Patents by Inventor Koichiro Shimoda

Koichiro Shimoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM
    Publication number: 20230108518
    Abstract: The present disclosure relates to an information processing apparatus, an information processing method, and a program capable of supporting work of giving a classification to a group of sentences. A presentation unit presents a sentence included in a cluster of interest among clusters generated by clustering a sentence set in a sentence selection region, and a reception unit receives selection of the sentence constituting a group of sentences from the sentences presented in the sentence selection region. The present disclosure can be applied to, for example, an FAQ construction/search support tool.
    Type: Application
    Filed: February 5, 2021
    Publication date: April 6, 2023
    Inventors: KATSUYOSHI KANEMOTO, MICHAEL SIEGFRIED SPRANGER, AKIHITO KUMAKURA, KOJIRO KASHIWA, IPPEI MUROFUSHI, JIN NAKAYAMA, RYOTA ANDO, KOICHIRO SHIMODA, YOSHINORI AKISAWA, NOBUO SATO, MASAAKI NAGATA
  • Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same
    Patent number: 9896546
    Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 ?m/sec to 0.02 ?m/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: February 20, 2018
    Assignee: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Koichiro Shimoda, Yasuhito Iizuka, Masaki Yamamoto, Yoro Sasaki, Hiroaki Adachi, Shuji Kashiwagi
  • RESIN COMPOSITION, LAYERED PRODUCT, MULTILAYER PRINTED WIRING BOARD, MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
    Publication number: 20150027754
    Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 ?m/sec to 0.02 ?m/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).
    Type: Application
    Filed: January 18, 2013
    Publication date: January 29, 2015
    Applicant: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Koichiro Shimoda, Yasuhito Iizuka, Masaki Yamamoto, Yoro Sasaki, Hiroaki Adachi, Shuji Kashiwagi