Patents by Inventor Kohei Higashi

Kohei Higashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131554
    Abstract: A cup includes a flow passage forming member forming a first exhaust passage, a scattered substance collection passage configured to collect a scattered substance from a substrate, and a second exhaust passage in sequence as going upwards; a joint exhaust passage connected to each of the first exhaust passage, the scattered substance collection passage, and the second exhaust passage; a first annular member included in the flow passage forming member, the scattered substance collection passage and the first exhaust passage being formed above and below the first annular member, respectively; and a communication hole provided in the flow passage forming member to allow the scattered substance collection passage and the joint exhaust passage to communicate with each other such that a pressure loss of the communication hole is large as compared to a pressure loss in a gap formed between the first annular member and the substrate.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Inventors: Ryunosuke Higashi, Kenji Yada, Yoshihiro Imura, Kohei Kawakami, Yuhei Maeda
  • Publication number: 20240125697
    Abstract: A substrate processing apparatus includes a supply channel through which a liquid to be supplied to a substrate flows; and a foreign substance detecting unit configured to detect a foreign substance in the liquid based on a signal obtained when light, which is near-infrared light, is radiated toward a flow path forming unit constituting a part of the supply channel by a light projector so that light is emitted from the flow path forming unit and a light receiver receives the light emitted from the flow path forming unit.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 18, 2024
    Inventors: Koudai Higashi, Masato Hayashi, Kohei Noguchi
  • Patent number: 11835849
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A), in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group, a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A), a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A), a glass transition temperature of the resin (A) is 145° C. or lower, and the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 ?m or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: December 5, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Tsutomu Yoshimura, Yasunori Yonekuta, Naoya Hatakeyama, Kohei Higashi, Yoichi Nishida
  • Publication number: 20230380847
    Abstract: Ultrasound oscillators emit ultrasonic waves. An ultrasonic driving part drives the ultrasound oscillators such that the ultrasonic waves propagates in a first direction D1 from one side toward the other side and propagates in a second direction D2 opposite to the first direction D1 in a structure S. The ultrasonic driving part drives the ultrasound oscillators by changing frequencies of the ultrasound oscillators such that a current value flowing through the ultrasound oscillators is a maximal current value.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Kohei HIGASHI, Koichiro NAKAMURA
  • Publication number: 20230240701
    Abstract: An ultrasonic treatment tool includes a grip part that grips a structure in a subject; and an ultrasound oscillator unit that is provided in the grip part and disposed at a position facing the gripped structure. A piezoelectric material constituting the ultrasound oscillator unit has a mechanical quality coefficient of 500 or more.
    Type: Application
    Filed: April 13, 2023
    Publication date: August 3, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Kohei HIGASHI, Koichiro NAKAMURA
  • Patent number: 11687001
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A), in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group, a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A), a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A), a glass transition temperature of the resin (A) is 145° C. or lower, and the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 ?m or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: June 27, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Tsutomu Yoshimura, Yasunori Yonekuta, Naoya Hatakeyama, Kohei Higashi, Yoichi Nishida
  • Publication number: 20230194983
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A), in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group, a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A), a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A), a glass transition temperature of the resin (A) is 145° C. or lower, and the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 µm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Tsutomu YOSHIMURA, Yasunori YONEKUTA, Naoya HATAKEYAMA, Kohei HIGASHI, Yoichi NISHIDA
  • Patent number: 11650501
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A), in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group, a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A), a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A), a glass transition temperature of the resin (A) is 145° C. or lower, and the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 ?m or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: May 16, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Tsutomu Yoshimura, Yasunori Yonekuta, Naoya Hatakeyama, Kohei Higashi, Yoichi Nishida
  • Publication number: 20230099422
    Abstract: A method for producing a composition, the method being for producing a composition using a stirring device provided with a stirring tank and a stirrer, includes a mixing step of charging a resin, an acid generator, and a solvent into the stirring tank, and a stirring step of stirring the mixture accommodated in the stirring tank, using the stirrer, in which a ratio c of a content of the acid generator to a total mass of the mixture is 0.3% to 2.5% by mass, the stirrer is provided with a rotatable stirring shaft, a plurality of support parts attached to the stirring shaft, and a plurality of stirring elements attached to each of end parts of the plurality of support parts, the shape and the arrangement of the stirring elements are specified, and the positions of the plurality of stirring elements are specified so as to satisfy a specific Expression (1).
    Type: Application
    Filed: September 2, 2022
    Publication date: March 30, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Takumi TANAKA, Takashi BANNAI, Takamitsu TOMIGA, Kohei HIGASHI, Fumihiro YOSHINO, Yuma KURUMISAWA
  • Publication number: 20230028463
    Abstract: A method for producing an actinic ray-sensitive or radiation-sensitive resin composition, comprising: preparing an intermediate solution which includes a photoacid generator and a solvent; and mixing the intermediate solution with at least a resin to prepare an actinic ray-sensitive or radiation-sensitive resin composition having a viscosity of 10 mPa·s or more.
    Type: Application
    Filed: September 2, 2022
    Publication date: January 26, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Takamitsu Tomiga, Kohei Higashi, Fumihiro Yoshino, Yuma Kurumisawa, Takumi Tanaka
  • Patent number: 11333978
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition for forming a pattern used as a mask in an ion implanting, including a resin including a repeating unit having an acid-decomposable group, a photoacid generator, and an additive having a melting point or glass transition temperature of lower than 25° C. and a molecular weight of 180 or more, in which a content of the additive is 1% by mass or more with respect to a total solid content in the composition.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: May 17, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Kohei Higashi, Hideki Takakuwa
  • Publication number: 20220146937
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin having a polarity that increases by an action of an acid, (B) a photoacid generator, (P) an amine oxide, and (D) an acid diffusion control agent (provided that acid diffusion control agents corresponding to the amine oxide are excluded), in which a content of the amine oxide (P) is from 0.01 ppm to 1,000 ppm with respect to a total mass of the actinic ray-sensitive or radiation-sensitive resin composition, and a mass ratio of the acid diffusion control agent (D) to the amine oxide (P) is more than 1 and 10,000 or less.
    Type: Application
    Filed: January 21, 2022
    Publication date: May 12, 2022
    Applicant: FUJIFILM Corporation
    Inventors: Naoya Hatakeyama, Yasunori Yonekuta, Takamitsu Tomiga, Kohei Higashi, Fumihiro Yoshino
  • Publication number: 20220137512
    Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, (B) a photoacid generator, and an anion (P) which is one or more anions selected from the group consisting of NO3?, SO42?, Cl?, and Br?, in which a content of the anion (P) is from 0.01 ppb to 100 ppm with respect to a total mass of the actinic ray-sensitive or radiation-sensitive resin composition, an actinic ray-sensitive or radiation-sensitive film formed from the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 5, 2022
    Applicant: FUJIFILM Corporation
    Inventors: Naoya HATAKEYAMA, Yasunori YONEKUTA, Takamitsu TOMIGA, Kohei HIGASHI, Fumihiro YOSHINO
  • Publication number: 20210055653
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A), in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group, a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A), a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A), a glass transition temperature of the resin (A) is 145° C. or lower, and the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 ?m or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Application
    Filed: March 3, 2020
    Publication date: February 25, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Tsutomu YOSHIMURA, Yasunori YONEKUTA, Naoya HATAKEYAMA, Kohei HIGASHI, Yoichi NISHIDA
  • Publication number: 20200142306
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition for forming a pattern used as a mask in an ion implanting, including a resin including a repeating unit having an acid-decomposable group, a photoacid generator, and an additive having a melting point or glass transition temperature of lower than 25° C. and a molecular weight of 180 or more, in which a content of the additive is 1% by mass or more with respect to a total solid content in the composition.
    Type: Application
    Filed: December 30, 2019
    Publication date: May 7, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kohei HIGASHI, Hideki TAKAKUWA
  • Publication number: 20200019058
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes: a resin, in which the actinic ray-sensitive or radiation-sensitive resin composition has a concentration of a solid content of 10% by mass or more, and in which the resin includes: a repeating unit A which is a repeating unit derived from a monomer allowing a homopolymer formed therefrom to have a glass transition temperature of 50° C. or lower, and a repeating unit B which is a repeating unit having an acid-decomposable group, a content of the repeating unit B is 20% by mole or less with respect to all the repeating units in the resin, and at least one of the repeating unit contained in the resin is a repeating unit having an aromatic ring.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Naoya HATAKEYAMA, Yasunori YONEKUTA, Tsutomu YOSHIMURA, Kohei HIGASHI, Yoichi NISHIDA
  • Patent number: 10479917
    Abstract: The present invention addresses the problem of providing a water-soluble cutting or grinding fluid that has excellent permeability and washability, that can be widely used in cutting or grinding, and that is particularly suitable for use in superfinishing. The present invention provides a water-soluble cutting or grinding fluid that contains a glycol compound (A), at least one substance (B) selected from the group consisting of organic amines and inorganic alkalis, a surfactant (C), and water (D), the water-soluble cutting or grinding fluid having a contact angle of 2 to 15° as measured using the ?/2 method one second after a drop of a dilution of the water-soluble cutting or grinding fluid is dropped on an SPCC-SB plate.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: November 19, 2019
    Assignee: NTN Corporation
    Inventors: Masashi Kitai, Kohei Higashi, Hidekazu Hirano, Hajime Isa, Masanori Nishira, Hitoshi Shiotani, Keiji Iwamoto, Youhei Migaki
  • Patent number: 10465299
    Abstract: A gas production apparatus is provided which includes: a module including a plurality of PN junctions connected in series to one another, each being formed of an inorganic semiconductor and having a light receiving surface; two gas generators that are provided at open ends of PN junctions at both extremities of the module, respectively, on a side of the light receiving surface; an electrolysis chamber which contains an aqueous electrolytic solution in contact with the two gas generators and contains gases generated by the two gas generators; and a diaphragm which is ion-permeable but gas-impermeable, and partitions the electrolysis chamber into two regions including the two gas generators, respectively, and containing hydrogen and oxygen, respectively.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: November 5, 2019
    Assignees: FUJIFILM Corporation, JAPAN TECHNOLOGICAL RESEARCH ASSOCIATION OF ARTIFICIAL PHOTOSYNTHETIC CHEMICAL PROCESS
    Inventor: Kohei Higashi
  • Patent number: 10452217
    Abstract: According to the invention, there are provided a conductive film which has a mesh-like metal layer composed of metal thin wires and in which visual recognition of the metal thin wires is suppressed and the metal layer has excellent conductive characteristics, a touch panel sensor, and a touch panel. A conductive film according to the invention includes a substrate; a patterned to-be-plated layer which is disposed on the substrate in a mesh pattern and has a functional group interacting with a plating catalyst or a precursor thereof; and a mesh-like metal layer which is disposed on the patterned to-be-plated layer and has a plurality of metal thin wires intersecting each other, an average thickness of the patterned to-be-plated layer is 0.05 to 100 ?m, an average thickness of the metal layer is 0.05 to 0.5 ?m, and an average intersection growing rate at an intersection of metal thin wires of the mesh of the metal layer is 1.6 or less.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: October 22, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Kohei Higashi, Naoki Tsukamoto, Masataka Satou
  • Patent number: 10351961
    Abstract: Provided are a water decomposition apparatus and a water decomposition method that can maintain high gas generation efficiency even in an early stage of light irradiation and even in a case where time has elapsed and that can recover the gas generation amount of hydrogen gas or the like, can generate hydrogen gas or the like stably for a long time on an average, and can increase the integrated amount of generation of hydrogen for a long time, even in a case where time has elapsed and the gas generation amount of hydrogen gas or the like has decreased.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: July 16, 2019
    Assignees: FUJIFILM Corporation, JAPAN TECHNOLOGICAL RESEARCH ASSOCIATION OF ARTIFICIAL PHOTOSYNTHETIC CHEMICAL PROCESS
    Inventors: Kohei Higashi, Naotoshi Sato