Patents by Inventor Koji Kishino
Koji Kishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11638349Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.Type: GrantFiled: June 19, 2020Date of Patent: April 25, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Dai Sasaki, Yasunori Nishiguchi, Kazuki Matsumura, Yohsuke Ishikawa, Hiroki Tamiya, Koji Kishino
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Publication number: 20220353988Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.Type: ApplicationFiled: June 19, 2020Publication date: November 3, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Dai SASAKI, Yasunori NISHIGUCHI, Kazuki MATSUMURA, Yohsuke ISHIKAWA, Hiroki TAMIYA, Koji KISHINO
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Patent number: 11452216Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.Type: GrantFiled: July 25, 2018Date of Patent: September 20, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuki Matsumura, Yohsuke Ishikawa, Koji Kishino
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Publication number: 20220259378Abstract: A resin composition contains: a modified polyphenylene ether compound (A) having, at one terminal, a group with an unsaturated double bond; a cross-linking agent (B) having a carbon-carbon double bond; a hindered amine-based polymerization inhibitor (C); and a solvent (D).Type: ApplicationFiled: June 19, 2020Publication date: August 18, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Dai SASAKI, Yohsuke ISHIKAWA, Kazuki MATSUMURA, Yasunori NISHIGUCHI, Hiroki TAMIYA, Koji KISHINO
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Publication number: 20210161020Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.Type: ApplicationFiled: July 25, 2018Publication date: May 27, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuki MATSUMURA, Yohsuke ISHIKAWA, Koji KISHINO
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Publication number: 20200157300Abstract: The resin composition includes: an epoxy resin as Component (A); a phenolic compound as Component (B); and an imidazole compound having a triazine skeleton, as Component (C). A cured product of the resin composition has a glass transition temperature of 260° C. or more.Type: ApplicationFiled: June 4, 2018Publication date: May 21, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yohsuke ISHIKAWA, Kazuki MATSUMURA, Koji KISHINO
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Publication number: 20190181081Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 ?m and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.Type: ApplicationFiled: February 14, 2019Publication date: June 13, 2019Inventors: Hiroki TAMIYA, Koji KISHINO, Ryuji TAKAHASHI, Yasunori HOSHINO, Takahiro YAMADA, Shimpei OBATA, Hiroyuki SHIRAKI, Shinya ARAKAWA, Shigetoshi FUJITA
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Patent number: 10009997Abstract: A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.Type: GrantFiled: June 12, 2012Date of Patent: June 26, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroharu Inoue, Koji Kishino
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Patent number: 9795030Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.Type: GrantFiled: March 24, 2017Date of Patent: October 17, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Hiroharu Inoue, Koji Kishino
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Publication number: 20170196082Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.Type: ApplicationFiled: March 24, 2017Publication date: July 6, 2017Inventors: Hiroharu INOUE, Koji KISHINO
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Patent number: 9661749Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.Type: GrantFiled: November 29, 2012Date of Patent: May 23, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Hiroharu Inoue, Koji Kishino
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Patent number: 9578734Abstract: The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, R1 represents H or CH3, and R2 represents H or an alkyl group.Type: GrantFiled: September 19, 2013Date of Patent: February 21, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroharu Inoue, Koji Kishino
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Patent number: 9516746Abstract: A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.Type: GrantFiled: November 21, 2012Date of Patent: December 6, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Koji Kishino, Hiroharu Inoue, Takeshi Kitamura
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Patent number: 9480148Abstract: A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.Type: GrantFiled: February 15, 2012Date of Patent: October 25, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroharu Inoue, Shingo Yoshioka, Koji Kishino, Takatoshi Abe
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Publication number: 20160293538Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 ?m and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.Type: ApplicationFiled: March 15, 2016Publication date: October 6, 2016Inventors: HIROKI TAMIYA, KOJI KISHINO, RYUJI TAKAHASHI, YASUNORI HOSHINO, TAKAHIRO YAMADA, SHIMPEI OBATA, HIROYUKI SHIRAKI, SHINYA ARAKAWA, SHIGETOSHI FUJITA
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Patent number: 9102850Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.Type: GrantFiled: March 11, 2014Date of Patent: August 11, 2015Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroharu Inoue, Koji Kishino, Takashi Hoshi
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Publication number: 20150075852Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.Type: ApplicationFiled: March 11, 2014Publication date: March 19, 2015Inventors: Hiroharu Inoue, Koji Kishino, Takashi Hoshi
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Publication number: 20140374142Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.Type: ApplicationFiled: November 29, 2012Publication date: December 25, 2014Applicant: PANASONIC CORPORATIONInventors: Hiroharu Inoue, Koji Kishino
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Publication number: 20140367150Abstract: The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, R1 represents H or CH3, and R2 represents H or an alkyl group.Type: ApplicationFiled: September 19, 2013Publication date: December 18, 2014Applicant: PANASONIC CORPORATIONInventors: Hiroharu Inoue, Koji Kishino
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Publication number: 20140311781Abstract: A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.Type: ApplicationFiled: November 21, 2012Publication date: October 23, 2014Applicant: PANASONIC CORPORATIONInventors: Koji Kishino, Hiroharu Inoue, Takeshi Kitamura