Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.

Abstract: A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. A thickness of a base of the fin is larger than a thickness of the heat sink substrate. Furthermore, an electronic apparatus of this invention has a heat sink unit of this invention disposed within the apparatus.

Abstract: A heatsink apparatus has a construction which produces a high heat-radiating effect even if the apparatus is designed to be compact or to have a small thickness. The heatsink apparatus includes a base plate to which a heat-generating body may be connected, a heat-radiating portion, and a fan mounted on the base plate. The heat-radiating portion includes plate-like members having main surfaces facing the base plated, and a fan mounted on the base plate.

Abstract: A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. A thickness of a base of the fin is larger than a thickness of the heat sink substrate. Furthermore, an electronic apparatus of this invention has a heat sink unit of this invention disposed within the apparatus.

Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.

Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.

Abstract: A heat sink apparatus for cooling a highly heat-generative semiconductor device in which a base of a heat sink is made larger in volume in its central portion than in its peripheral portion.