Abstract: A lead frame includes a frame part, a lead extending inward from the frame part and having a front surface and a back surface, and an external connection terminal formed at a part of the lead in an extension direction and protruding from the back surface of the lead. The lead includes a pentagonal shape in a cross-section where the front surface of the lead faces upward, the pentagonal shape having a quadrangular main body part and a triangular protrusion protruding from a lower surface of the main body part. A width of a lower end of the main body part is smaller than a width of an upper end of the main body part.

Abstract: A lead frame includes a frame part, a lead extending inward from the frame part and having a front surface and a back surface, and an external connection terminal formed at a part of the lead in an extension direction and protruding from the back surface of the lead. The lead includes a pentagonal shape in a cross-section where the front surface of the lead faces upward, the pentagonal shape having a quadrangular main body part and a triangular protrusion protruding from a lower surface of the main body part. A width of a lower end of the main body part is smaller than a width of an upper end of the main body part.

Abstract: A lead frame includes a terminal portion. The terminal portion includes: a columnar electrode; a first metal plating layer formed on an upper surface of the electrode; and a second metal plating layer formed on a lower surface of the electrode. The terminal portion includes a plurality of terminal portions. The lead frame further includes a coupling portion that is coupled to the plurality of terminal portions. A first distance between the upper surface of the electrode and the coupling portion is larger than a second distance between the lower surface of the electrode and the coupling portion.

Abstract: A lead frame includes a terminal part having a first side surface formed in a concave curve shape on a lower side from an upper end of the terminal part, and a second side surface formed in a concave curve shape on a lower side from a lower end of the first side surface. The concave curve shape of each of the first and second side surfaces has a depth in a surface direction of the terminal part. A boundary part of the first side surface and the second side surface becomes a protrusion protruding outward. The depth of the concave curve shape of the second side surface is larger than that of the first side surface. A distance between an upper end and a lower end of the second side surface is longer than a distance between an upper end and the lower end of the first side surface.

Abstract: A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.

Abstract: A reader/writer includes a substrate, a communication control part on the substrate, a molded resin layer sealing the communication control part and an antenna connected to the communication control part. The antenna is provided on the molded resin layer.

Abstract: A reader/writer includes a substrate, a communication control part on the substrate, a molded resin layer sealing the communication control part and an antenna connected to the communication control part. The antenna is provided on the molded resin layer.

Abstract: A substrate cleaning apparatus is used for cleaning and drying a substrate such as a semiconductor wafer used in a semiconductor fabricating process or the like. The substrate cleaning apparatus includes a substrate holding mechanism (10) configured to hold the substrate (W), and a rotating mechanism (20) configured to rotate the substrate holding mechanism (10). At least one of components of the substrate cleaning apparatus has a surface structure to which droplets are hardly attached.

Abstract: A dehydration drying method dehydrates and dries a substrate. The substrate (15) is dehydrated and dried without being rotated while the substrate (15) is accommodated in a carrier (10) operable to carry the substrate (15) between apparatuses for carrying out certain processes.

Abstract: The present invention relates to a polishing apparatus having a plurality of polishing units (30A-30D). Moving mechanisms for moving top rings (301A˜301D) between polishing positions on the polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters (5, 6) are provided for transferring the wafer between a plurality of transferring positions (TP1-TP7) including the wafer receiving/delivering positions. Pushers (33, 34, 37, 38) for receiving and delivering the wafer between the linear transporters (5, 6) and the top rings (301A-301D) are provided at the transferring positions (TP2, TP3, TP6, TP7) as the wafer receiving/delivering positions.

Abstract: A substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display is polished to a flat mirror finish, and then is cleaned to a high degree of cleanliness. A polishing section having at least one polishing unit performs primary polishing and secondary polishing of the substrate by pressing the substrate against a polishing surface. A cleaning section cleans the substrate which has been polished to remove particles attached to the substrate by a scrubbing cleaning. Metal ions are removed from the substrate by supplying an etching liquid.

Abstract: A subtract such as a semiconductor wafer, a glass substrate, or a liquid crystal display is polished to a flat mirror finish, and then is cleaned to a high degree of cleanliness. A polishing section having at least one polishing unit performs primary polishing and secondary polishing of the substrate by pressing the substrate against a polishing surface. A cleaning section cleans the substrate which has been polished to remove particles attached to the substrate by a scrubbing cleaning. Metal ions are removed from the substrate by supplying an etching liquid.

Abstract: A substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display is polished to a flat mirror finish, and then cleaning a polished substrate that is cleaned to a high degree of cleanliness. A polishing section having at least one polishing unit for performs primary polishing and secondary polishing of the substrate by pressing the substrate against a polishing surface. A cleaning section cleans the substrate which has been polished to remove particles attached to the substrate by a scrubbing cleaning. Metal ions are removed from the substrate by supplying an etching liquid.

Abstract: An apparatus performs at least one of cleaning and drying a semiconductor wafer while rotating the semiconductor wafer. The apparatus has a rotating mechanism for rotating the semiconductor wafer, and a sensor for detecting a reference position such as a notch or an orientation flat of the semiconductor wafer. The semiconductor wafer may be stopped from rotating to align the reference position with a predetermined position based on an output signal from the sensor.

Abstract: The present invention relates to a substrate cleaning apparatus, and more particularly to a substrate cleaning apparatus suitable for cleaning a substrate which requires a high level of cleanliness, such as a semiconductor wafer, a glass substrate, a liquid crystal panel, etc.

Abstract: The cleaning apparatus of the present invention comprises a cleaning member 105 adapted to be rotated while maintaining contact with a surface of a semiconductor wafer W, to thereby clean the surface of the semiconductor wafer W, and a drive motor 50 for rotating the cleaning member 105. A linear bushing 75 and coil springs 81 are provided between the cleaning member 105 and the drive motor 50. The linear bushing 75 ensures that the cleaning member 105 is capable of slidably moving in a direction of an axis of rotation. The coil springs 81 ensure that the cleaning member 105 applies a predetermined pressure to the semiconductor wafer W. A pressure in a casing 1 [(1-1), (1-2) and (1-3)] is set to a negative pressure relative to an outside air pressure by suction through a pipe 111.