Patents by Inventor Koichi Sada

Koichi Sada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8398771
    Abstract: A substrate processing apparatus in accordance with the present invention includes a process chamber configured to accommodate a substrate, a gas supply line configured to supply a gas to an inside of the process chamber, and an exhaust line configured to exhaust the inside of the process chamber. The gas supply line of the substrate processing apparatus includes a preheating unit preheating the gas supplied from a gas source, a metal pipeline having an angled section wherein the metal pipe line connects the preheating unit and the inside of the process chamber to supply the gas preheated by the preheating unit into the process chamber, and a heat dissipation member covering the angled section to dissipate heat from the angled section.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: March 19, 2013
    Assignee: Hitachi Kokusai Electric, Inc.
    Inventors: Takayuki Nakada, Koichi Sada, Tomoyuki Matsuda
  • Patent number: 8076615
    Abstract: A substrate processing apparatus comprises: an outer tube; a manifold connected to the outer tube and made of a non-metal material; an inner tube disposed in the manifold at a more inner side than the outer tube and configured to process a substrate therein; a heating device installed at a more outer side than the outer tube and configured to heat the inside of the outer tube; a lid configured to open and close an opening of the manifold, with a seal member intervened therebetween; and a heat absorption member installed in the manifold, with a bottom end of the inner tube intervened therebetween, and configured to absorb heat from the heating device, the heat absorption member being made of a non-metal material.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: December 13, 2011
    Assignee: Hitachi Kokusai Electric, Inc.
    Inventors: Shinya Morita, Koichi Sada, Takayuki Nakada, Tomoyuki Matsuda
  • Publication number: 20100051597
    Abstract: A substrate processing apparatus comprises: an outer tube; a manifold connected to the outer tube and made of a non-metal material; an inner tube disposed in the manifold at a more inner side than the outer tube and configured to process a substrate therein; a heating device installed at a more outer side than the outer tube and configured to heat the inside of the outer tube; a lid configured to open and close an opening of the manifold, with a seal member intervened therebetween; and a heat absorption member installed in the manifold, with a bottom end of the inner tube intervened therebetween, and configured to absorb heat from the heating device, the heat absorption member being made of a non-metal material.
    Type: Application
    Filed: August 26, 2009
    Publication date: March 4, 2010
    Inventors: Shinya Morita, Koichi Sada, Takayuki Nakada, Tomoyuki Matsuda
  • Publication number: 20100024728
    Abstract: A substrate processing apparatus comprises: a process chamber configured to accommodate a substrate; a gas supply line configured to supply gas into the process chamber; and an exhaust line configured to exhaust the inside of the process chamber. In the substrate processing apparatus, the gas supply line comprises: a preheating unit configured to preheat the gas before supplying the gas into the process chamber; a metal pipeline configured to supply the preheated gas into the process chamber; and a heat dissipation member covering the outer periphery of a bend section formed in the metal pipeline.
    Type: Application
    Filed: July 7, 2009
    Publication date: February 4, 2010
    Inventors: Takayuki NAKADA, Koichi Sada, Tomoyuki Matsuda