Abstract: Disclosed in an embodiment is a light-emitting element package comprising: a body including a cavity; a light-emitting element arranged on the bottom surface of the cavity and including a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer, which is arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a light-transmitting member arranged on the upper part of the cavity, wherein the body includes: a lower body including the bottom surface of the cavity; an upper body including the lateral surface of the cavity; and a first insulating layer arranged between the lower body and the upper body, the lower body includes a first conductive body and a second conductive body insulated and arranged together with the first conductive body, the first conductive type semiconductor layer is electrically connected with the first conductive body, the second conductive type semiconductor layer is electrical

Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition comprising a resin and a filler provided in the resin, wherein the resin includes a soluble liquid crystal polymer resin, and wherein the filler has a negative coefficient of thermal expansion (negative CTE) and is provided in the soluble liquid crystal polymer resin.

Abstract: An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.

Abstract: Disclosed in an embodiment is a semiconductor device package comprising: a body comprising a cavity; a semiconductor device disposed within the cavity; and a light transmission member disposed on an upper portion of the cavity, wherein the body comprises a first conductive part and a second conductive part disposed to be spaced apart from each other in a first direction, a first insulating part disposed between the first conductive part and the second conductive part, and a second insulating part disclosed in an edge region where a lower surface and side surfaces of the body meet, wherein the cavity comprises a stepped portion on which the light transmission member is disposed, and wherein the second insulating part overlaps with the stepped portion in a vertical direction of the body.

Abstract: An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side sur

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Abstract: Disclosed in an embodiment is a light-emitting element package comprising: a body including a cavity; a light-emitting element arranged on the bottom surface of the cavity and including a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer, which is arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a light-transmitting member arranged on the upper part of the cavity, wherein the body includes: a lower body including the bottom surface of the cavity; an upper body including the lateral surface of the cavity; and a first insulating layer arranged between the lower body and the upper body, the lower body includes a first conductive body and a second conductive body insulated and arranged together with the first conductive body, the first conductive type semiconductor layer is electrically connected with the first conductive body, the second conductive type semiconductor layer is electrical

Abstract: An embodiment provides a semiconductor device package, the semiconductor device package comprising: a substrate including an electrode disposed on one surface; a metal sidewall disposed on the substrate while surrounding the electrode; a semiconductor device disposed on the electrode; and a light transmitting member disposed on the metal sidewall to cover the semiconductor device, wherein the metal sidewall has the inner surface and the outer surface which are corrugated, and includes: a first metal part disposed on the substrate; a second metal part disposed on the first metal part; and a third metal part disposed on the second metal part, and the inner surface or the outer surface of the metal sidewall includes a recess portion between the second metal part and the third metal part.

Abstract: Disclosed herein is a light-emitting device package a body including a cavity; a first electrode disposed on a bottom surface of the cavity; a plurality of second electrodes disposed on the bottom surface of the cavity and configured to surround the first electrode; a first light-emitting device disposed on the first electrode; a second light-emitting device disposed on one among the plurality of second electrodes; and a light-transmitting member disposed on the body, wherein the bottom surface of the cavity includes a first edge extending in a first direction, a second edge configured to face the first edge and extend in the first direction, a third edge configured to extend in a second direction perpendicular to the first direction and connected to the first and second edges, and a fourth edge configured to face the third edge, extend in the second direction, and connected to the first and second edges; the first electrode includes an arrangement portion, on which the first light-emitting device is disposed

Abstract: Disclosed in an embodiment is a semiconductor device package comprising: a body comprising a cavity; a semiconductor device disposed within the cavity; and a light transmission member disposed on an upper portion of the cavity, wherein the body comprises a first conductive part and a second conductive part disposed to be spaced apart from each other in a first direction, a first insulating part disposed between the first conductive part and the second conductive part, and a second insulating part disclosed in an edge region where a lower surface and side surfaces of the body meet, wherein the cavity comprises a stepped portion on which the light transmission member is disposed, and wherein the second insulating part overlaps with the stepped portion in a vertical direction of the body.

Abstract: An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.

Abstract: Disclosed herein is a semiconductor device package including: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed on the cavity; and an adhesive layer which fixes the light transmitting member to the body, wherein the cavity includes a stepped portion on which the light transmitting member is disposed, the stepped portion includes a first bottom surface and a third bottom surface spaced apart from each other in a first direction, a second bottom surface and a fourth bottom surface spaced apart from each other in a second direction perpendicular to the first direction, a first connecting portion in which the first bottom surface and the second bottom surface are connected to each other, a second connecting portion in which the second bottom surface and the third bottom surface are connected to each other, a third connecting portion in which the third bottom surface and the fourth bottom surface are connected to each other, and a fourth connecting porti

Abstract: An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side sur

Abstract: Disclosed herein is a semiconductor device package including: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed on the cavity; and an adhesive layer which fixes the light transmitting member to the body, wherein the cavity includes a stepped portion on which the light transmitting member is disposed, the stepped portion includes a first bottom surface and a third bottom surface spaced apart from each other in a first direction, a second bottom surface and a fourth bottom surface spaced apart from each other in a second direction perpendicular to the first direction, a first connecting portion in which the first bottom surface and the second bottom surface are connected to each other, a second connecting portion in which the second bottom surface and the third bottom surface are connected to each other, a third connecting portion in which the third bottom surface and the fourth bottom surface are connected to each other, and a fourth connecting porti

Abstract: Disclosed herein is a light-emitting device package a body including a cavity; a first electrode disposed on a bottom surface of the cavity; a plurality of second electrodes disposed on the bottom surface of the cavity and configured to surround the first electrode; a first light-emitting device disposed on the first electrode; a second light-emitting device disposed on one among the plurality of second electrodes; and a light-transmitting member disposed on the body, wherein the bottom surface of the cavity includes a first edge extending in a first direction, a second edge configured to face the first edge and extend in the first direction, a third edge configured to extend in a second direction perpendicular to the first direction and connected to the first and second edges, and a fourth edge configured to face the third edge, extend in the second direction, and connected to the first and second edges; the first electrode includes an arrangement portion, on which the first light-emitting device is disposed

Abstract: According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Abstract: According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

Abstract: One embodiment provides a light emitting device comprising: a substrate; a first electrode arranged on the substrate; a light emitting structure arranged on the first electrode and including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers; and a second electrode arranged on the second semiconductor layer, wherein the second electrode includes: a pad electrode; and a branch electrode extending from the pad electrode and having a hexagonal structure for enabling an upper surface of the second semiconductor layer to be exposed in a hexagonal shape.