Patents by Inventor Koji Tsuduki
Koji Tsuduki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972990Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.Type: GrantFiled: October 11, 2021Date of Patent: April 30, 2024Assignee: Canon Kabushiki KaishaInventors: Satoshi Nozu, Yu Aoki, Hirotaka Sekiguchi, Koji Sato, Koji Tsuduki
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Publication number: 20220030716Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.Type: ApplicationFiled: October 11, 2021Publication date: January 27, 2022Inventors: Satoshi Nozu, Yu Aoki, Hirotaka Sekiguchi, Koji Sato, Koji Tsuduki
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Patent number: 11164803Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.Type: GrantFiled: August 14, 2019Date of Patent: November 2, 2021Assignee: Canon Kabushiki KaishaInventors: Satoshi Nozu, Yu Aoki, Hirotaka Sekiguchi, Koji Sato, Koji Tsuduki
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Patent number: 10958860Abstract: A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.Type: GrantFiled: July 15, 2019Date of Patent: March 23, 2021Assignee: CANON KABUSHIKI KAISHAInventors: Satoshi Nozu, Yu Aoki, Koji Tsuduki
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Publication number: 20200075437Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.Type: ApplicationFiled: August 14, 2019Publication date: March 5, 2020Inventors: Satoshi Nozu, Yu Aoki, Hirotaka Sekiguchi, Koji Sato, Koji Tsuduki
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Publication number: 20200029039Abstract: A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.Type: ApplicationFiled: July 15, 2019Publication date: January 23, 2020Inventors: Satoshi Nozu, Yu Aoki, Koji Tsuduki
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Patent number: 10319767Abstract: An optical member includes a first region and a second region constituting an interface with an adhesive member. The first region is disposed outside the second region in a second direction intersecting a first direction. An adhesive force generated at an interface between the first region and the adhesive member is smaller than an adhesive force generated at an interface between the second region and the adhesive member.Type: GrantFiled: May 5, 2017Date of Patent: June 11, 2019Assignee: Canon Kabushiki KaishaInventors: Kazuya Notsu, Koji Tsuduki, Kunihiro Abe
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Patent number: 9978675Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.Type: GrantFiled: November 14, 2016Date of Patent: May 22, 2018Assignee: CANON KABUSHIKI KAISHAInventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
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Publication number: 20170338267Abstract: An optical member includes a first region and a second region constituting an interface with an adhesive member. The first region is disposed outside the second region in a second direction intersecting a first direction. An adhesive force generated at an interface between the first region and the adhesive member is smaller than an adhesive force generated at an interface between the second region and the adhesive member.Type: ApplicationFiled: May 5, 2017Publication date: November 23, 2017Inventors: Kazuya Notsu, Koji Tsuduki, Kunihiro Abe
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Patent number: 9815133Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.Type: GrantFiled: August 3, 2015Date of Patent: November 14, 2017Assignee: Canon Kabushiki KaishaInventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
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Patent number: 9774769Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.Type: GrantFiled: September 29, 2015Date of Patent: September 26, 2017Assignee: CANON KABUSHIKI KAISHAInventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
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Publication number: 20170150601Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.Type: ApplicationFiled: November 14, 2016Publication date: May 25, 2017Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
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Patent number: 9585287Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.Type: GrantFiled: October 21, 2014Date of Patent: February 28, 2017Assignee: Canon Kabushiki KaishaInventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka
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Publication number: 20160366774Abstract: An electronic component including an electronic device and a container accommodating the electronic device. The container includes a base portion including a first surface on which the electronic device is mounted and a second surface on an opposite side of the first surface, an opposing portion opposing the electronic device with a space in between, a frame portion surrounding the space between the base portion and the opposing portion, and a plurality of connecting portions that are positioned on the second surface and positioned in at least an orthographic projection area of the electronic device, the plurality of connecting portions being soldered to a wiring member. In the orthographic projection area of the electronic device, a thickness of the base portion in a central area is smaller than a thickness of the base portion in a peripheral area such that the second surface forms a concave surface.Type: ApplicationFiled: June 8, 2016Publication date: December 15, 2016Inventors: Shin Hasegawa, Fujio Ito, Takanori Suzuki, Takao Toyoka, Tadashi Kosaka, Yasushi Kurihara, Koji Tsuduki
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Publication number: 20160119564Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.Type: ApplicationFiled: September 29, 2015Publication date: April 28, 2016Inventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
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Publication number: 20160044796Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.Type: ApplicationFiled: August 3, 2015Publication date: February 11, 2016Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
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Patent number: 9253922Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.Type: GrantFiled: April 24, 2013Date of Patent: February 2, 2016Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
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Patent number: 9225882Abstract: A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane.Type: GrantFiled: February 25, 2014Date of Patent: December 29, 2015Assignee: Canon Kabushiki KaishaInventors: Takamasa Sakuragi, Takanori Suzuki, Koji Tsuduki
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Patent number: 9220172Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.Type: GrantFiled: April 24, 2013Date of Patent: December 22, 2015Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
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Patent number: 9209330Abstract: A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a second member fixed to the first member to cover the semiconductor chip, includes adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive, and generating a stress between the first member and the second member, after the adhesive starts to cure, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive.Type: GrantFiled: June 26, 2013Date of Patent: December 8, 2015Assignee: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Yasushi Kurihara