Abstract: A brush scrubbing apparatus is made up of a wafer holder which retains a wafer, a brush which removes a particle on the wafer, a driver which rotates at least one of the wafer holder and the wafer, an alignment mechanism which defines a relative position between the brush and the wafer holder, and controller which controls the alignment mechanism responding to a driving power supply voltage in the driver. The brush scrubbing apparatus can precisely get the reference position for deciding the pushing distance without using the eye measurement.

Abstract: Disclosed herein is a semiconductor wafer cleaning method using a semiconductor wafer cleaning device. The method includes providing a semiconductor wafer cleaning device with a back brush, bringing the back brush into contact with the entire lower surface of the semiconductor wafer, and cleaning an upper surface of the semiconductor wafer with a surface brush so as to clean the entire surface of the semiconductor wafer in an ever-horizontal state.

Abstract: A brush scrubbing apparatus is made up of a wafer holder which retains a wafer, a brush which removes a particle on the wafer, a driver which rotates at least one of the wafer holder and the wafer, an alignment mechanism which defines a relative position between the brush and the wafer holder, and controller which controls the alignment mechanism responding to a driving power supply voltage in the driver. The brush scrubbing apparatus can precisely get the reference position for deciding the pushing distance without using the eye measurement.

Abstract: A brush scrubbing apparatus is made up of a wafer holder which retains a wafer, a brush which removes a particle on the wafer, a driver which rotates at least one of the wafer holder and the wafer, an alignment mechanism which defines a relative position between the brush and the wafer holder, and controller which controls the alignment mechanism responding to a driving power supply voltage in the driver. The brush scrubbing apparatus can precisely get the reference position for deciding the pushing distance without using the eye measurement.

Abstract: A flame retardant resin composition comprising a mixture of:a) 10 to 70 parts by weight of an ethylene/(meth)acrylic ester copolymer;b) 30 to 90 parts by weight of a low crystalline ethylene/higher olefin copolymer;c) 0 to 30 parts by weight of an ethylene polymer selected from the group consisting of polyethylene and crystalline ethylene/.alpha.-olefin copolymers;d) 150 to 250 parts by weight, based on 100 parts by weight of the polymer components a), b) and c), of a metal hydroxide flame retardant; ande) 2 to 30 parts by weight of red phosphorus, anda flame retardant plastic optical fiber cable comprising a plastic optical fiber core and the above resin composition covering the plastic optical fiber core.

Abstract: In a method of corona discharge processing of resin formings surface, excellent corona discharge processing is possible, even if there is a distance between the resin formings and the discharge electrode, by generating a high voltage pulse having a pulse width of 1 .mu.s or more, an average electric field strength of 4 to 20 kv/cm denoted by applied voltage (wave height) versus interelectrode distance, and a pulse frequency of 10 pps or more. This processing is performed by the apparatus which comprises arranging a transfer conveyor to transfer the resin formings, a counter-electrode placed in a down side of the transfer conveyor, a dielectric to cover a surface of the counter-electrode, and a number of discharge electrodes which are arranged in a definite distance above the resin formings along the transfer route.

Abstract: To perform a corona discharge treatment, a high voltage needs to be impressed between a base electrode and a discharge electrode. One of the electrodes is linked to a high frequency and high voltage source, and the other electrode is grounded. When the electrode linked to the source is moved to be accommodated to a surface to be treated of an object, accidents of an electric shock or a short-circuit often result from an unexpected contact of the electrode on an operator or installation, or a troubles often result from spark or coming-part of contacts. In this invention, one of the electrodes is linked to the source and immovably arranged, while the other is grounded and is allowed to make the movement for accommodating the surface to be treated of the object and the discharge electrode to each other. According to the corona discharge treatment apparatus of this invention, such accidents as an electric shock or a short-circuit, etc., are foreclosed, and troubles are reduced.