Abstract: The present invention provides a method for manufacturing a semiconductor device comprising steps of: bonding one semiconductor chip to each of multiple mounting portions of a substrate; covering the semiconductor chips bonded to the mounting portions with a common resin layer; bringing the substrate into contact with the resin layer and gluing the substrate to an adhesive sheet; and performing dicing and measurement for the semiconductor chips that are glued to the adhesive sheet.

Abstract: According to the invention, during the processing for the measurement and the determination of the characteristic of a semiconductor device, data for the semiconductor device are stored in the memory of a tester. Then, the data for the semiconductor devices are individually stored. Therefore, based on the acquired data, the semiconductor devices are taped, along one taping line, in accordance with their characteristics.

Abstract: According to the invention, the characteristics of semiconductor devices are measured while these devices are adhered to an adhesive sheet, and the semiconductor devices, at this time, are aligned in a predetermined manner. Further, a semiconductor device is captured in the field of view of a camera to identify its location, and the characteristics of semiconductor devices, which are adjacent to the semiconductor device, are measured, without a position recognition process being required for these devices. Consequently, a considerable reduction in working time is realized and is accompanied by an improvement in productivity.

Abstract: According to the invention, during the processing for the measurement and the determination of the characteristic of a semiconductor device, data for the semiconductor device are stored in the memory of a tester. Then, the data for the semiconductor devices are individually stored. Therefore, based on the acquired data, the semiconductor devices are taped, along one taping line, in accordance with their characteristics.

Abstract: According to the invention, the characteristics of semiconductor devices are measured while these devices are adhered to an adhesive sheet, and the semiconductor devices, at this time, are aligned in a predetermined manner. Further, a semiconductor device is captured in the field of view of a camera to identify its location, and the characteristics of semiconductor devices, which are adjacent to the semiconductor device, are measured, without a position recognition process being required for these devices. Consequently, a considerable reduction in working time is realized and is accompanied by an improvement in productivity.

Abstract: The present invention provides a method for manufacturing a semiconductor device comprising steps of: bonding one semiconductor chip to each of multiple mounting portions of a substrate; covering the semiconductor chips bonded to the mounting portions with a common resin layer; bringing the substrate into contact with the resin layer and gluing the substrate to an adhesive sheet; and performing dicing and measurement for the semiconductor chips that are glued to the adhesive sheet.