Patents by Inventor Kohshi Nishimura

Kohshi Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7116208
    Abstract: A printed wiring board includes a substrate (20) on which a wiring pattern (12) has been formed, and a fuse (6) provided on the substrate (20). One end of the fuse (6) is directly connected to a first pad (12a) of the wiring pattern (12), and the other end of the fuse (6) is directly connected to a second pad (12b) of the wiring pattern (12). The fuse (6) is covered by a protective material (7).
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: October 3, 2006
    Assignee: Rohm Co., Ltd.
    Inventors: Kohshi Nishimura, Satoshi Nakamura, Saizou Suzuki
  • Publication number: 20050140490
    Abstract: A printed wiring board includes a substrate (20) on which a wiring pattern (12) has been formed, and a fuse (6) provided on the substrate (20). One end of the fuse (6) is directly connected to a first pad (12a) of the wiring pattern (12), and the other end of the fuse (6) is directly connected to a second pad (12b) of the wiring pattern (12). The fuse (6) is covered by a protective material (7).
    Type: Application
    Filed: February 17, 2005
    Publication date: June 30, 2005
    Applicant: ROHM CO., LTD.
    Inventors: Kohshi Nishimura, Satoshi Nakamura, Saizou Suzuki
  • Patent number: 6717062
    Abstract: A circuit board module comprises a battery case 101 storing a battery of which external terminals 4 have a laminated members 8 made of different metal material for each other, a circuit board 102 for carrying out charge and discharge of the above-mentioned battery, and a joint member 103 for connecting the battery case 101 and the circuit board 102 electrically and/or mechanically, wherein the joint body 103 is constructed by clad material that a first metal layer 111 and a second metal layer 112 made of different metal materials each other are laminated.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: April 6, 2004
    Assignee: Rohm Co., Ltd.
    Inventors: Satoshi Nakamura, Kohshi Nishimura
  • Patent number: 6610923
    Abstract: A multi-chip module includes metal frame segments including a plurality of die-bonding pads and a plurality of terminals, a plurality of electronic components mounted on the die-bonding pads in electrical connection to the terminals, and a resin package for enclosing the electronic components and the metal frame segments with each of the terminals partially projecting outwardly from the resin package. Selected ones of the electronic components are electrically connected to each other via the metal frame segments and wires within the resin package.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: August 26, 2003
    Assignee: Rohm Co., Ltd.
    Inventors: Mitsunori Nagashima, Kohshi Nishimura
  • Publication number: 20030048620
    Abstract: A printed wiring board includes a substrate (20) on which a wiring pattern (12) has been formed, and a fuse (6) provided on the substrate (20). One end of the fuse (6) is directly connected to a first pad (12a) of the wiring pattern (12), and the other end of the fuse (6) is directly connected to a second pad (12b) of the wiring pattern (12). The fuse (6) is covered by a protective material (7).
    Type: Application
    Filed: September 12, 2002
    Publication date: March 13, 2003
    Inventors: Kohshi Nishimura, Satoshi Nakamura, Saizou Suzuki
  • Publication number: 20020039283
    Abstract: A circuit board module comprises a battery case 101 storing a battery of which external terminals 4 have a laminated members 8 made of different metal material for each other, a circuit board 102 for carrying out charge and discharge of the above-mentioned battery and a joint member 103 for connecting the battery case 101 and the circuit board 102 electrically and/or mechanically, wherein the joint body 103 is constructed by clad material that a first metal layer 111 and a second metal layer 112 made of different metal materials each other are laminated.
    Type: Application
    Filed: July 2, 2001
    Publication date: April 4, 2002
    Inventors: Satoshi Nakamura, Kohshi Nishimura