Abstract: The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan ? peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000?Mw?35,000. The invention also provides a molded article or the like formed using the polyamide composition.

Abstract: The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan ? peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000?Mw?35,000. The invention also provides a molded article or the like formed using the polyamide composition.

Abstract: A polyamide comprising a unit containing at least one (a) alicyclic dicarboxylic acid and a unit containing a (b) diamine having 8 or more carbon atoms, wherein the polyamide satisfies the following conditions (1) and (2): (1) a sulfuric acid relative viscosity ?r at 25° C. is 2.3 or more; and (2) Mw (weight average molecular weight)/Mn (number average molecular weight) is 4.0 or less.

Abstract: A polyamide comprising a unit containing at least one (a) alicyclic dicarboxylic acid and a unit containing a (b) diamine having 8 or more carbon atoms, wherein the polyamide satisfies the following conditions (1) and (2): (1) a sulfuric acid relative viscosity ?r at 25° C. is 2.3 or more; and (2) Mw (weight average molecular weight)/Mn (number average molecular weight) is 4.0 or less.

Abstract: A refresh mode switching signal generating circuit generates a refresh mode switching signal of an H level or an L level depending on whether a particular bonding pad is wire-bonded to a power supply terminal of a package. In response to the refresh mode switching signal, the refresh mode switching circuit switches a cycle number in a refresh mode of a semiconductor memory device, so that the cycle number in a refresh mode can be changed according to requirements of users.

Abstract: An upper column address strobe signal and a lower column address strobe signal applied to a dynamic RAM are 180.degree. out of phase from each other. Data of n bits are read out from a memory cell array at a time. The data read out from memory cell array is divided into two bit groups and applied to an upper IO buffer and a lower IO buffer. Upper IO buffer and lower IO buffer latch sequentially the upper bit group and the lower bit group and output these groups to a data transmission bus in response to the upper column address strobe signal and the lower column address strobe signal.

Abstract: Using a packaging material containing a fibrous substance such as pulp and a carboxyl-containing polymer a substance such as an acid type carboxymethyl cellulose, a cement mixing material such as a superplasticizer is packaged and the package is thrown into a cement formulation such as concrete, mortar or a cement paste in a truck agitator.