Patents by Inventor KOK SEONG TEO

KOK SEONG TEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11881385
    Abstract: Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material that is attachable to the frame at specific points. The specific attachment points are spaced apart to produce an amount of flexibility based on a malleability of the metallic material. The amount of flexibility ranges from approximately 2.5 to approximately 4.5.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: January 23, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yueh Sheng Ow, Yuichi Wada, Junqi Wei, Kang Zhang, Ananthkrishna Jupudi, Sarath Babu, Kok Seong Teo, Kok Wei Tan
  • Patent number: 11557499
    Abstract: Methods and apparatus for protecting parts of a process chamber from thermal cycling effects of deposited materials. In some embodiments, a method of protecting the part of the process chamber includes wet etching the part with a weak alkali or acid, cleaning the part by bead blasting, coating at least a portion of a surface of the part with a stress relief layer. The stress relief layer forms a continuous layer that is approximately 50 microns to approximately 250 microns thick and is configured to preserve a structural integrity of the part from the thermal cycling of aluminum deposited on the part. The method may also include wet cleaning of the part with a heated deionized water rinse after formation of the stress relief layer.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: January 17, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yuichi Wada, Kok Wei Tan, Chul Nyoung Lee, Siew Kit Hoi, Xinxin Wang, Zheng Min Clarence Chong, Yaoying Zhong, Kok Seong Teo
  • Publication number: 20220122871
    Abstract: Methods and apparatus for protecting parts of a process chamber from thermal cycling effects of deposited materials. In some embodiments, a method of protecting the part of the process chamber includes wet etching the part with a weak alkali or acid, cleaning the part by bead blasting, coating at least a portion of a surface of the part with a stress relief layer. The stress relief layer forms a continuous layer that is approximately 50 microns to approximately 250 microns thick and is configured to preserve a structural integrity of the part from the thermal cycling of aluminum deposited on the part. The method may also include wet cleaning of the part with a heated deionized water rinse after formation of the stress relief layer.
    Type: Application
    Filed: October 16, 2020
    Publication date: April 21, 2022
    Inventors: Yuichi WADA, Kok Wei TAN, Chul Nyoung LEE, Siew Kit HOI, Xinxin WANG, Zheng Min Clarence CHONG, Yaoying ZHONG, Kok Seong TEO
  • Publication number: 20210335582
    Abstract: Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material that is attachable to the frame at specific points. The specific attachment points are spaced apart to produce an amount of flexibility based on a malleability of the metallic material. The amount of flexibility ranges from approximately 2.5 to approximately 4.5.
    Type: Application
    Filed: April 24, 2020
    Publication date: October 28, 2021
    Inventors: Yueh Sheng OW, Yuichi WADA, Junqi WEI, Kang ZHANG, Ananthkrishna JUPUDI, Sarath BABU, Kok Seong TEO, Kok Wei TAN
  • Publication number: 20200306931
    Abstract: Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle mounted to the manifold and configured to spray the atomized fluid in a divergent spray pattern such that the substrate surface is cleansed when impinged by spray from the at least one spray nozzle, wherein the at least one spray nozzle sprays the atomized fluid at a pressure of approximately 30 psi to approximately 2500 psi.
    Type: Application
    Filed: March 25, 2019
    Publication date: October 1, 2020
    Inventors: PRAYUDI LIANTO, PENG SUO, SHIH-CHAO HUNG, PIN GIAN GAN, CHUN YU TO, PERIYA GOPALAN, KOK SEONG TEO, LIT PING LAM, ANDY LOO, PANGYEN ONG, DAVID P. SURDOCK, KEITH YPMA, BRIAN WILLIAMS, SCOTT OSTERMAN, MARVIN L. BERNT, MUHAMMAD NORHAZWAN, SAMUEL GOPINATH, MUHAMMAD AZIM, GUAN HUEI SEE, QI JIE PENG, SRISKANTHARAJAH THIRUNAVUKARASU, ARVIND SUNDARRAJAN