Patents by Inventor Koichiro Sekiguchi

Koichiro Sekiguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
    Patent number: 5188280
    Abstract: A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: February 23, 1993
    Assignees: Hitachi Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara, Ikuo Yoshida, Akiomi Kohno, Masaya Horino, Hideaki Kamohara, Shouichi Irie, Hiroshi Akasaki, Kanji Otsuka
  • Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
    Patent number: 5090609
    Abstract: An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: February 25, 1992
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara, Ikuo Yoshida, Akiomi Kohno, Masaya Horino, Hideaki Kamohara, Shouichi Irie, Hiroshi Akasaki, Kanji Otsuka