Abstract: A processing apparatus includes an inner cylinder 25 (a processing chamber 23) accommodated in a carrying unit for carrying an object to be processed and further seals up the object with the inner cylinder 25 or a first stationary wall 34 to process the object in contact with processing fluid. In this processing apparatus with sealing mechanism, flexible hollow packings 100, 101 are arranged doubly in either the inner cylinder 25 or the first stationary wall 34, at its occluded part with the first stationary wall 34 and the inner cylinder 25. The hollow packings 100, 101 have their hollow parts 102 connected with respective pressurized-air sources 103 through pressure-detecting switches 110 and closing valves 105. By expanding or contracting the hollow packings 100, 101, the operation of the apparatus is switched in between its sealing state and non-sealing state. With this arrangement, it is possible to improve the sealing capability and prolong the life of the mechanism.

Abstract: A liquid processing apparatus is provided to improve its processing efficiency, together with a liquid processing method. The apparatus is capable of both reduction in temperature-variation of a processing liquid at processing and shortening for temperature-recovery of the processing liquid. Further, the liquid processing apparatus can facilitate the establishment of respective designated temperatures for different processes and carry out different processes continuously and effectively. The apparatus includes an inner cylinder 25 to accommodate semiconductor wafers W and a chemical supply unit 50 to supply the semiconductor wafers W in an inner cylindrical chamber 23 with a chemical liquid. The apparatus further includes a case heat exchanger 90 arranged in an outer peripheral position of the inner cylinder 25 and allowing a temperature-adjustment medium to flow and a medium supplier 100 to supply the regulator 90 with the temperature-adjustment medium.

Abstract: A substrate processing apparatus includes a rotor 45 for rotating a plurality of wafers W paralleled each other at appropriate intervals. While rotating the wafers W by the rotor 45, a chemical liquid is supplied to the wafers W for their processing. The rotor 45 has holding members 95, 96, 97, 98, 99 for holding the peripheries of the wafers W in parallel arrangement and a press member 100 for holding the wafers W while applying a pressure on their peripheries. Irrespective of rotation of the rotor 45, the press member 100 always applies a pressure on the peripheries of the wafers W so as to prevent the peripheries from sifting with respect to the holding members 95, 96, 97, 98, 99. With the action of the press member 100, it becomes possible to prevent the peripheries of the wafers W from being worn and also possible to elongate the span of life of the holding members 95, 96, 97, 98, 99 while performing a chemical processing.

Abstract: The present invention provides a rotary shaft sealing mechanism having the seal between the rotary shaft and the seal ring improved, and a liquid processing apparatus including the rotary shaft sealing mechanism.

Abstract: A rotor (1) includes a pair of flanges (4, 5), four fixed holding bars (30) fixed to the flanges (4, 5), and two movable holding bars (60) supported for turning on the flanges (4, 5). The holding bars (30, 60) are provided in their surfaces with positioning grooves (32a) for positioning and holding wafers (W). The holding bars (30, 60) are provided with drain grooves (32b) connected to the positioning grooves (32a). The drain grooves (32b) prevent a processing liquid from staying in the positioning grooves (32a).

Abstract: A rotary substrate processing apparatus includes a rotor 1 having a holding member for holding a plurality of semiconductor wafers W arranged at appropriate intervals and a motor 4 for rotating the rotor 1. The holding member includes open/close holding rods 3 that are moved to open or close the rotor 1 in inserting the wafers W into the rotor 1 sideways and a plurality of constant-position holding rods 2a to 2d for holding the wafers W in cooperation with the open/close holding rods 3. Among the constant-position holding rods 2a to 2d, at least one constant-position holding rod 2a is equipped with a plurality of press members 5 which move toward respective peripheral portions of the wafers W. by centrifugal force due to the rotation of the rotor 1. Consequently, it becomes possible to make the wafers W follow the rotation of the rotor 1 ensurely and also possible to reduce slip between the open/close holding rods 3, the constant-position holding rods 2a to 2d and the wafers W.

Abstract: A cleaning processing apparatus, which is one embodiment of a liquid processing apparatus for performing a liquid processing by supplying a predetermined process liquid to a target object to be processed such as a semiconductor wafer while rotating the target object, comprises a rotor for holding wafers W, a slidable process section for housing the rotor, and a cleaning liquid spurting nozzle for supplying a predetermined cleaning liquid to the wafers W. A housing for housing the slidable process section is of a hermetic structure so as to be substantially shielded from the outside.

Abstract: A processing apparatus includes an inner cylinder 25 (a processing chamber 23) accommodated in a carrying unit for carrying an object to be processed and further seals up the object with the inner cylinder 25 or a first stationary wall 34 to process the object in contact with processing fluid. In this processing apparatus with sealing mechanism, flexible hollow packings 100, 101 are arranged doubly in either the inner cylinder 25 or the first stationary wall 34, at its occluded part with the first stationary wall 34 and the inner cylinder 25. The hollow packings 100, 101 have their hollow parts 102 connected with respective pressurized-air sources 103 through pressure-detecting switches 110 and closing valves 105. By expanding or contracting the hollow packings 100, 101, the operation of the apparatus is switched in between its sealing state and non-sealing state. With this arrangement, it is possible to improve the sealing capability and prolong the life of the mechanism.

Abstract: A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in order to perform a liquid process. The nozzles 54, 56 are respectively equipped with a plurality of ejecting orifices 53, 55 capable of ejecting the processing liquid in a plane manner, allowing the substrates W to be processed uniformly and effectively.

Abstract: A rotor (1) includes a pair of flanges (4, 5), four fixed holding bars (30) fixed to the flanges (4, 5), and two movable holding bars (60) supported for turning on the flanges (4, 5). The holding bars (30, 60) are provided in their surfaces with positioning grooves (32a) for positioning and holding wafers (W). The holding bars (30, 60) are provided with drain grooves (32b) connected to the positioning grooves (32a). The drain grooves (32b) prevent a processing liquid from staying in the positioning grooves (32a).

Abstract: A liquid processing apparatus is provided to improve its processing efficiency, together with a liquid processing method. The apparatus is capable of both reduction in temperature-variation of a processing liquid at processing and shortening for temperature-recovery of the processing liquid. Further, the liquid processing apparatus can facilitate the establishment of respective designated temperatures for different processes and carry out different processes continuously and effectively. The apparatus includes an inner cylinder 25 to accommodate semiconductor wafers W and a chemical supply unit 50 to supply the semiconductor wafers W in an inner cylindrical chamber 23 with a chemical liquid. The apparatus further includes a case heat exchanger 90 arranged in an outer peripheral position of the inner cylinder 25 and allowing a temperature-adjustment medium to flow and a medium supplier 100 to supply the regulator 90 with the temperature-adjustment medium.

Abstract: Fiber-reinforced polymer compositions containing resin components including (a) 30-90 weight % of polyamide resins, and (b) 10-70 weight % of polyolefins+unsaturated carboxylic acid-modified polyolefins, based on the resin components; and (c) 5-50 parts by weight of glass fibers per 100 parts by weight of the total compositions, a molar ratio of end amino groups in the polyamide resins to carboxyl groups in the modified polyolefins being 10-1000. The compositions have a morphology in which polyolefin domains having an average size of 0.5-5 .mu.m are uniformly dispersed in polyamide matrix phases.

Abstract: A fiber-reinforced polymer composition containing resin components including (a) 30-90 weight % of a polyamide resin, and (b) 10-70 weight % of polyolefin+unsaturated carboxylic acid-modified polyolefin, based on the resin components; and, per 100 parts by weight of the total components, (c) 5-50 parts by weight of glass fibers, and (d) additives including the following set of additives: 0.1-1 parts by weight of N,N'-hexamethylene-bis (3,5-di-tert-butyl-4-hydroxy-hydrocinnamide); 0.1-1 parts by weight of triethylene glycol-bis [3-(3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate]; and 0.1-1 parts by weight of pentaerythrityl-tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate]. An alternative set of additives are 0.1-2 parts by weight of N,N'-bis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionyl] hydrazine; 0.05-0.5 parts by weight of pentaerythrityl-tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate]; 0.05-0.5 parts by weight of distearyl-pentaerythritol diphosphite; and 0.

Abstract: Fiber-reinforced polymer compositions containing resin components including (a) 30-90 weight % of polyamide resins, and (b) 10-70 weight % of polyolefins+unsaturated carboxylic acid-modified polyolefins, based on the resin components; and (c) 5-50 parts by weight of glass fibers per 100 parts by weight of the total compositions, a molar ratio of end amino groups in the polyamide resins to carboxyl groups in the modified polyolefins being 10-1000. The compositions have a morphology in which polyolefin domains having an average size of 0.5-5 .mu.m are uniformly dispersed in polyamide matrix phases.