Patents by Inventor Koji Onouchi

Koji Onouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7525064
    Abstract: The purpose of the present invention is provide a method of forming a flux layer on an aluminum plate member, wherein a heating step for drying after a spray-coating of a flux composition can be omitted. The invention relates to a flux layer 2 composed of solid constituents of 5-25 g/m2 formed on a surface of an aluminum plate member 1, by spray-coating a flux composition from a nozzle 20 to the plate member 1 with a thickness of 0.2-1.6 mm, which was press-molded and heated for degreasing in a heat-degreasing oven 10, while a temperature of the plate member 1 is kept from 120 to 180° C. under the remaining heat after completing a heating step for degreasing, and naturally drying for volatilizing volatile constituents of the flux composition utilizing the remaining heat.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: April 28, 2009
    Assignees: Denso Corporation, Harima Chemicals, Inc.
    Inventors: Koji Onouchi, Shouei Teshima, Ichiro Taninaka
  • Patent number: 7401726
    Abstract: For integrally bonding a first member and a second member made of copper or a copper alloy by brazing, a paste brazing material composed essentially of copper (Cu), tin (Sn), nickel (Ni) and phosphorus (P) is beforehand applied to at least one of the first and second members. A base material is exposed at the whole or a part of a contact portion between the first and second members. Thereafter, the first and second members are assembled at a predetermined position, and heated at a temperature in a range of 600° C.-800° C. within a reducing atmosphere furnace. By the brazing method, an oxide film on the surface of the base material can be sufficiently removed, so that the paste brazing material can smoothly flow on the surface at the contact portion.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: July 22, 2008
    Assignee: Denso Corporation
    Inventors: Hiroki Tarui, Masafumi Takahashi, Tsuguharu Shimpo, Koji Onouchi, Hiroshi Ogawa
  • Publication number: 20060113355
    Abstract: The purpose of the present invention is provide a method of forming a flux layer on an aluminum plate member, wherein a heating step for drying after a spray-coating of a flux composition can be omitted. The invention relates to a flux layer 2 composed of solid constituents of 5-25 g/m2 formed on a surface of an aluminum plate member 1, by spray-coating a flux composition from a nozzle 20 to the plate member 1 with a thickness of 0.2-1.6 mm, which was press-molded and heated for degreasing in a heat-degreasing oven 10, while a temperature of the plate member 1 is kept from 120 to 180° C. under the remaining heat after completing a heating step for degreasing, and naturally drying for volatilizing volatile constituents of the flux composition utilizing the remaining heat.
    Type: Application
    Filed: November 28, 2005
    Publication date: June 1, 2006
    Applicants: DENSO Corporation, Harima Chemicals, Inc.
    Inventors: Koji Onouchi, Shoei Teshima, Ichiro Taninaka
  • Publication number: 20050082350
    Abstract: For integrally bonding a first member and a second member made of copper or a copper alloy by brazing, a paste brazing material composed essentially of copper (Cu), tin (Sn), nickel (Ni) and phosphorus (P) is beforehand applied to at least one of the first and second members. A base material is exposed at the whole or a part of a contact portion between the first and second members. Thereafter, the first and second members are assembled at a predetermined position, and heated at a temperature in a range of 600° C.-800° C. within a reducing atmosphere furnace. By the brazing method, an oxide film on the surface of the base material can be sufficiently removed, so that the paste brazing material can smoothly flow on the surface at the contact portion.
    Type: Application
    Filed: October 14, 2004
    Publication date: April 21, 2005
    Inventors: Hiroki Tarui, Masafumi Takahashi, Tsuguharu Shimpo, Koji Onouchi, Hiroshi Ogawa