Patents by Inventor Koh Hoo Goh

Koh Hoo Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and method for its production
    Patent number: 8049311
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Ting Hng
  • Chip-sized flip-chip semiconductor package and method for making the same
    Patent number: 7615410
    Abstract: A semiconductor package (10; 14) comprises a semiconductor die (2; 2?) with a plurality of contact areas (4) on its active surface and an electrically conductive bump (7) on each contact area (4). The die (2; 2?) and electrically conductive bumps (7) are encapsulated in a plastic housing (11) so that the plastic housing (11) encapsulates at least sides of the die (2; 2?) and sides of the electrically conductive bumps (7).
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: November 10, 2009
    Assignee: Infineon Technologies AG
    Inventors: Koh Hoo Goh, Bun-Hin Keong, Abdul Rahman Mohamed
  • Electronic Component and Method for its Production
    Publication number: 20090250807
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Application
    Filed: May 4, 2009
    Publication date: October 8, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Tin Hng
  • Leadframe for use in a semiconductor package
    Patent number: 7432584
    Abstract: A leadframe comprises a die mounting area, a plurality of lead fingers and a metal deposit having a negative electrochemical potential with respect to a standard H2 half cell. A semiconductor package comprises the leadframe and a semiconductor chip having a plurality of contact areas mounted to the die mounting area and electrically connected to the inner ends of the lead fingers of the leadframe by a plurality of bond wires. The semiconductor chip, the bond wires and inner portions of the lead fingers are encapsulated by a plastic housing.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: October 7, 2008
    Assignee: Infineon Technologies, AG
    Inventors: Koh Hoo Goh, Bun-Hin Keong
  • Chip-Sized Flip-Chip Semiconductor Package and Method for Making the Same
    Publication number: 20070029666
    Abstract: A semiconductor package (10; 14) comprises a semiconductor die (2; 2?) with a plurality of contact areas (4) on its active surface and an electrically conductive bump (7) on each contact area (4). The die (2; 2?) and electrically conductive bumps (7) are encapsulated in a plastic housing (11) so that the plastic housing (11) encapsulates at least sides of the die (2; 2?) and sides of the electrically conductive bumps (7).
    Type: Application
    Filed: July 12, 2006
    Publication date: February 8, 2007
    Inventors: Koh Hoo Goh, Bun-Hin Keong, Abdul Mohamed