Patents by Inventor Koichi Takekawa

Koichi Takekawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tape automated bonding semiconductor device and production process thereof
    Patent number: 5357400
    Abstract: A TAB(tape automated bonding) device is provided with a multi-metal-layer film tape for each semiconductor chip. Two parallel grounding conductor layers and a power supply conductor layer sandwiched between the two grounding conductor layers are formed in the multi-metal-layer film tape, and grounding leads which are connected to grounding terminals of the semiconductor chip are connected to the grounding conductor layer, and power supply leads which are connected to power supply terminals of the chip are connected to the power supply conductor layer.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: October 18, 1994
    Assignee: NEC Corporation
    Inventor: Koichi Takekawa