Patents by Inventor Kok Hua Lee

Kok Hua Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket connector for connection lead of semiconductor device under test with tester
    Patent number: 8174279
    Abstract: A socket connector for electrically connecting a lead of a semiconductor device under test (DUT) with a tester includes a container having a chamber, a conductive end or plug that seals the chamber at one end, and a conductive membrane that seals the chamber at another end. A liquid conductive material fills the chamber. The conductive plug is arranged to be in electrical contact with the tester. The lead of the semiconductor DUT is in electrical contact with the conductive membrane and thus with the tester via the conductive membrane, the liquid conductive material and the conductive plug.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: May 8, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Kok Hua Lee, Zi Yi Lam, Wai Khuin Phoon
  • Burn-in system for electronic devices
    Patent number: 8008934
    Abstract: A burn-in system (10) includes an enclosure (12) defining a burn-in chamber (14). The enclosure (12) is configured to be mounted on a burn-in board (34) over a burn-in socket (36). A heating element (16) is configured to generate heat within the burn-in chamber (14) and a temperature sensor (18) is configured to sense a temperature within the burn-in chamber (14). An opening (24) is formed in the enclosure (12) for receiving a fluid (26). A controller (20) is configured to control the heating element (16) and fluid flow into the enclosure (12) in response to the temperature sensed by the temperature sensor (18).
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: August 30, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Wei Ping Wong, Chee Keong Chiew, Kok Hua Lee
  • SOCKET CONNECTOR FOR CONNECTION LEAD OF SEMICONDUCTOR DEVICE UNDER TEST WITH TESTER
    Publication number: 20110043234
    Abstract: A socket connector for electrically connecting a lead of a semiconductor device under test (DUT) with a tester includes a container having a chamber, a conductive end or plug that seals the chamber at one end, and a conductive membrane that seals the chamber at another end. A liquid conductive material fills the chamber. The conductive plug is arranged to be in electrical contact with the tester. The lead of the semiconductor DUT is in electrical contact with the conductive membrane and thus with the tester via the conductive membrane, the liquid conductive material and the conductive plug.
    Type: Application
    Filed: August 21, 2009
    Publication date: February 24, 2011
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Kok Hua LEE, Zi Yi LAM, Wai Khuin PHOON
  • BURN-IN SYSTEM FOR ELECTRONIC DEVICES
    Publication number: 20100315109
    Abstract: A burn-in system (10) includes an enclosure (12) defining a burn-in chamber (14). The enclosure (12) is configured to be mounted on a burn-in board (34) over a burn-in socket (36). A heating element (16) is configured to generate heat within the burn-in chamber (14) and a temperature sensor (18) is configured to sense a temperature within the burn-in chamber (14). An opening (24) is formed in the enclosure (12) for receiving a fluid (26). A controller (20) is configured to control the heating element (16) and fluid flow into the enclosure (12) in response to the temperature sensed by the temperature sensor (18).
    Type: Application
    Filed: June 10, 2009
    Publication date: December 16, 2010
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Wei Ping Wong, Chee Keong Chiew, Kok Hua Lee