Abstract: A polyolefin packaging material includes a first polyolefin polymer film, a second polyolefin polymer film, and a polyolefin bonding adhesive layer. The first polyolefin polymer film is a cast polypropylene film (CPP film). The second polyolefin polymer film is a biaxially oriented polypropylene film (BOPP film). The polyolefin bonding adhesive layer is bonded between the first polyolefin polymer film and the second polyolefin polymer film. The polyolefin bonding adhesive layer is formed of a polyolefin copolymer modified by maleic anhydride, the polyolefin copolymer is formed by copolymerization of at least two kinds of C2 to C4 olefin molecules, a graft ratio of the maleic anhydride grafted onto the polyolefin copolymer is between 0.5% and 5%, and a melt index of the polyolefin copolymer is between 1 g/10 min and 5 g/10 min.

Abstract: A polyolefin bonding adhesive film includes a support base layer and a bonding adhesive layer formed on a side surface of the support base layer by co-extrusion. The support base layer is a polypropylene film. The bonding adhesive layer is formed of a first polyolefin copolymer modified by maleic anhydride. The first polyolefin copolymer is formed by copolymerization of at least two kinds of C2 to C4 olefin molecules, a first graft ratio of the maleic anhydride grafted onto the first polyolefin copolymer is between 0.5% and 5%, and a first melt index of the first polyolefin copolymer is between 3 g/10 min and 5 g/10 min.

Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: An optical device is provided. The optical device includes a substrate that has a top surface and a bottom surface. The optical device also includes a cover layer disposed on the substrate, and the cover layer has a top surface and a bottom surface. The top surface of the cover layer faces the bottom surface of the substrate. The optical device further includes a first meta structure disposed on the bottom surface of the substrate and a second meta structure disposed on the top surface of the cover layer. Moreover, the optical device includes a detector disposed on the bottom surface of the cover layer.

Abstract: An optical device is provided. The optical device includes a substrate, a waveguide layer, a first input grating, a first fold grating, and an isolation layer. The waveguide layer is disposed on the substrate. The first input grating is disposed in the waveguide layer. A first incident light passes through the first input grating to form a first light. The first fold grating is disposed in the waveguide layer. The first light passes through the first fold grating to form a first diffracted light in a first direction and a second diffracted light in a second direction. The isolation layer includes a first well array and is disposed on the waveguide layer. When the first diffracted light in the first direction travels to a first top portion corresponding to the first well array of the waveguide layer, the first diffracted light further passes through the first well array.

Abstract: An image sensor includes a group of sensor units, a color filter layer disposed within the group of sensor units, and a dielectric structure and a metasurface disposed corresponding to the color filter layer. The metasurface includes a plurality of peripheral nanoposts located at corners of the group of sensor units from top view, respectively, a central nanopost enclosed by the plurality of peripheral nanoposts, and a filling material laterally surrounding the plurality of peripheral nanoposts and the central nanopost. The central nanopost is offset from a center point of the group of sensor units by a distance from top view.

Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: A semiconductor device includes a transistor having a source/drain and a gate. The semiconductor device also includes a conductive contact for the transistor. The conductive contact provides electrical connectivity to the source/drain or the gate of the transistor. The conductive contact includes a plurality of barrier layers. The barrier layers have different depths from one another.

Abstract: A semiconductor device includes a transistor having a source/drain and a gate. The semiconductor device also includes a conductive contact for the transistor. The conductive contact provides electrical connectivity to the source/drain or the gate of the transistor. The conductive contact includes a plurality of barrier layers. The barrier layers have different depths from one another.

Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: A manufacturing method includes the following operations. A lens layer is formed above a substrate. A patterned hard mask layer is formed on the lens layer. The lens layer is etched to transfer a pattern of the patterned hard mask layer to the lens layer such that a plurality of lenses are defined, wherein the lens are micro-lenses or meta-surface lenses. A cladding layer is formed to cover the plurality of lenses and the substrate. Portions of the cladding layer are etched to form a first inclined sidewall and a second inclined sidewall, wherein the first inclined sidewall is above the second inclined sidewall, wherein a projection of the first inclined sidewall on the substrate is spaced apart from a projection of the second inclined sidewall on the substrate.

Abstract: An image sensor includes a photodiode array having a plurality of photodiodes, a grid disposed over the photodiode array, and a plurality of optical components disposed over the grid and corresponding to the plurality of apertures, respectively. The grid defines a plurality of apertures corresponding to the plurality of photodiodes, respectively. The optical components includes a first optical component above a first photodiode of the plurality of photodiodes, the first optical component includes at least one lens and provides at least one focus on the first photodiode, in which the focus of the lens of the first optical component misaligns a center of the first photodiode, in a plan view.

Abstract: A waveguide structure is provided. The waveguide structure includes waveguide combiners stacked one upon the other. Each waveguide combiner includes a waveguide plate and an input coupler disposed on the waveguide plate. The input coupler of at least one waveguide combiner includes first grating pillars, and each first grating pillar has a gradually changing refractive index.

Abstract: The optical system includes a projector, a deflector, a polarizer, a first grating coupler structure, and a second grating coupler structure. The projector emits three beams having different wavelengths. The deflector is disposed below the projector and is configured to change incident angles of the three beams and to focus the three beams at the same region of the first grating coupler structure. The first grating coupler structure is below the deflector and is configured to couple the three beams into a light-guide lens such that the three beams travel the same optical path within the light-guide lens. The light-guide lens is connected to the first grating coupler structure and is configured to transmit the three beams. The polarizer is disposed between the projector and the deflector and is configured to filter out transverse electric (TE) modes or transverse magnetic (TM) modes of the three beams.

Abstract: A biosensor is provided. The biosensor includes a substrate, photodiodes, pixelated filters, an excitation light rejection layer and an immobilization layer. The substrate has pixels. The photodiodes are disposed in the substrate and correspond to one of the pixels, respectively. The pixelated filters are disposed on the substrate. The excitation light rejection layer is disposed on the pixelated filter. The immobilization layer is disposed on the excitation light rejection layer.

Abstract: An optical fingerprint sensor is provided. The optical fingerprint sensor includes a substrate, a plurality of light-shielding layers and a plurality of groups of microlenses. The substrate has a plurality of photoelectric conversion units disposed therein. The light-shielding layers are sequentially disposed on the substrate. Each light-shielding layer includes a plurality of apertures formed therein. Each group of microlenses is disposed above the apertures formed in an uppermost light-shielding layer and overlies one photoelectric conversion unit.

Abstract: A biosensor structure is provided. The biosensor structure includes a substrate, an insulating layer, a semiconductor layer and a gold disc. The insulating layer is disposed on the substrate. The semiconductor layer is disposed on the insulating layer, and a well is disposed in the semiconductor layer. The gold disc is disposed at bottom of the well.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having photoelectric conversion elements. The semiconductor device also includes a first light-shielding layer disposed on the substrate and having first apertures. The semiconductor device further includes a light-adjusting structure disposed on the first light-shielding layer. Moreover, the semiconductor device includes a second light-shielding layer disposed on the light-adjusting structure and having second apertures. The semiconductor device also includes first light-condensing structures covering the second apertures. The semiconductor device further includes a third light-shielding layer disposed on the first light-condensing structure and having third apertures. Furthermore, the semiconductor device includes second light-condensing structures covering the third apertures.