Abstract: An image forming apparatus includes a display unit, an image forming unit, a detecting unit to detect whether a sheet is on the tray, a moving unit to cause the tray to ascend and to descend to a lower limit position per a tray sheet amount, and a determination unit to determine that tray descent is interrupted at a position located higher than the lower limit position. At the lower limit position, a screen prompting tray sheet removal is displayed. When the tray descent is interrupted, a screen is displayed to include a tray sheet removal prompt and a notice that an obstacle presents under the tray, an image forming process is stopped, and then the tray is caused to ascend when the sheets are not on the tray and then the image forming process is resumed, even if the obstacle presents under the tray.

Abstract: An image forming apparatus includes a display unit, an image forming unit, a detecting unit to detect whether a sheet is on the tray, a moving unit to cause the tray to ascend and to descend to a lower limit position per a tray sheet amount, and a determination unit to determine that tray descent is interrupted at a position located higher than the lower limit position. At the lower limit position, a screen prompting tray sheet removal is displayed. When the tray descent is interrupted, a screen is displayed to include a tray sheet removal prompt and a notice that an obstacle presents under the tray, an image forming process is stopped, and then the tray is caused to ascend when the sheets are not on the tray and then the image forming process is resumed, even if the obstacle presents under the tray.

Abstract: Even when descending of a sheet stacking unit is interrupted by an obstacle, sheet stacking operation is resumed in a range in which the sheet stacking unit is movable.

Abstract: An image processing apparatus prints an image on a sheet and controls one of a plurality of binding units to bind the sheets on which the images are printed. The image processing apparatus further enables designation of a binding process to be used to bind the sheets, and provides notification of the number of sheets that can be bound by the designated binding process and the number of sheets that can be bound by a non-designated binding process.

Abstract: Even when descending of a sheet stacking unit is interrupted by an obstacle, sheet stacking operation is resumed in a range in which the sheet stacking unit is movable.

Abstract: A printing apparatus enables specifying a mode shift before execution of a new job to be entered, making it possible to reduce the time period during which a user needs to wait before performing sheet processing.

Abstract: A printing apparatus enables specifying a mode shift before execution of a new job to be entered, making it possible to reduce the time period during which a user needs to wait before performing sheet processing.

Abstract: An image processing apparatus prints an image on a sheet and controls one of a plurality of binding units to bind the sheets on which the images are printed. The image processing apparatus further enables designation of a binding process to be used to bind the sheets, and provides notification of the number of sheets that can be bound by the designated binding process and the number of sheets that can be bound by a non-designated binding process.

Abstract: A method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards, which comprises subjecting a copper foil-clad circuit board substrate comprising an electrically insulating support having provided on one or both sides thereof a copper foil having an average thickness of 12 .mu.m or more to etching with an etching solution for copper, the etching being performed such that the whole surface of the copper foil is etched at a predetermined etching rate selected from the range of from 0.01 to 0.3 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness, and the variation of the thickness of the copper foil remaining after the etching is within .+-.2.0 .mu.m on the basis of a desired thickness.