Patents by Inventor Koji Furukawa
Koji Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11934096Abstract: A frame member for an electron beam lithography device of the present disclosure includes a frame body comprising sapphire or aluminum oxide-based ceramics having an open porosity of 0.2% or less and a conductive film disposed at least on a main surface of an electron gun side of the frame body.Type: GrantFiled: October 23, 2019Date of Patent: March 19, 2024Assignee: KYOCERA CORPORATIONInventors: Shigenobu Furukawa, Koji Akashi
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Publication number: 20240010805Abstract: A fiber reinforced prepreg comprising reinforcement fibers; particles (D1) and (D2); and a thermosetting resin composition is provided. The resin includes maleimide compound (A), and co-monomer (B). Co-monomer (B) has least one of an alkenylphenol, an alkenylphenoxy, or a diamine group. Particles (D1) are smaller than (D2) and particles (D1) and (D2) are insoluble in the thermosetting resin. Particles (D1) range in diameter from 1 to 10 microns and have a mode on a volume basis from 3 to 6 microns and are present from 3 to 12 percent by volume of the thermosetting resin. Particles (D2) range from 10 to 100 microns diameter and a mode of 20 to 60 microns and are present from 1 to 6 percent by volume of the thermosetting resin composition. After cure, at least 90% by volume of particles (D1) and (D2) remain in the prepreg interlayers.Type: ApplicationFiled: December 2, 2021Publication date: January 11, 2024Applicant: Toray Composite Materials America, Inc.Inventors: Madelyn Milligan, Jonathan C. Hughes, Alfred P. Haro, Toshiya Kamae, Naoki Matsuura, Koji Furukawa
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Publication number: 20230037333Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.Type: ApplicationFiled: November 5, 2020Publication date: February 9, 2023Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Publication number: 20230017689Abstract: A prepreg includes composition elements [A], [B], and [C] described below, [A] a reinforcing fiber, [B] a thermosetting resin, and [C] a thermoplastic resin. [C] is present on a surface of the prepreg, [B] contains a first curing agent [b1] and a second curing agent [b2], and the reinforcing fiber of [A] that crosses over a boundary surface between a resin region containing [B] and a resin region containing [C] and that is in contact with both resin regions is present.Type: ApplicationFiled: November 20, 2020Publication date: January 19, 2023Applicant: Toray Industries, Inc.Inventors: Jun Misumi, Masato Honma, Kyoko Shinohara, Koji Furukawa, Atsuhito Arai
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Publication number: 20220411572Abstract: An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more. (2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.Type: ApplicationFiled: November 5, 2020Publication date: December 29, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Publication number: 20220411626Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.Type: ApplicationFiled: November 5, 2020Publication date: December 29, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Publication number: 20220380561Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.Type: ApplicationFiled: November 5, 2020Publication date: December 1, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Patent number: 11505641Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.Type: GrantFiled: February 27, 2019Date of Patent: November 22, 2022Assignee: TORAY INDUSTRIES, INC.Inventors: Koji Furukawa, Junko Kawasaki, Soichi Yoshizaki, Kentaro Sano, Toshiya Kamae
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Patent number: 11319420Abstract: A prepreg containing the following constituent elements [A] to [C], wherein a resin composition containing the constituent elements [B] and [C] has a higher-order structure derived from a diffraction angle 2? between 1.0° and 6.0° observed with X-ray diffraction after curing: [A]: carbon fibers [B]: epoxy resin [C]: curing agent of [B].Type: GrantFiled: March 16, 2018Date of Patent: May 3, 2022Assignee: TORAY INDUSTRIES, INC.Inventors: Atsuhito Arai, Koji Furukawa, Atsuki Sugimoto, Masahiro Mino, Mayumi Mihara
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Patent number: 11208541Abstract: A prepreg, which includes a carbon fiber reinforced material, has excellent Mode I interlaminar toughness, Mode II interlaminar toughness, and tensile strength. The prepreg includes the following constituents [A] to [C] and satisfies the following conditions (I) and (II): [A]: a carbon fiber; [B]: an epoxy resin; and [C]: a hardener for [B], and (I) a surface oxygen concentration O/C of [A] measured by X-ray photoelectron spectroscopy is 0.10 or more; and (II) a cured product obtained by curing [B] and [C] includes a resin region having molecular anisotropy exhibiting interference fringes in polarizing microscope observation in a crossed Nicol state.Type: GrantFiled: May 28, 2018Date of Patent: December 28, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Koji Furukawa, Atsuhito Arai, Atsuki Sugimoto, Masahiro Mino, Mayumi Mihara
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Publication number: 20210371613Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.Type: ApplicationFiled: February 27, 2019Publication date: December 2, 2021Applicant: Toray Industries, Inc.Inventors: Koji Furukawa, Junko Kawasaki, Soichi Yoshizaki, Kentaro Sano, Toshiya Kamae
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Patent number: 11034810Abstract: An object of the present invention is to provide an epoxy resin composition capable of providing a carbon fiber-reinforced composite material that is excellent in moldability, heat resistance, and mechanical properties such as tensile strength and compression strength, and a prepreg. The present invention provides an epoxy resin composition containing at least components [A] to [D] shown below: [A]: an epoxy resin having a xylene group; [B]: a glycidyl amine epoxy resin having three or more glycidyl groups in a molecule; [C]: a thermoplastic resin; and [D]: an aromatic polyamine, the epoxy resin composition containing 10 to 80 parts by mass of the component [A] and 20 to 90 parts by mass of the component [B] based on 100 parts by mass in total of epoxy resins, and also 1 to 25 parts by mass of the component [C] based on 100 parts by mass in total of epoxy resins.Type: GrantFiled: March 5, 2018Date of Patent: June 15, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Junichi Aoki, Koji Furukawa, Atsuhito Arai, Jun Misumi, Hiroaki Sakata, Takashi Ochi
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Publication number: 20210115208Abstract: Provided is a prepreg including the following constituents [A] to [C], the prepreg satisfying the following conditions [I] to [III]: [A]: a sizing agent-coated carbon fiber; [B]: an epoxy resin having a specific structure; and [C]: a hardener for [B], [I]: an epoxy resin composition including the constituents [B] and [C] has a nematic-isotropic phase transition temperature in a temperature range of 130° C. to 180° C.; [II] a prepreg after isothermal holding at 100° C. for 30 minutes does not have a high-order structure originated from a diffraction angle of 2?=1.0° to 6.0° measured by wide angle X-ray diffraction at 100° C.; and [III]: a prepreg after isothermal holding at 180° C. for 2 hours has a high-order structure originated from the diffraction angle of 2?=1.0° to 6.0° measured by wide angle X-ray diffraction at 180° C.Type: ApplicationFiled: April 11, 2019Publication date: April 22, 2021Applicant: Toray Industries, Inc.Inventors: Atsuki Sugimoto, Atsuhito Arai, Koji Furukawa, Ryohei Watari
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Publication number: 20210087362Abstract: A prepreg includes following constituents [A] to [C] and satisfies following conditions (I) and (II): [A]: a carbon fiber; [B]: an epoxy resin; and [C]: a hardener for [B], and (I) a surface oxygen concentration O/C of [A] measured by X-ray photoelectron spectroscopy is 0.10 or more; and (II) a cured product obtained by curing [B] and [C] includes a resin region having molecular anisotropy exhibiting interference fringes in polarizing microscope observation in a crossed Nicol state.Type: ApplicationFiled: May 28, 2018Publication date: March 25, 2021Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Atsuhito ARAI, Atsuki SUGIMOTO, Masahiro MINO, Mayumi MIHARA
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Patent number: 10851217Abstract: Provided are: an epoxy resin composition that gives a carbon fiber-reinforced composite material having excellent moldability, heat resistance, and mechanical properties such as tensile strength and compressive strength; and a prepreg. An epoxy resin composition containing at least the following constituent elements [A]-[D]. The epoxy resin composition contains 5-50 parts by mass of constituent element [A] and 20-95 parts by mass of constituent element [B], as well as 1-25 parts by mass of constituent element [C], relative to 100 parts by mass of the total amount of epoxy resin. Constituent element [A] is an epoxy resin having primarily two epoxy groups and one or more condensed polycyclic aromatic hydrocarbon skeletons within a repeating unit of a specific structure; [B] is a glycidylamine epoxy resin having three or more glycidyl groups in the molecule; [C] is a sulfone or imide thermoplastic resin; and [D] is an epoxy resin curing agent.Type: GrantFiled: August 31, 2016Date of Patent: December 1, 2020Assignee: TORAY INDUSTRIES, INC.Inventors: Junichi Aoki, Koji Furukawa, Kyoko Tamaru, Atsuhito Arai, Hiroaki Sakata, Takashi Ochi
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Publication number: 20200276836Abstract: Provided are a medium conveying device and an inkjet printer that can convey a medium stably. In a case where a paper P is conveyed along a plane in a conveying unit 40, a posture of the paper P is corrected by a posture correction unit 20, and then the paper P is delivered to the conveying unit 40 by a delivery unit 30. The delivery unit 30 holds a leading end portion of the paper P of which the posture is corrected by the posture correction unit 2 with a paper holding bar 31, and delivers the paper P to the conveying unit 40 by moving the paper holding bar 31 linearly along a conveying direction of the paper P by the conveying unit 40.Type: ApplicationFiled: May 20, 2020Publication date: September 3, 2020Applicant: FUJIFILM CorporationInventors: Jun YAMANOBE, Takashi FUKUI, Koji FURUKAWA
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Patent number: 10597503Abstract: A prepreg containing at least the following components [A]-[F], wherein the ratio Ne/Nd of the number of structures Ne of component [F] present in a range of outside 110% of the particle diameter of component [E] and the number of structures Nd of component [F] present in a range outside 110% of the particle diameter of component [D] is 0.25 or higher. [A]: Carbon fibers, [B] thermosetting resin, [C]: curing agent, [D]: particles composed mainly of thermoplastic resin having a primary particle number-average particle size of 5-50 ?m, [E]: conductive particles different from component [D] and having a primary particle number-average particle size in the range of a specific expression, [F]: filler comprising a carbon material.Type: GrantFiled: March 19, 2015Date of Patent: March 24, 2020Assignee: TORAY INDUSTRIES, INC.Inventors: Atsuhito Arai, Koji Furukawa, Naofumi Yamashita, Shinji Kochi, Yumi Kunimitsu, Yui Fujioka, Hiroshi Taiko
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Publication number: 20200056005Abstract: A prepreg containing the following constituent elements [A] to [C], wherein a resin composition containing the constituent elements [B] and [C] has a higher-order structure derived from a diffraction angle 20 between 1.0° and 6.0° observed with X-ray diffraction after curing: [A]: carbon fibers [B]: epoxy resin [C]: curing agent of [B].Type: ApplicationFiled: March 16, 2018Publication date: February 20, 2020Applicant: TORAY INDUSTRIES, INC.Inventors: Atsuhito ARAI, Koji FURUKAWA, Atsuki SUGIMOTO, Masahiro MINO, Mayumi MIHARA
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Publication number: 20200010633Abstract: An object of the present invention is to provide an epoxy resin composition capable of providing a carbon fiber-reinforced composite material that is excellent in moldability, heat resistance, and mechanical properties such as tensile strength and compression strength, and a prepreg. The present invention provides an epoxy resin composition containing at least components [A] to [D] shown below: [A]: an epoxy resin having a xylene group; [B]: a glycidyl amine epoxy resin having three or more glycidyl groups in a molecule; [C]: a thermoplastic resin; and [D]: an aromatic polyamine, the epoxy resin composition containing 10 to 80 parts by mass of the component [A] and 20 to 90 parts by mass of the component [B] based on 100 parts by mass in total of epoxy resins, and also 1 to 25 parts by mass of the component [C] based on 100 parts by mass in total of epoxy resins.Type: ApplicationFiled: March 5, 2018Publication date: January 9, 2020Applicant: TORAY INDUSTRIES, INC.Inventors: Junichi AOKI, Koji FURUKAWA, Atsuhito ARAI, Jun MISUMI, Hiroaki SAKATA, Takashi OCHI
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Patent number: 10515053Abstract: A method of constructing a database in an on-vehicle device includes the steps of connecting a mobile terminal storing a plurality of pieces of music and music information associated with each of the plurality of pieces of music, acquiring the music information of each piece of music from the mobile terminal, when the acquired music information is stored in a storage space, determining whether free capacity of the storage space is insufficient, and when it is determined that the free capacity of the storage space is insufficient, removing at least one piece of music information of each piece of music from the storage space, and constructing a database for searching music on the basis of the music information stored in the storage space.Type: GrantFiled: April 4, 2017Date of Patent: December 24, 2019Assignee: ALPINE ELECTRONICS, INC.Inventors: Koji Furukawa, Toru Marumoto