Patents by Inventor Kojiro Okawa

Kojiro Okawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020152690
    Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m&mgr; are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.
    Type: Application
    Filed: April 16, 2002
    Publication date: October 24, 2002
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuhito Fujii, Masahisa Yamaguchi, Takaki Miyachi, Kojiro Okawa, Yasuki Suzuura
  • Publication number: 20020134026
    Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m&mgr; are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.
    Type: Application
    Filed: January 23, 2002
    Publication date: September 26, 2002
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuhito Fujii, Masahisa Yamaguchi, Takaki Miyachi, Kojiro Okawa, Yasuki Suzuura
  • Patent number: 6398826
    Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m&mgr; are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: June 4, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuhito Fujii, Masahisa Yamaguchi, Takaki Miyachi, Kojiro Okawa, Yasuki Suzuura
  • Patent number: 6165061
    Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m.mu. are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: December 26, 2000
    Assignee: Dai Nippon Printing Co.
    Inventors: Kazuhito Fujii, Masahisa Yamaguchi, Takaki Miyachi, Kojiro Okawa, Yasuki Suzuura