Patents by Inventor Kok-Siang Ng

Kok-Siang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reference layer openings
    Patent number: 7804694
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: September 28, 2010
    Assignee: Intel Corporation
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan
  • REFERENCE LAYER OPENINGS
    Publication number: 20090126978
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Application
    Filed: January 13, 2009
    Publication date: May 21, 2009
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan
  • Reference layer openings
    Patent number: 7495929
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: February 24, 2009
    Assignee: Intel Corporation
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan
  • Ground plane having opening and conductive bridge traversing the opening
    Patent number: 7427718
    Abstract: Conductive bridges to traverse openings in ground planes, and methods of making the conductive bridges, are disclosed. In one aspect, an apparatus may include a ground plane, one or more openings defined in the ground plane, such as, for example, conjoined via openings and/or slots, and one or more conductive bridges coupled with the ground plane that traverse the one or more openings.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: September 23, 2008
    Assignee: Intel Corporation
    Inventors: Kok Siang Ng, Loo Howe Yin, Ahmad Jalaluddin Yusof
  • REFERENCE LAYER OPENINGS
    Publication number: 20080006439
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Application
    Filed: September 20, 2007
    Publication date: January 10, 2008
    Inventors: Kok-Siang Ng, King Keong Wong, Michael Ryan
  • Reference layer openings
    Patent number: 7292452
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: November 6, 2007
    Assignee: Intel Corporation
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan
  • Reference layer openings
    Publication number: 20050276030
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Application
    Filed: June 10, 2004
    Publication date: December 15, 2005
    Inventors: Kok-Siang Ng, King Wong, Michael Ryan