Patents by Inventor Koichi Shibayama
Koichi Shibayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240137114Abstract: A transmission power controller includes: a control unit that outputs, within a range not exceeding a TPC set point, a TPC controlled variable that increases transmission power of a transmission system device more in a case of a larger attenuation of a reception signal received from a communication satellite; a data accumulation unit that accumulates the TPC controlled variable; an appropriate value extraction unit that extracts, as a TPC appropriate set point, the largest TPC controlled variable among the accumulated TPC controlled variables except a top predetermined proportion; and an updating unit that outputs, to the transmission system device, a reference transmission power increase signal that increases the reference transmission power more in a case of a larger difference between the TPC set point and the TPC appropriate set point and updates the TPC set point with the TPC appropriate set point. Thereby, efficient use of a transmitter is enabled.Type: ApplicationFiled: March 9, 2021Publication date: April 25, 2024Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Koichi HARADA, Fumihiro YAMASHITA, Hiroki SHIBAYAMA
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Publication number: 20240121637Abstract: A wireless communication monitoring system for monitoring a hardware failure of a wireless communication unit of a wireless communication device using a remote monitoring control device, in which the wireless communication device transmits or receives a predetermined radio signal to or from a monitoring device added or attached to the host device to perform a life and death check for checking an operation, and the remote monitoring control device detects a hardware failure of the wireless communication unit of the wireless communication device on the basis of a result of the life and death check received from the wireless communication device. This makes it possible to detect a failure that cannot be detected from information obtained from a device state request to a wireless communication device of the related art.Type: ApplicationFiled: February 17, 2021Publication date: April 11, 2024Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Akira MATSUSHITA, Mitsuru NISHINO, Munehiro MATSUI, Masaki SHIMA, Koichi HARADA, Hiroki SHIBAYAMA, Fumihiro YAMASHITA
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Publication number: 20240097344Abstract: A reflector antenna includes: a radiator that radiates a radio wave; a main reflector that reflects the radio wave radiated from the radiator in a communication direction; an expansion panel that is attached to at least a part of the main reflector to increase an area of the main reflector; and a first adjustment unit that changes a position of the radiator, or a second adjustment unit that replaces the radiator with a radiator having a different radiation angle. This configuration makes it possible to implement a large-aperture antenna having excellent transportability and operability without preparing another antenna having a large aperture and replacing a standard antenna.Type: ApplicationFiled: December 3, 2020Publication date: March 21, 2024Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Koichi HARADA, Masaki SHIMA, Hiroki SHIBAYAMA, Fumihiro YAMASHITA
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Patent number: 9120293Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.Type: GrantFiled: March 31, 2011Date of Patent: September 1, 2015Assignee: SEIKU CHEMICAL CO., LTD.Inventors: Reona Yokota, Koichi Shibayama, Akihiro Uenishi, Hidenobu Deguchi, Tomoki Kunikawa, Tatsushi Hayashi
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Publication number: 20130337229Abstract: A roughened cured material allows reduction of surface roughness and increase in adhesive strength between a cured object and a metal layer. A roughened cured material is obtained by advancing curing of an epoxy resin material to obtain a preliminary-cured material and conducting roughening treatment on a surface of the preliminary-cured material. The epoxy resin material contains an epoxy resin, a curing agent, and a silica whose mean particle diameter is not smaller than 0.2 ?m but not larger than 1.2 ?m. When a roughening-treated surface of the roughened cured material is photographed with a scanning electron microscope, in a 5 ?m×5 ?m sized area of the roughening-treated surface in a photographed image, the number of particles of the silica that are exposed from the roughening-treated surface and whose exposed portions have a maximum length of 0.3 ?M or longer in the image is not greater than 15.Type: ApplicationFiled: January 27, 2012Publication date: December 19, 2013Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Takayuki Kobayashi, Koichi Shibayama, Shuichiro Matsumoto
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Publication number: 20130108861Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.Type: ApplicationFiled: March 31, 2011Publication date: May 2, 2013Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Reona Yokota, Koichi Shibayama, Akihiro Uenishi, Hidenobu Deguchi, Tomoki Kunikawa, Tatsushi Hayashi
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Publication number: 20110003914Abstract: A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B).Type: ApplicationFiled: January 30, 2009Publication date: January 6, 2011Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Reona Yokota, Koichi Shibayama, Kazuyoshi Shiomi, Hiroshi Kouyanagi
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Patent number: 7754803Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of 1.0×10?3 [° C.?1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.Type: GrantFiled: February 4, 2003Date of Patent: July 13, 2010Assignee: Sekisui Chemical Co., Ltd.Inventors: Akihiko Fujiwara, Koichi Shibayama, Hidenobu Deguchi
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Patent number: 7709085Abstract: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.Type: GrantFiled: December 7, 2004Date of Patent: May 4, 2010Assignee: Sekisui Chemical Co., Ltd.Inventors: Koichi Shibayama, Koji Yonezawa, Kazuyoshi Shiomi, Motohiro Yagi, Hidenobu Deguchi, Nobuhiro Goto
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Patent number: 7682691Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of up to 17×10?3 [° C.?1 ] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.Type: GrantFiled: February 4, 2003Date of Patent: March 23, 2010Assignee: Sekisui Chemical Co., Ltd.Inventors: Kazunori Akaho, Koji Yonezawa, Motohiro Yagi, Akihiko Fujiwara, Koichi Shibayama, Hidenobu Deguchi
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Publication number: 20090267263Abstract: Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 ?m. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.Type: ApplicationFiled: July 12, 2009Publication date: October 29, 2009Inventors: Koichi Shibayama, Koji Yonezawa
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Publication number: 20090256283Abstract: Disclosed is a thermoplastic cresin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistence. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.Type: ApplicationFiled: June 20, 2009Publication date: October 15, 2009Inventors: Koichi Shibayama, Koji Yonezawa
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Publication number: 20080268257Abstract: It is an object of the invention to provide a material for -insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustion The invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.Type: ApplicationFiled: June 30, 2008Publication date: October 30, 2008Applicant: Sekisui Chemical Co., Ltd.Inventors: Koji Yonezawa, Koichi Shibayama, Masao Fushimi, Hideyuki Takahashi, Koji Taniguchi, Motohiro Yagi
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Publication number: 20080268237Abstract: It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustion The invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.Type: ApplicationFiled: June 30, 2008Publication date: October 30, 2008Applicant: Sekisui Chemical Co., Ltd.Inventors: Koji Yonezawa, Koichi Shibayama, Masao Fushimi, Hideyuki Takahashi, Koji Taniguchi, Motohiro Yagi
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Publication number: 20080233386Abstract: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.Type: ApplicationFiled: December 7, 2004Publication date: September 25, 2008Inventors: Koichi Shibayama, Koji Yonezawa, Kazuyoshi Shiomi, Motohiro Yagi, Hidenobu Deguchi, Nobuhiro Goto
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Publication number: 20070191555Abstract: The invention provides a thermosetting resin composition comprising a bifunctional dihydrobenzoxazine compound and an epoxy compound, and provides a thermosetting resin molding obtained by thermally curing the thermosetting resin composition. The molding has excellent electric properties of low dielectric constant and low dielectric loss tangent. The resin composition comprises an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20): wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.Type: ApplicationFiled: March 30, 2004Publication date: August 16, 2007Inventors: Hatsuo Ishida, Koichi Shibayama, Hiroshi Abe
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Publication number: 20070148442Abstract: Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 ?m. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.Type: ApplicationFiled: December 14, 2004Publication date: June 28, 2007Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Koichi Shibayama, Koji Yonezawa
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Publication number: 20070072963Abstract: Disclosed is a thermoplastic resin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistance. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.Type: ApplicationFiled: December 14, 2004Publication date: March 29, 2007Inventors: Koichi Shibayama, Koji Yonezawa
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Patent number: 7173068Abstract: A thermoplastic foam is provided which contains a thermoplastic resin and a layered silicate and in which foam cells and the layered silicate are evenly and finely dispersed. A volume-expansible gas or heat decomposable blowing agent is incorporated into interlayer spaces of a layered silicate in a composite material containing 100 parts by weight of a thermoplastic resin and 0.1–50 parts by weight of the layered silicate, and the gas or blowing agent is allowed to expand in volume or thermally decompose to form foam cells 6, so that a thermoplastic foam is obtained in which the layered silicate has an average interlayer spacing of over 60 ? when determined by an X-ray diffractometry.Type: GrantFiled: August 16, 2004Date of Patent: February 6, 2007Assignee: Sekisui Chemical Co., Ltd.Inventors: Koichiro Iwasa, Hiroki Erami, Naoki Ueda, Koichi Shibayama, Juichi Fukatani
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Publication number: 20050260404Abstract: There is provided a sheet-form molding which is outstanding in fire retardation and prevention of flame spread, exhibiting good fire retardant and flame spread-preventive effects based on its good form retention during combustion, and also outstanding in mechanical strength and stability, particularly with a reduced incidence of necking and shrinkage, thus insuring high dimensional accuracy in use and precision in application. Particularly, there is provided a sheet-form molding comprising a single layer or a plurality of layers, which has at least one layer consisting essentially of formulating 0.1 to 100 weight parts of a lamellar silicate, and 0.1 to 70 weight parts of a metal hydroxide and/or 0.1 to 50 weight parts of a melamine derivative in each 100 weight parts of a thermoplastic resin.Type: ApplicationFiled: August 27, 2001Publication date: November 24, 2005Inventors: Tetsunari Iwade, Koichi Shibayama, Hideyuki Takahashi, Koji Taniguchi, Hiroshi Murayama, Tetsuya Kusano, Akihiko Bandou