guide body installed in the label printer including a roller and a print head; a movable unit that is movably installed on the paper guide body close to one end of the print head, adapts to a displacement of the roller and the print head because of a changed contact position, and keeps approaching the print head during a print process of the label printer for neither gap between the tip of the movable unit and the print head nor other problems such as a label sticker on printing paper improperly peeled off, printing crooked and paper jam.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 23, 2023
    Assignee: TSC AUTO ID TECHNOLOGY CO., LTD.
    Inventors: Hawk Chiang, Ko-Chun Chen, Shang-Shih Kuo
  • Patent number: 11648783
    Abstract: A portable label printer for printing content onto a surface of a label is provided. The label has a chip disposed therein. The portable label printer includes a main body, an RFID antenna assembly, a front cover unit, a back cover unit, and a print head module. The front and back cover units are disposed in the main body, and a paper exit port is formed between the front and back cover units. The RFID antenna assembly is disposed in the main body and adjacent to the paper exit port. The print head module is disposed in the main body and under the RFID antenna assembly. The label first passes through the print head module, and then passes through the RFID antenna assembly. When the label passes through the RFID antenna assembly, the RFID antenna assembly performs data reading or data writing on the chip of the label.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: May 16, 2023
    Assignee: TSC AUTO ID TECHNOLOGY CO., LTD.
    Inventors: Ko-Chun Chen, Jung-Te Cheng, Hui-Tse Chang, Wen-Wei Tsai
  • Publication number: 20230062948
    Abstract: A movable paper guide structure of a label printer includes: a paper guide body installed in the label printer including a roller and a print head; a movable unit that is movably installed on the paper guide body close to one end of the print head, adapts to a displacement of the roller and the print head because of a changed contact position, and keeps approaching the print head during a print process of the label printer for neither gap between the tip of the movable unit and the print head nor other problems such as a label sticker on printing paper improperly peeled off, printing crooked and paper jam.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 2, 2023
    Inventors: HAWK CHIANG, KO-CHUN CHEN, SHANG-SHIH KUO
  • Publication number: 20220379583
    Abstract: The present application relates to a composite heat dissipation material. The composite heat dissipation material comprises at least one artificial graphite layer and a graphitic heat dissipation layer. The graphitic heat dissipation layer includes a graphite material layer, and the graphite material layer is not formed from artificial graphite materials. Further, the graphitic heat dissipation layer is bonded to the artificial graphite layer. The composite heat dissipation material of the present application can efficiently and rapidly dissipate heat energy produced from a heating source, thereby lowering temperature thereof.
    Type: Application
    Filed: April 19, 2022
    Publication date: December 1, 2022
    Inventor: Ko-Chun CHEN
  • Publication number: 20220063296
    Abstract: A portable label printer for printing content onto a surface of a label is provided. The label has a chip disposed therein. The portable label printer includes a main body, an RFID antenna assembly, a front cover unit, a back cover unit, and a print head module. The front and back cover units are disposed in the main body, and a paper exit port is formed between the front and back cover units. The RFID antenna assembly is disposed in the main body and adjacent to the paper exit port. The print head module is disposed in the main body and under the RFID antenna assembly. The label first passes through the print head module, and then passes through the RFID antenna assembly. When the label passes through the RFID antenna assembly, the RFID antenna assembly performs data reading or data writing on the chip of the label.
    Type: Application
    Filed: January 21, 2021
    Publication date: March 3, 2022
    Inventors: KO-CHUN CHEN, JUNG-TE CHENG, HUI-TSE CHANG, WEN-WEI TSAI
  • Patent number: 9097468
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Grant
    Filed: February 5, 2012
    Date of Patent: August 4, 2015
    Assignee: WAH HONG INDUSTRIAL CORP.
    Inventors: Ko-Chun Chen, Chiu-Lang Lin
  • Publication number: 20150109173
    Abstract: An apparatus for a case for an electronic device containing one or more antennas is disclosed. The apparatus for the electronic device comprises a metal layer, a dielectric layer and a masking layer, wherein the masking layer has one or more channels, and some of the channels have antenna therein. The antenna extends from one wall to another wall of the case.
    Type: Application
    Filed: November 4, 2014
    Publication date: April 23, 2015
    Inventor: Ko-Chun CHEN
  • Patent number: 8955580
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: February 17, 2015
    Assignee: Wah Hong Industrial Corp.
    Inventors: Ko-Chun Chen, Chiu-Lang Lin
  • Publication number: 20150043162
    Abstract: An electromagnetic interference (EMI) shield for reducing the electromagnetic interference and substantially uniformly distribute heat is disclosed. The EMI shield comprises a first layer configured to shield EMI and a second layer configured to dissipate heat. The EMI shield further comprises an interface. Some embodiments also provide methods for shielding EMI and uniformly dissipate heat of an electronic component.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 12, 2015
    Inventors: Ko-Chun CHEN, Wen-Hsiung HUANG, Pei-Min YANG, Chun-Chang LIANG
  • Patent number: 8941543
    Abstract: An apparatus for a case for an electronic device containing one or more antennas is disclosed. The apparatus for the electronic device comprises a metal layer, a dielectric layer and a masking layer, wherein the masking layer has one or more channels, and some of the channels have antenna therein. The antenna extends from one wall to another wall of the case.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: January 27, 2015
    Assignee: Wah Hong Industrial Corp.
    Inventor: Ko-Chun Chen
  • Publication number: 20140338879
    Abstract: A heat-transfer apparatus for dissipating heat from an electronic device is disclosed. The heat-transfer apparatus includes a composite, comprising a metal layer, a dielectric layer and one or more electrically conductive layers. The composite is plastically deformed and is substantially free of crack. A backlight apparatus comprising the heat-transfer apparatus is also provided.
    Type: Application
    Filed: January 17, 2014
    Publication date: November 20, 2014
    Inventor: Ko-Chun CHEN
  • Publication number: 20140340873
    Abstract: A heat-transfer apparatus for dissipating heat from an electronic device is disclosed. The heat-transfer apparatus includes a composite, comprising a metal layer, a dielectric layer and one or more electrically conductive layers. The composite is plastically deformed and is substantially free of crack. A backlight apparatus comprising the heat-transfer apparatus is also provided.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 20, 2014
    Inventor: Ko-Chun CHEN
  • Publication number: 20140203975
    Abstract: An apparatus for a case for an electronic device containing one or more antennas is disclosed. The apparatus for the electronic device comprises a metal layer, a dielectric layer and a masking layer, wherein the masking layer has one or more channels, and some of the channels have antenna therein. The antenna extends from one wall to another wall of the case.
    Type: Application
    Filed: January 21, 2014
    Publication date: July 24, 2014
    Inventor: Ko-Chun CHEN
  • Publication number: 20140185323
    Abstract: A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20140069622
    Abstract: A multi-layer heat dissipation composite for reducing the external surface temperature of an electronic device is disclosed. The heat dissipation composite comprises a reflective component and a component with anisotropic property. The heat dissipation composite further comprises an adhesive. Some embodiments also provide methods for reducing the external surface temperature of an electronic device.
    Type: Application
    Filed: July 9, 2013
    Publication date: March 13, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang Lin
  • Publication number: 20140049985
    Abstract: A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.
    Type: Application
    Filed: August 19, 2013
    Publication date: February 20, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20140049984
    Abstract: A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.
    Type: Application
    Filed: August 19, 2013
    Publication date: February 20, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20120132404
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Application
    Filed: February 5, 2012
    Publication date: May 31, 2012
    Applicant: WAH HONG INDUSTRIAL CORP.
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20110214851
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Application
    Filed: May 16, 2011
    Publication date: September 8, 2011
    Applicant: WAH HONG INDUSTRIAL CORP.
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN