Abstract: An outboard motor includes an engine, an exhaust manifold, and a lower exhaust passage. The engine includes a plurality of cylinders, and a plurality of exhaust ports. The cylinders are disposed in-line in a vertical direction. The exhaust ports are respectively connected to the cylinders. The exhaust manifold includes a first passage, a second passage, and a third passage. The first passage is connected to the exhaust ports, and extends in a vertical direction. The second passage is connected to the first passage. The third passage is connected to the first passage below the second passage. The lower exhaust passage is connected to the exhaust manifold, and provides a passage through which exhaust gas is expelled to the outside from the exhaust manifold. One of the second passage and the third passage is connected to the lower exhaust passage.

Abstract: Disclosed is a motorcycle fitted with a canister. A canister (55) is disposed along the body frame (20) at a position outside the body frame and closer to the body frame than the tip end of a tandem step (54R).

Abstract: A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.

Abstract: The present invention provides a cell transplantation device which is capable of inserting cells for transplantation into a cell-deficient site without application of direct external force to the cells. The present invention discloses a cell transplantation device provided with a plate-type carrier with at least one pass-through hole formed on its side surface, a linear member to be threaded through the pass-through hole, and a pusher member which engages with the linear member that comes out from each exit of the pass-through holes.

Abstract: A retaining structure for a honeycomb structure includes a honeycomb structure, a retainer mat, and a housing. The honeycomb structure is a member made of a ceramic material. The retainer mat is in contact with the honeycomb structure and directly retains the honeycomb structure. The housing is in contact with the retainer mat and directly retains the retainer mat. The housing is made of aluminum. The housing includes an inner wall, an outer wall, and a coolant passage. The inner wall is in contact with the retainer mat. The coolant passage is located between the inner wall and the outer wall. An inflow port of the coolant passage is located at one end of the housing. A discharge port of the coolant passage is located at the other end of the housing.

Abstract: A connector adapted to connect device, allows itself to be fastened with a bolt using a conventional tool, and to be downsized. A edge 9a of the protection rib 9 and a bearing surface 7b on which a bolt 10 on a fastening part 7 is tightened are formed in the same plane.

Abstract: The present invention provides a method for arranging various cells as cell clusters in an arbitrary three-dimensional space and producing a three dimensional structure of a desired shape constituted exclusively by cells. Furthermore, the present invention provides a support provided with a substrate and a thread or needle-shaped material that penetrates the substrate and cell clusters for positioning cell clusters in arbitrary space. The support is provided with a sheet that can be removed as necessary for covering the substrate. Further, a method for using the support structure to position cell clusters in an arbitrary space and a method for the production of three-dimensional cell structures are provided.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.

Abstract: A semiconductor device includes: a first power line to supply a first voltage to a plurality of internal circuits; a second power line to supply the first voltage to the plurality of internal circuits; a first switch provided between said first power line and each of the plurality of internal circuits; a second switch provided between said second power line and each of the plurality of internal circuits; and a control circuit to control the first switch of a second internal circuit included in the plurality of the internal circuits based on the amounts of noise and voltage drop at power-on in a first circuit included in the plurality of internal circuits.

Abstract: A manufacturing method of a multilayer wiring board that includes a core board, a wiring layer, and an electrically insulating layer that are stacked on the core board. The manufacturing method forms a plurality of through holes in a core member, a thermal expansion coefficient of the core board being between 2 to 20 ppm, and the core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal. The through holes are made conductive by a conductive material, to electrically connect between the front and the back of the core board. A wiring layer and an electrically insulating layer are stacked on one surface of the core board to form a multilayer wiring layer. A capacitor is formed on the other surface of the core board.

Abstract: The present invention provides a method for arranging various cells as cell clusters in an arbitrary three-dimensional space and producing a three dimensional structure of a desired shape constituted exclusively by cells. Furthermore, the present invention provides a support provided with a substrate and a thread or needle-shaped material that penetrates the substrate and cell clusters for positioning cell clusters in arbitrary space. The support is provided with a sheet that can be removed as necessary for covering the substrate. Further, a method for using the support structure to position cell clusters in an arbitrary space and a method for the production of three-dimensional cell structures are provided.

Abstract: Disclosed is a motorcycle fitted with a canister. A canister (55) is disposed along the body frame (20) at a position outside the body frame and closer to the body frame than the tip end of a tandem step (54R).

Abstract: The present invention provides a cell transplantation device which is capable of inserting cells for transplantation into a cell-deficient site without application of direct external force to the cells. The present invention discloses a cell transplantation device provided with a plate-type carrier with at least one pass-through hole formed on its side surface, a linear member to be threaded through the pass-through hole, and a pusher member which engages with the linear member that comes out from each exit of the pass-through holes.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer.

Abstract: A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.

Abstract: Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer.