Patents by Inventor Koji Shinoda
Koji Shinoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11890820Abstract: A method for manufacturing a three-dimensional structure including: preparing a first structure including a fixing face; fixing a plastic layer to the fixing face of the first structure; preparing a conductive wire; and operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer.Type: GrantFiled: December 3, 2021Date of Patent: February 6, 2024Assignee: HOSIDEN CORPORATIONInventor: Koji Shinoda
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Publication number: 20220194022Abstract: A method for manufacturing a three-dimensional structure including: preparing a first structure including a fixing face; fixing a plastic layer to the fixing face of the first structure; preparing a conductive wire; and operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer.Type: ApplicationFiled: December 3, 2021Publication date: June 23, 2022Applicant: HOSIDEN CORPORATIONInventor: Koji SHINODA
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Patent number: 11342703Abstract: In a connector (1), one end parts (31A, 31B and 31C) of first terminals (3A), a plurality of second terminals (3B) and a plurality of third terminals (3C) are arranged in parallel to each other along a first direction (D1). An outer resin portion (4) is formed with a first clamping portion (42A) for clamping one end part (20A) of a first core resin portion (2A) and one end part (20B) of a second core resin portion (2B) together, a second clamping portion (42B) for clamping the one end part (20A) of a first core resin portion (2A) and one end part (20C) of a third core resin portion (2C) together and a third clamping portion (42C) for clamping the one end part (20B) of a second core resin portion (2B) and the one end part (20C) of the third core resin portion (2C) together.Type: GrantFiled: July 19, 2019Date of Patent: May 24, 2022Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventor: Koji Shinoda
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Patent number: 11217929Abstract: In a connector (1), one end parts (31A) of first terminals (3A), one end parts (31B) of a plurality of second terminals (3B) and one end parts (31C) of a plurality of third terminals (3C) are arranged in parallel to each other along a first direction (D1). One end part (20C) of a third core resin portion (2C) sandwiches one end part (20A) of a first core resin portion (2A) and one end part (20B) of a second core resin portion (2B) from both sides in a second direction (D2). The one end part (20A) of the first core resin portion (2A) and the one end part (20B) of the second core resin portion (2B), and the one end part (20C) of the third core resin portion (3C) are shaped to be locked in a third direction (D3).Type: GrantFiled: February 27, 2019Date of Patent: January 4, 2022Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventors: Hiroki Yamada, Koji Shinoda
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Publication number: 20210318190Abstract: A strain sensor module comprises a base material, a sensor part including a plurality of sensor electrodes for detecting a strain formed on the base material and a lead-out wiring for connecting the plurality of sensor electrodes in series, and a terminal part which is electrically connected to an external circuit.Type: ApplicationFiled: April 6, 2021Publication date: October 14, 2021Applicant: HOSIDEN CORPORATIONInventor: Koji SHINODA
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Publication number: 20210265761Abstract: In a connector (1), one end parts (31A, 31B and 31C) of first terminals (3A), a plurality of second terminals (3B) and a plurality of third terminals (3C) are arranged in parallel to each other along a first direction (D1). An outer resin portion (4) is formed with a first clamping portion (42A) for clamping one end part (20A) of a first core resin portion (2A) and one end part (20B) of a second core resin portion (2B) together, a second clamping portion (42B) for clamping the one end part (20A) of a first core resin portion (2A) and one end part (20C) of a third core resin portion (2C) together and a third clamping portion (42C) for clamping the one end part (20B) of a second core resin portion (2B) and the one end part (20C) of the third core resin portion (2C) together.Type: ApplicationFiled: July 19, 2019Publication date: August 26, 2021Inventor: Koji SHINODA
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Patent number: 11043771Abstract: A connector (10) includes a first terminal (62) and a second terminal (32), and a first holding portion (72) and a second holding portion (42) configured to coat around the first terminal (62) and the second terminal (32) with resin. The first holding portion (72) and the second holding portion (42) are stacked one over the other in the height direction. The first terminal (62) has an exposed surface (62H) exposed on a resin surface of the first holding portion (72). The second holding portion (42) covers the exposed surface (62H) of the first terminal (62) while being stacked on or below the first holding portion (72).Type: GrantFiled: September 19, 2019Date of Patent: June 22, 2021Inventor: Koji Shinoda
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Publication number: 20200403345Abstract: In a connector (1), one end parts (31A) of first terminals (3A), one end parts (31B) of a plurality of second terminals (3B) and one end parts (31C) of a plurality of third terminals (3C) are arranged in parallel to each other along a first direction (D1). One end part (20C) of a third core resin portion (2C) sandwiches one end part (20A) of a first core resin portion (2A) and one end part (20B) of a second core resin portion (2B) from both sides in a second direction (D2). The one end part (20A) of the first core resin portion (2A) and the one end part (20B) of the second core resin portion (2B), and the one end part (20C) of the third core resin portion (3C) are shaped to be locked in a third direction (D3).Type: ApplicationFiled: February 27, 2019Publication date: December 24, 2020Inventors: Hiroki YAMADA, Koji SHINODA
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Patent number: 10797430Abstract: A connector 22 includes a housing 31, a plate 32, a plurality of terminals 33 and a potting material 34. The housing 31 is formed by insert molding with the plate 32 and the plurality of terminals 33 as cores. The housing 31 includes a separation wall 31b held in close contact with a first surface 32a of the plate 32, and this separation wall 31b is held in close contact with side surfaces of the terminals 33.Type: GrantFiled: December 8, 2017Date of Patent: October 6, 2020Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Koji Shinoda
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Publication number: 20200106206Abstract: A connector (10) includes a first terminal (62) and a second terminal (32), and a first holding portion (72) and a second holding portion (42) configured to coat around the first terminal (62) and the second terminal (32) with resin. The first holding portion (72) and the second holding portion (42) are stacked one over the other in the height direction. The first terminal (62) has an exposed surface (62H) exposed on a resin surface of the first holding portion (72). The second holding portion (42) covers the exposed surface (62H) of the first terminal (62) while being stacked on or below the first holding portion (72).Type: ApplicationFiled: September 19, 2019Publication date: April 2, 2020Inventor: Koji Shinoda
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Publication number: 20190326704Abstract: A connector 22 includes a housing 31, a plate 32, a plurality of terminals 33 and a potting material 34. The housing 31 is formed by insert molding with the plate 32 and the plurality of terminals 33 as cores. The housing 31 includes a separation wall 31b held in close contact with a first surface 32a of the plate 32, and this separation wall 31b is held in close contact with side surfaces of the terminals 33.Type: ApplicationFiled: December 8, 2017Publication date: October 24, 2019Inventor: Koji SHINODA
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Patent number: 10289255Abstract: A touch sensing device including first electrodes at a first height, and second electrodes and first ground electrodes at a second height. The first electrodes are spaced apart along a first direction and each include first and second overlapping portions. The second electrodes are spaced apart along a second direction and include pairs of adjacent second electrodes. The second electrodes each include wide and narrow portions. The wide portions are spaced apart in the first direction and include pairs of adjacent wide portions. Each narrow portion is smaller in the second direction than each wide portion and interconnects the corresponding adjacent wide portions. The narrow portions overlap the corresponding first overlapping portions. Each first ground electrode, located between the corresponding adjacent second electrodes, includes first and second portions. Each first portion is located between the corresponding wide portions.Type: GrantFiled: October 19, 2017Date of Patent: May 14, 2019Assignee: HOSIDEN CORPORATIONInventor: Koji Shinoda
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Patent number: 10289227Abstract: A method for manufacturing a touch sensing device including at least 1) to 5) as follows: 1) preparing a material film being biaxially stretched and including an available area that is a partial area in a widthwise direction of the material film, the available area extending in a lengthwise direction of the material film and including first and second segments, the first and second segments defining different areas in the lengthwise direction; 2) forming an electrode group on one of the first and second segments; 3) cutting a first piece out of the material film to make the first piece including the first segment; 4) cutting a second piece out of the material film to make the second piece including the second segment; and 5) bonding the first segment to the second segment, substantially maintaining orientations of the first segment and the second segment as before the cutting.Type: GrantFiled: September 12, 2017Date of Patent: May 14, 2019Assignee: HOSIDEN CORPORATIONInventor: Koji Shinoda
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Patent number: 10261645Abstract: A touch sensing device including first electrodes and second electrodes. The first electrodes at a first height position are spaced apart along a first direction and each include an electrode body of strip shape extending in a second direction. The electrode body of each first electrode includes first overlapping portions. The second electrodes at a second height position are spaced apart along the second direction and intersect the first electrodes. Each second electrode includes wide portions and narrow portions. The wide portions of each second electrode are spaced apart along the first direction and include pairs of adjacent wide portions. The adjacent wide portions of each pair are located adjacent to each other in the first direction. Each narrow portion is smaller in the second direction than each wide portion, interconnects the adjacent wide portions of a corresponding pair, and overlaps a corresponding one of the first overlapping portions.Type: GrantFiled: October 19, 2017Date of Patent: April 16, 2019Assignee: HOSIDEN CORPORATIONInventor: Koji Shinoda
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Patent number: 10154602Abstract: The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.Type: GrantFiled: August 26, 2016Date of Patent: December 11, 2018Assignee: HOSIDEN CORPORATIONInventors: Takeshi Isoda, Koji Shinoda
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Publication number: 20180113532Abstract: A touch sensing device including first electrodes at a first height, and second electrodes and first ground electrodes at a second height. The first electrodes are spaced apart along a first direction and each include first and second overlapping portions. The second electrodes are spaced apart along a second direction and include pairs of adjacent second electrodes. The second electrodes each include wide and narrow portions. The wide portions are spaced apart in the first direction and include pairs of adjacent wide portions. Each narrow portion is smaller in the second direction than each wide portion and interconnects the corresponding adjacent wide portions. The narrow portions overlap the corresponding first overlapping portions. Each first ground electrode, located between the corresponding adjacent second electrodes, includes first and second portions. Each first portion is located between the corresponding wide portions.Type: ApplicationFiled: October 19, 2017Publication date: April 26, 2018Inventor: Koji SHINODA
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Publication number: 20180113533Abstract: A touch sensing device including first electrodes and second electrodes. The first electrodes at a first height position are spaced apart along a first direction and each include an electrode body of strip shape extending in a second direction. The electrode body of each first electrode includes first overlapping portions. The second electrodes at a second height position are spaced apart along the second direction and intersect the first electrodes. Each second electrode includes wide portions and narrow portions. The wide portions of each second electrode are spaced apart along the first direction and include pairs of adjacent wide portions. The adjacent wide portions of each pair are located adjacent to each other in the first direction. Each narrow portion is smaller in the second direction than each wide portion, interconnects the adjacent wide portions of a corresponding pair, and overlaps a corresponding one of the first overlapping portions.Type: ApplicationFiled: October 19, 2017Publication date: April 26, 2018Inventor: Koji SHINODA
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Patent number: 9939918Abstract: An input device including a base, a plastic part provided on the base, and a touch sensor embedded in the plastic part. Embedding the touch sensor in the plastic part contributes to the reduction of the distance from an outer face of the base to the touch sensor, thereby improving the sensitivity of the touch sensor. Embedding the touch sensor in the plastic part also makes it possible to omit a step of fixing the touch sensor to the plastic part, thereby improving the yield rate of the input device.Type: GrantFiled: February 6, 2013Date of Patent: April 10, 2018Assignee: HOSIDEN CORPORATIONInventors: Koji Shinoda, Takeshi Isoda
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Publication number: 20180088714Abstract: A method for manufacturing a touch sensing device including at least 1) to 5) as follows: 1) preparing a material film being biaxially stretched and including an available area that is a partial area in a widthwise direction of the material film, the available area extending in a lengthwise direction of the material film and including first and second segments, the first and second segments defining different areas in the lengthwise direction; 2) forming an electrode group on one of the first and second segments; 3) cutting a first piece out of the material film to make the first piece including the first segment; 4) cutting a second piece out of the material film to make the second piece including the second segment; and 5) bonding the first segment to the second segment, substantially maintaining orientations of the first segment and the second segment as before the cutting.Type: ApplicationFiled: September 12, 2017Publication date: March 29, 2018Inventor: Koji Shinoda
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Patent number: 9872409Abstract: The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.Type: GrantFiled: August 5, 2013Date of Patent: January 16, 2018Assignee: HOSIDEN CORPORATIONInventors: Takeshi Isoda, Koji Shinoda