Abstract: There is provided a device for generating a data merging rule for a machine learning model, the device including: a processor, and a memory connected to or built in the processor, in which the processor is configured to execute specifying processing of specifying a combination of feature vectors that are included in a data set including a correct answer label and are allowed to be merged, and rule generation processing of generating a merging rule of the feature vectors based on a combination of the feature vectors that are allowed to be merged.

Abstract: There is provided a device for determining an execution order of a plurality of tasks, the device including: processor; and a memory connected to or built in the processor, in which the processor is configured to execute execution order determination processing of determining an execution order of the plurality of tasks under a condition that an output of at least one task of the tasks is input to the task in a subsequent stage.

Abstract: One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.

Abstract: An information processing apparatus including: plural models including at least a first model that uses first data as input to carry out a first prediction task and a second model that uses second data as input to carry out a second prediction task different from the first prediction task, and at least one processor, in which the processor is configured to: acquire information data representing information related to a specific target; select a selection model to be used for prediction from among the plural models based on the information data; and derive a degree of importance to the specific target for each item included in the information data by using the selection model.

Abstract: A model generation apparatus includes a processor that is configured to: acquire information data for learning, acquire document data for learning, extract a first portion and a second portion having a lower rate of match with the information data than the first portion from the document data based on a rate of match between the information data and each portion of the document data, generate a first machine learning model by using first learning data in which first data for learning included in the information data is used as input data and the first portion is used as correct answer data, and generate a second machine learning model by using second learning data in which second data for learning included in the information data is used as input data and the second portion is used as correct answer data.

Abstract: An information processing apparatus includes at least one processor, in which the processor is configured to: for a machine learning model that uses a document data group including a plurality of document data as input and outputs output data, derive an evaluation value in the machine learning model for each document data included in the document data group.

Abstract: Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.

Abstract: A semiconductor device includes: a substrate; an adhesive member arranged on a surface of the substrate; a first chip stacked on the adhesive member with a first adhesive piece interposed therebetween; and a second chip stacked on the first chip with a second adhesive piece interposed therebetween. The adhesive member has a multilayer structure including a pair of surface layers formed of a cured product of a thermosetting resin composition and an intermediate layer arranged between the pair of surface layers.

Abstract: One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.

Abstract: A semiconductor device according to the present disclosure has a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, in which the support piece contains a cured product of a thermosetting resin composition, or includes a layer containing a cured product of a thermosetting resin composition, and a resin layer or a metal layer.

Abstract: A support piece formation laminate film according to the present disclosure includes a base material film, a pressure-sensitive adhesive layer, and a support piece formation film, in this order, in which the support piece formation film has a multi-layer structure including at least a metal layer. The support piece formation laminate film is applied to a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip.