Patents by Inventor Koki Oitori

Koki Oitori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin compositions and premolded semiconductor packages
    Patent number: 6569532
    Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: May 27, 2003
    Assignees: Sony Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami, Koji Tsuchiya, Masato Kanari
  • Epoxy resin compositions and premolded semiconductor packages
    Publication number: 20020076558
    Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
    Type: Application
    Filed: November 20, 2001
    Publication date: June 20, 2002
    Applicant: Shin-Etsu Company Co., Ltd.
    Inventors: Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami, Koji Tsuchiya, Masato Kanari
  • Epoxy resin compositions and premolded semiconductor packages
    Publication number: 20010004651
    Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 21, 2001
    Inventors: Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami, Koji Tsuchiya, Masato Kanari