Abstract: An electronic device includes a semiconductor substrate having a first conductive routing structure on a first side of the semiconductor substrate, and a low aspect ratio via opening extending from the first side to an opposite second side. The electronic device includes a transparent cover over a portion of the first side and covering the patterned first conductive routing structure, as well as an insulator layer including a photo-imageable material on the second side and along a sidewall of the via opening, and a second conductive routing structure on an outer side of the insulator layer and extending through the via opening and directly contacting a portion of the first conductive routing structure.

Abstract: A tripod type homokinetic universal joint which comprises an outer member, a tripod member, and bearing assemblies interposed between the outer member and the tripod member. Each bearing assembly has a plurality of rows of rollers adapted to roll on rolling guide surfaces on track grooves formed in the inner wall of the outer member. The rolling guide surface is defined by side faces of the track groove and near-corner portions of the base of the track groove. The side faces are so oblique that the track groove will be narrowed toward its inlet. Whereby the rollers cannot get off the rolling guide surface even if no shoulders are formed on the side faces of the track groove.