Abstract: During the process of transporting an electronic component (18) to a substrate (10) after a suction nozzle (7) has picked up the component (18), the component (18) being supplied from a component supply unit (1), the amount of offset of the component (18) with respect to the suction nozzle (7) is calculated. The feasibility of mounting the component (18) held by the suction nozzle (7) onto the substrate (10) without hindrance is determined from the amount of offset. If the result of the determination is positive, the component (18) is mounted onto the substrate (10).

Abstract: A method and device for feeding an electronic component are provided by which extensive shutdown of the electronic component mounting device due to lack of components is prevented, thereby enhancing the operation rate. The device has a feeder section designating unit (32) for designating a desired one of feeder sections (22), and a feeder section controller (31) for forcibly moving the feeder section which is currently feeding electronic components to a retracted position when the other feeder section has been designated by the feeder section designating unit (32) and for moving the designated feeder section which has been in a standby state to a predetermined component feeding position, by which a long-time pause of the electronic component mounting device caused by exhaustion of components is prevented and the operation rate is enhanced.

Abstract: An electronic parts mounting apparatus for divisionally recognizing an electronic part (2) even when the apparatus is arranged in such that the relative positional relation between a recognition camera (4) and a nozzle (1) cannot be varied. The electronic part (2) is vacuum-clamped by a nozzle (1), the posture of the nozzle (1) or the posture of the electronic part (2) is changed a plurality of times by a rotary driving member (3), and a part of the electronic part (2) imaged by the recognition camera (4) every time the posture of the electronic part (2) is changed, whereby the part is recognized. Thus, the recognition of the contour of the electronic part (2) becomes possible, and the electronic part can be mounted accurately on a circuit board by making a positional correction on the basis of the amount of deviation obtained.

Abstract: The invention provides an electronic parts mounting machine and an electronic parts packaging method wherein even when a system does not include driving means, such as an XY robot, for driving a mounting head, there is no possibility of causing a decrease in measurement accuracy or a need to allocate a larger space for the installation and movement of a test unit of a lead misalignment tester. When a lead misalignment test is conducted on each lead of an electronic part, a suction nozzle is rotated and, at the same time, the test unit is moved such that the test point of the test unit scans each lead of the electronic part sucked by the suction nozzle while said test point crosses said lead.