Abstract: An object of the present disclosure is to provide a doping method in which the status of the progress of a main reaction can be estimated in the lithium carbonate decomposition-type doping step of a nonaqueous lithium power storage element. The separation method, the doping method, and the doping apparatus according to the present disclosure include calculating a capacitor current density iC and an electrode reaction current density iR based on voltage and current of a cell that are measured during doping of the cell.

Abstract: A heater includes a base, a plurality of heating bodies, a plurality of terminals, and a cylindrical. The base has a first surface on which a heating target is placed, and a second surface opposite to the first surface. The plurality of heating bodies include an inside heating body disposed in a region including a center of the base, and a plurality of outside heating bodies disposed outside of the inside heating body to be concentric with the base. The inside heating body and the plurality of outside heating bodies are disposed to be spaced from each other in a thickness direction of the base. The inside heating body is disposed at a first layer located closest to the first surface in the thickness direction of the base. The plurality of outside heating bodies include a first outside heating body, and a second outside heating body.

Abstract: A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

Abstract: A semiconductor device of the embodiment includes a plurality of scan chains, a shift clock control circuit, and a shift clock generation circuit. The plurality of scan chains each include a plurality of scan flip-flops. The shift clock control circuit outputs, to each of the plurality of scan chains, a control signal that non-inverts or inverts a scan clock signal. The shift clock generation circuit is provided to each of the plurality of scan flip-flops and generates a non-inverted scan clock signal or an inverted scan clock signal based on the control signal, the non-inverted scan clock signal being obtained by non-inverting the scan clock signal, the inverted scan clock signal being obtained by inverting the scan clock signal.

Abstract: A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

Abstract: A semiconductor device of the embodiment includes a plurality of scan chains, a shift clock control circuit, and a shift clock generation circuit. The plurality of scan chains each include a plurality of scan flip-flops. The shift clock control circuit outputs, to each of the plurality of scan chains, a control signal that non-inverts or inverts a scan clock signal. The shift clock generation circuit is provided to each of the plurality of scan flip-flops and generates a non-inverted scan clock signal or an inverted scan clock signal based on the control signal, the non-inverted scan clock signal being obtained by non-inverting the scan clock signal, the inverted scan clock signal being obtained by inverting the scan clock signal.

Abstract: The subject of the present invention is to provide a resin material in which woody biomass and a thermoplastic resin are uniformly mixed, and which is easy to mold. The present invention provides a molding resin material containing a pulverized product from a woody biomass-derived torrefied product and a thermoplastic resin.

Abstract: A fuel cell system includes a fuel exhaust gas inlet channel for guiding a fuel exhaust gas containing liquid water discharged from a fuel cell stack to a gas liquid separator provided downstream of a humidifier in an oxygen-containing gas inlet channel. The specific gravity of the fuel exhaust gas is lighter than the specific gravity of the oxygen-containing exhaust gas. An outlet channel of the gas liquid separator includes a stirring booster having a first point and a second point positioned downstream of the first point. The second point is positioned ahead of the first point in the gravity direction.

Abstract: A heater includes a base having a first surface and a second surface, and a heat generator disposed on a third surface of the base, the third surface being parallel to the first surface. The base includes a hole portion that opens in at least the second surface. The third surface includes a plurality of blank areas on each of which the heat generator is not present and each of which is circular. The blank areas include a first blank area including a region that the hole portion overlaps and a second blank area that does not include a region that the hole portion overlaps.

Abstract: A casing includes a plate-shaped cover glass for use in an exterior portion of an article; an inorganic coating which covers an end surface of the cover glass; and a resin coating which is at least partially overlaid on the inorganic coating, and which forms an outer edge of the cover glass.

Abstract: An exhaust gas purification device includes a selective catalytic reduction (SCR) device arranged in a downstream exhaust flow path, and a mixer arranged upstream of the selective catalytic reduction device and including a helical flow path that helically guides the flow of exhaust gas from an internal combustion engine. In the exhaust gas purification device, the mixer includes a casing, an injector, and a partition plate. The casing has an upstream opening and a downstream opening and is provided with the helical flow path therein. The injector is arranged in the helical flow path to add a reducing agent to the helical flow path. The partition plate is continuous from the upstream opening to the downstream opening. The partition plate is arranged to divide the inner space of the casing into an upstream side and a downstream side, and defines the helical flow path.

Abstract: A fuel cell system includes a gas liquid separator provided downstream of a humidifier in an oxygen-containing gas inlet channel, a fuel exhaust gas inlet channel for guiding a fuel exhaust gas containing liquid water discharged from a fuel cell stack to the gas liquid separator. The gas liquid separator performs gas liquid separation of both of an oxygen-containing gas humidified by the humidifier and the fuel exhaust gas containing the liquid water guided from the fuel exhaust gas inlet channel.

Abstract: A showerhead provided in a chamber of a semiconductor manufacturing apparatus and facing a wafer holder includes: a disk-shaped member having a plurality of through holes penetrating the disk-shaped member in a direction of a thickness thereof; a high-frequency conductor embedded in the disk-shaped member; a hole provided in the disk-shaped member, extending in the direction of the thickness of the disk-shaped member and having a bottom exposing a portion of the conductor; an electrode terminal portion disposed in the hole and having a base portion electrically connected to the conductor and a columnar portion provided on the base portion; a cylindrical member having a first end portion fitted outside the columnar portion and facing the conductor and a second end portion facing away from the first end portion, and a sealing member surrounding the first end portion.

Abstract: A showerhead provided in a chamber of a semiconductor manufacturing apparatus and facing a wafer holder includes: a plate-shaped ceramic substrate; a plurality of through holes penetrating the ceramic substrate in the direction of the thickness of the ceramic substrate; and a plurality of radio frequency conductors embedded in a plurality of zones, respectively, of the ceramic substrate, as seen on the side of a surface of the ceramic substrate facing the wafer holder.

Abstract: A wafer holder includes a mounting table that has a mounting surface for a workpiece at a top, a supporting member that supports the mounting table from a lower side, a first cylindrical member one end of which is joined hermetically to a lower surface of the mounting table, and a second cylindrical member that is provided inside the first cylindrical member and one end of which is joined hermetically to the lower surface of the mounting table.

Abstract: A wafer holder includes a mounting table that has a mounting surface for a workpiece at a top, a supporting member that supports the mounting table from a lower side, a first cylindrical member one end of which is joined hermetically to a lower surface of the mounting table, and a second cylindrical member that is provided inside the first cylindrical member and one end of which is joined hermetically to the lower surface of the mounting table.

Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.

Abstract: An exhaust gas purification device includes a selective catalytic reduction (SCR) device arranged in a downstream exhaust flow path, and a mixer arranged upstream of the selective catalytic reduction device and including a helical flow path that helically guides the flow of exhaust gas from an internal combustion engine. In the exhaust gas purification device, the mixer includes a casing, an injector, and a partition plate. The casing has an upstream opening and a downstream opening and is provided with the helical flow path therein. The injector is arranged in the helical flow path to add a reducing agent to the helical flow path. The partition plate is continuous from the upstream opening to the downstream opening. The partition plate is arranged to divide the inner space of the casing into an upstream side and a downstream side, and defines the helical flow path.

Abstract: A showerhead provided in a chamber of a semiconductor manufacturing apparatus and facing a wafer holder includes: a plate-shaped ceramic substrate; a plurality of through holes penetrating the ceramic substrate in the direction of the thickness of the ceramic substrate; and a plurality of radio frequency conductors embedded in a plurality of zones, respectively, of the ceramic substrate, as seen on the side of a surface of the ceramic substrate facing the wafer holder.

Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.