Abstract: A semiconductor device has a super junction structure and includes a first semiconductor layer of the second conductive type disposed on the first column region and the second column region, a second semiconductor layer of the first conductive type disposed on the first semiconductor layer, a first semiconductor region of the first conductive type that is electrically connected to the first electrode and is disposed in a surface layer portion of the second semiconductor layer to be separated from the first semiconductor layer, and a second semiconductor region of the second conductive type that is electrically connected to the second electrode and that is disposed at least in the surface layer portion of the second semiconductor layer to be separated from the first semiconductor region and is electrically connected to the first semiconductor layer.

Abstract: A substrate manufacturing machine (component mounter) includes a substrate type setting section configured to set next and subsequent substrate types to be manufactured subsequently to a current substrate type currently being manufactured, a substrate type checking section configured to check whether the set next and subsequent substrate types are correct, a manufacturing condition investigation section configured to examine whether a manufacturing condition for manufacturing substrates of the next and subsequent substrate types is satisfied, and a manufacturing authorization section configured to authorize manufacturing of the substrates of the next and subsequent substrate types in a case where the next and subsequent substrate types are correct and the manufacturing condition is satisfied.

Abstract: It is an object of the present invention to provide a component management system or the like that can accurately predict component exhaustion in a component mounting device that performs work at a line. Specifying section updates the time table based on the arrival time point or the unloading time point in each of component mounting devices. Arrival predicting section predicts the arrival time point in each component mounting device based on the time table and updates a prediction table. Since component-exhaustion predicting section acquires the arrival time point of a circuit board for which a component will be exhausted from the prediction table and calculates a component exhaustion time point, it is possible to predict the component exhaustion time point with high accuracy. An operator can perform a replenishment work based on the component exhaustion time point.

Abstract: A board production management device for managing a board production line including a solution memory section for linking and storing a problem event that may occur in a board production line and that requires a countermeasure operation, a solution to serve as the countermeasure operation, and a set authority level set for a worker who may implement the solution; an solution memory section for authenticating the authority level of a worker who implements the countermeasure operation; and a solution notification section for separately reporting, when a problem event occurs, an executable solution corresponding to a set authority level equal to or less than the authority level, and an unexecutable solution corresponding to a set authority level exceeding the authority level.

Abstract: Provided are (i) a catalyst that has a core-shell structure and is highly active in an oxygen reduction reaction, which is a cathode reaction of a fuel cell, and (ii) a reaction acceleration method in which the catalyst is used. A core-shell catalyst for accelerating an oxygen reduction reaction, contains: silver or palladium as a core material; and platinum as a shell material, the core-shell catalyst having, on a surface thereof, a (110) surface of a face centered cubic lattice.

Abstract: A main body frame of a multifunction machine has first and second frames of which surfaces parallel to a Z-axis face each other. A recording head is disposed between the first and the second frames and fixed to the main body frame. An ejection tray is fixed to the main body frame on a +Z direction with respect to the recording head. A scanner is fixed to the main body frame on the +Z direction with respect to the ejection tray and forms an ejection space with the ejection tray. The recording head performs recording on a medium which is being transported toward a first direction, which is an in-plane direction of the first frame. The ejection tray is configured to be removed toward a second direction, which is the in-plane direction of the first frame, in a state where the scanner is fixed to the main body frame.

Abstract: Provided are valve devices and flow heads for a valve device. A valve device can include a valve body (30) that opens and closes a valve hole (15a) to allow communication between a primary flow path (17a) and a secondary flow path (17b), a back pressure chamber (7) defined at the back side of the valve body, a small hole (51) that is provided in the valve body to allow the primary flow path of and the back pressure chamber to communicate with each other, and a pin (6) that has a straight portion inserted into the small hole to clean the small hole by relative motions of the small hole and the straight portion. A flow head (34) may be annular and include one or more notches along a perimeter and be configured to engage with an inner peripheral surface of an upper end portion of an inner barrel of the valve device.

Abstract: A printing device includes a recording portion performing recording on a medium; a discharge tray loading the medium recorded; a first detector configured to detect the medium of a first load capacity loaded on the discharge tray; a second detector configured to detect the medium of a second load capacity smaller than the first load capacity loaded on the discharge tray; a mounting portion on which an optional device is mounted; and a controller controlling the recording by the recording portion, in which the optional device mounted on the mounting portion is positioned above the discharge tray, the first detector and the second detector are positioned below the optional device mounted on the mounting portion, and when the first detector detects the medium of the first load capacity in a non-mounted case in which the optional device is not mounted, the controller executes full load processing.

Abstract: A substrate manufacturing machine (component mounter) includes a substrate type setting section configured to set next and subsequent substrate types to be manufactured subsequently to a current substrate type currently being manufactured, a substrate type checking section configured to check whether the set next and subsequent substrate types are correct, a manufacturing condition investigation section configured to examine whether a manufacturing condition for manufacturing substrates of the next and subsequent substrate types is satisfied, and a manufacturing authorization section configured to authorize manufacturing of the substrates of the next and subsequent substrate types in a case where the next and subsequent substrate types are correct and the manufacturing condition is satisfied.

Abstract: A substrate manufacturing machine (component mounter) includes a substrate type setting section configured to set next and subsequent substrate types to be manufactured subsequently to a current substrate type currently being manufactured, a substrate type checking section configured to check whether the set next and subsequent substrate types are correct, a manufacturing condition investigation section configured to examine whether a manufacturing condition for manufacturing substrates of the next and subsequent substrate types is satisfied, and a manufacturing authorization section configured to authorize manufacturing of the substrates of the next and subsequent substrate types in a case where the next and subsequent substrate types are correct and the manufacturing condition is satisfied.

Abstract: A control device acquires a first two-dimensional position of a cam bolt and a locknut in a first direction based on a first actual image captured by a first camera, and based on the acquired first two-dimensional position, the control device moves an adjustment socket to a position where the adjustment socket is fittable to a head of the cam bolt and moves a tightening socket to a position where the tightening socket is fittable to the locknut. Then, the control device acquires a second two-dimensional position of the cam bolt and the locknut in a second direction based on a second actual image captured by a second camera, and corrects, based on the acquired second two-dimensional position, a position of the adjustment socket relative to the head of the cam bolt and a position of the tightening socket relative to the locknut.

Abstract: Provided are valve devices and flow heads for a valve device. A valve device can include a valve body (30) that opens and closes a valve hole (15a) to allow communication between a primary flow path (17a) and a secondary flow path (17b), a back pressure chamber (7) defined at the back side of the valve body, a small hole (51) that is provided in the valve body to allow the primary flow path of and the back pressure chamber to communicate with each other, and a pin (6) that has a straight portion inserted into the small hole to clean the small hole by relative motions of the small hole and the straight portion. A flow head (34) may be annular and include one or more notches along a perimeter and be configured to engage with an inner peripheral surface of an upper end portion of an inner barrel of the valve device.

Abstract: A board production management device for managing a board production line including a solution memory section for linking and storing a problem event that may occur in a board production line and that requires a countermeasure operation, a solution to serve as the countermeasure operation, and a set authority level set for a worker who may implement the solution; an solution memory section for authenticating the authority level of a worker who implements the countermeasure operation; and a solution notification section for separately reporting, when a problem event occurs, an executable solution corresponding to a set authority level equal to or less than the authority level, and an unexecutable solution corresponding to a set authority level exceeding the authority level.

Abstract: A setup support device capable of editing a setup list in accordance with a change in a production schedule or the like, thereby enabling more efficient setup of a component mounter. The setup support device includes a list editing section for performing editing to increase or decrease production jobs included in a setup list in accordance with a request from an operator who performs setup at the component mounter or a change in a production schedule, and a guidance section for issuing setup guidance for the production jobs to the operator based on the edited setup list.

Abstract: [Problem] To provide an electrode connection structure and the like in which a plurality of elongated leads are arranged in parallel and a longitudinal side surface of each lead is connected to an electrode by plating treatment with high quality. [Solution] An electrode connection structure in which a semiconductor chip 12 electrode and/or a substrate electrode is connected to a plurality of elongated leads 11 of a lead frame 10 by plating. The plurality of elongated leads 11 of the lead frame 10 are arranged in parallel, and a longitudinal side surface of each lead 11 is connected to the semiconductor chip 12 electrode and/or the substrate electrode by plating.

Abstract: A setup support device that improves the efficiency of setup of a component mounter by guiding supplying of feeders to a component supply device as preparation for setting of the feeders. The support setup device includes: a preparation cart on which are loaded multiple of the feeders used to perform multiple production jobs; and a feeder identifying section configured to identify multiple of the feeders to be set on a component supply device among the multiple feeders loaded on the preparation cart. The preparation cart includes a guidance section configured to issue guidance all at once for the identified multiple feeders to an operator performing the setup so as to supply the identified multiple feeders to the component supply device as preparation for setting the identified multiple feeders on the component supply device.

Abstract: In a printer, an upstream side transport path for transporting a paper sheet to a recording region in which recording is performed by a recording head from a tube for supplying ink to a recording head from a liquid accommodation body stored in the liquid storage unit and a medium accommodation unit in a state where a recording unit, the liquid storage unit, and a medium accommodation unit are stacked, is configured, and the liquid storage unit includes a liquid storage unit inner transport path including a supply connection section which connects the liquid accommodation body and the tube to each other, and a first transport section which forms a part of the upstream side transport path.

Abstract: Provided is a relay device and manufacturing system that relays communication based on SECS/GEM protocol to a manufacturing system using a different communication protocol, and enables integrated management via a SECS/GEM host. Relay device performs protocol conversion between a SECS/GEM protocol and an original protocol that is a non-SECS/GEM protocol, and transfers data transmitted between user host and manufacturer host. Also, relay device performs transfer processing based on a port correspondence database that specifies local IP addresses of manufacturer host and the like and TCP protocol port numbers corresponding to these IP addresses.

Abstract: According to an aspect, a semiconductor apparatus includes semiconductor devices. Each semiconductor device includes: a state monitor that monitors a plurality of functions implemented by the semiconductor device, and outputs state monitoring signals; and an anomaly determination circuit that performs anomaly determination based on the state monitoring signals. When the anomaly determination circuit of a first semiconductor device detects that one or more of the functions of the semiconductor devices are abnormal based on a first anomaly determination result and a second anomaly determination result, the anomaly determination circuit of the first semiconductor device outputs an anomaly detection signal to the semiconductor devices.

Abstract: A setup support device capable of editing a setup list in accordance with a change in a production schedule or the like, thereby enabling more efficient setup of a component mounter. The setup support device includes a list editing section for performing editing to increase or decrease production jobs included in a setup list in accordance with a request from an operator who performs setup at the component mounter or a change in a production schedule, and a guidance section for issuing setup guidance for the production jobs to the operator based on the edited setup list.