Patents by Inventor Koichi SHIROYAMA

Koichi SHIROYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8922232
    Abstract: [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: December 30, 2014
    Assignees: Advantest Corporation, Shinko Electric Industries Co., Ltd.
    Inventors: Shigeru Matsumura, Kohei Kato, Katsushi Sugai, Koichi Shiroyama, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi
  • Publication number: 20120049876
    Abstract: [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322. [Selected Drawing] FIG.
    Type: Application
    Filed: August 18, 2011
    Publication date: March 1, 2012
    Applicants: SHINKO ELECTRIC INDUSTRIES CO., LTD., ADVANTEST CORPORATION
    Inventors: Shigeru MATSUMURA, Kohei KATO, Katsushi SUGAI, Koichi SHIROYAMA, Mitsutoshi HIGASHI, Akinori SHIRAISHI, Hideaki SAKAGUCHI