Patents by Inventor Koh MURAI

Koh MURAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11858091
    Abstract: An apparatus for recirculating fluids in semiconductor systems. The apparatus including a base portion, an inlet portion coupled to a first end of the base portion, and a nozzle coupled to a second end of the base portion. The nozzle including a helical groove extending from a position near a nozzle base portion to a position near a tip of the nozzle portion. The helical groove extending from an exterior surface through the nozzle portion to an interior surface of the nozzle portion. Methods of using the apparatus in a semiconductor recirculation system are also disclosed.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: January 2, 2024
    Assignee: Mega Fluid Systems, Inc.
    Inventors: Robert Eiseler, Koh Murai, Michael Perkins, II
  • Publication number: 20200171622
    Abstract: An apparatus for recirculating fluids in semiconductor systems. The apparatus including a base portion, an inlet portion coupled to a first end of the base portion, and a nozzle coupled to a second end of the base portion. The nozzle including a helical groove extending from a position near a nozzle base portion to a position near a tip of the nozzle portion. The helical groove extending from an exterior surface through the nozzle portion to an interior surface of the nozzle portion. Methods of using the apparatus in a semiconductor recirculation system are also disclosed.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 4, 2020
    Applicant: Mega Fluid Systems, Inc.
    Inventors: Robert EISELER, Koh MURAI, Michael PERKINS, II