Abstract: A system of an interconnected inverter includes an inverter that converts DC power from a DC power supply into AC power and provides AC power to an AC power line, an RDC that converts a voltage value obtained by a voltage sensor into electrical angle information that shows a phase angle of an output voltage, the voltage sensor obtaining a voltage value of an output voltage from the inverter to a power grid, and an ECU that controls the inverter to provide an alternating current in synchronization with an alternating current that flows through the AC power line by using timing at which an angle shown in the electrical angle information given from the RDC attains to a prescribed angle. Extra cost for diversion can be reduced.

Abstract: According to one embodiment, a display device includes a first substrate having a first transparent substrate and a pixel electrode, a second substrate having a second transparent substrate, a first common electrode, a second common electrode, and an insulating film disposed between the first common electrode and the second common electrode, and a liquid crystal layer. The first common electrode is disposed between the liquid crystal layer and the insulating film, and includes a first opening and a first electrode portion. The second common electrode is disposed between the insulating film and the second transparent substrate, and includes a second electrode portion overlapping the first opening.

Abstract: A display device is providing and includes first substrate including first transparent substrate, and pixel electrode disposed in each of pixels on first transparent substrate; second substrate including second transparent substrate having first and second side surfaces, and common electrode disposed over pixels; and liquid crystal layer disposed between first and second substrates and including stripe-shaped polymer and liquid crystal molecules.

Abstract: A display device includes a liquid crystal layer between a first substrate and a second substrate. The first substrate includes a wiring line and a pixel electrode. The liquid crystal layer includes a stripe-shaped polymer extending in a first direction and a liquid crystal molecule. The liquid crystal layer includes a first polymer in an area overlapping the wiring line and a second polymer in an area overlapping the pixel electrode. The first polymer includes a first portion extending in a direction different from the first direction. The second polymer includes a second portion extending in a direction different from the first direction. A density of the first portion is higher than a density of the second portion.

Abstract: Exemplary communication system 1 includes game devices 10, communication terminals 20, and game support server 30. Game devices 10 enable users to perform a multi-play activity. Each of communication terminals 20 runs an application associated with corresponding game device 10. Game support server 30 divides communication terminals 20 into separate communication groups in accordance with a situation of the multi-play activity performed by game devices 10 so that communication terminals 20 belonging to a same communication group can communicate with each other.

Abstract: An air-conditioning device includes: a heating cycle configured to circulate the heating medium through a heater core, the heater core being configured to heat blown air; an auxiliary heating device configured to heat the heating medium by an electric heater; a refrigeration cycle configured to circulate cooling medium discharged from a compressor through a condenser, the condenser being configured to heat the heating medium; refrigeration cycle control means configured to operate the refrigeration cycle such that temperature of the heating medium reaches target heating-medium temperature; auxiliary heating device control means configured to operate the auxiliary heating device such that the temperature of the heating medium reaches the target heating-medium temperature; and switching means configured to stop the operation of the refrigeration cycle in the state in which the temperature of the heating medium is equal to or higher than the threshold value.

Abstract: An air-conditioning device includes: a heating cycle configured to circulate the heating medium through a heater core, the heater core being configured to heat blown air; an auxiliary heating device configured to heat the heating medium by an electric heater; a refrigeration cycle configured to circulate cooling medium discharged from a compressor through a condenser, the condenser being configured to heat the heating medium; refrigeration cycle control means configured to operate the refrigeration cycle such that temperature of the heating medium reaches target heating-medium temperature; auxiliary heating device control means configured to operate the auxiliary heating device such that the temperature of the heating medium reaches the target heating-medium temperature; and switching means configured to stop the operation of the refrigeration cycle in the state in which the temperature of the heating medium is equal to or higher than the threshold value.

Abstract: An air-conditioning device includes: a compressor, an external heat exchanger, an evaporator, a fluid-cooled condenser, a thermostatic expansion valve, an internal heat exchanger, a fixed restrictor, a first flow-path switching valve, and a second flow-path switching valve configured to switch flow path of cooling medium so as to bypass the fluid-cooled condenser and the fixed restrictor at cabin-cooling operation time.

Abstract: A liquid heating device includes: a liquid circulation circuit configured to allow circulation of antifreezing fluid therethrough; an electric heater provided in the liquid circulation circuit, the electric heater being configured to heat the antifreezing fluid circulating through the liquid circulation circuit; and a controller serving as a controlling unit configured to control output of the electric heater. The controller restricts the output of the electric heater when viscosity of the antifreezing fluid exceeds a predetermined threshold viscosity.

Abstract: A wafer separating apparatus can separate a plurality of wafers bonded to a slicing base with an adhesive from the slicing base. The apparatus includes: a water tank configured to store therein water; a retainer configured to retain the slicing base; a first nozzle configured to apply a jet of water to side of a wafer of the wafers; and a tray configured to contain a wafer separated from the slicing base, wherein the tray is disposed inside the water tank.

Abstract: A wafer separating apparatus can separate a plurality of wafers bonded to a slicing base with an adhesive from the slicing base. The apparatus includes: a water tank configured to store therein water; a retainer configured to retain the slicing base; a first nozzle configured to apply a jet of water to side of a wafer of the wafers; and a tray configured to contain a wafer separated from the slicing base, wherein the tray is disposed inside the water tank.

Abstract: A mounting structure of the present invention includes a semiconductor element 101, a circuit board 301 having electrodes 302 opposed to electrodes 102 of the semiconductor element 101, and conductive two-layer bumps 213. Second bumps 210 joined to the electrodes 302 of the circuit board 301 are formed larger than first bumps 209 joined to the electrodes 102 of the semiconductor element 101. The axis of the first bump 209 and the axis of the second bump 210 are not aligned with each other.

Abstract: A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.

Abstract: A mounting structure of the present invention includes a semiconductor element 101, a circuit board 301 having electrodes 302 opposed to electrodes 102 of the semiconductor element 101, and conductive two-layer bumps 213. Second bumps 210 joined to the electrodes 302 of the circuit board 301 are formed larger than first bumps 209 joined to the electrodes 102 of the semiconductor element 101. The axis of the first bump 209 and the axis of the second bump 210 are not aligned with each other.

Abstract: An air conditioning system includes a heat-pump type cooling unit and an air-heating unit. On a first circulation path in the cooling unit, provided are a gas-liquid separator provided between an expansion valve and an evaporator for separating refrigerant supplied from the expansion valve into refrigerant gas and refrigerant liquid and sending the refrigerant liquid to the evaporator, a bypass path for flowing the refrigerant gas through the first circulation path with bypassing the evaporator, and a changeover valve for preventing the refrigerant liquid from flowing into the evaporator. In warming-up mode, only the refrigerant gas is circulated in a refrigeration cycle. According to the system, air-heating can be achieved by driving the cooling unit even under a condition where outside temperature is very low.

Abstract: An air conditioning system comprises a compressor 2 which compresses a refrigerant made of carbon dioxide, a radiator 4 which radiates heat of the refrigerant compressed by the compressor 2, an expansion valve 5 which decompresses the refrigerant which dissipated heat by the radiator 4 and which can control a refrigerant pressure on the outlet side of the radiator 4, an evaporator 7 which evaporates the refrigerant decompressed by the expansion valve 5, a sensor 13 which detects temperatures of a surface of a pipe through which a high pressure refrigerant on the outlet side of the radiator passes, and a control apparatus 23 which calculates a target refrigerant pressure on the outlet side of the radiator 4 based on a value detected by the sensor to control the expansion valve 5. The control apparatus corrects the target refrigerant pressure on the outlet side of the radiator 4 corresponding to refrigerant temperatures.

Abstract: In an air conditioning system having a variable displacement compressor driven by an engine of a vehicle, method and device for controlling a refrigeration cycle are provided to ensure necessary cooling performance of the system without damaging the traveling performance of the vehicle. In the method, a limit value in the discharge rate of the variable displacement compressor is determined by an engine speed or a variable related to the engine speed. The variable displacement compressor is controlled on the basis of the limit value.

Abstract: A controller (117) for an air conditioner using a refrigerant as a heat source is constructed such that, when a refrigerant temperature detected by a refrigerant temperature sensor (116) has reached a specified value, air with a volume of normal setting is blown into a vehicle compartment, and when the refrigerant temperature has not reached the specified value, air blowing into the vehicle compartment by a blower fan (107) is limited.

Abstract: A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.

Abstract: An air conditioner includes: a compressor configured to compress a refrigerant; an outside heat exchanger configured to make the compressed refrigerant radiate heat; a pressure reducing unit configured to reduce the pressure of the heat-radiated refrigerant; an inside heat exchanger configured to vaporize the pressure-reduced refrigerant; a discharge pressure detector configured to detect a discharge pressure of the refrigerant discharged from the compressor; a controller configured to provide a duty factor according to the detected discharge pressure; and a control valve configured to adjust a discharge capacity of the compressor according to the provided duty factor. During a start-up operation of the compressor, the controller controls the duty factor provided to the control valve so that the discharge pressure detected by the discharge pressure detector is maintained within a predetermined range and so that the duty factor reaches a maximum system duty factor.