Patents by Inventor Kong Lee

Kong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240168093
    Abstract: The present invention relates to an apparatus and a method of predicting a low-voltage failure of a secondary battery.
    Type: Application
    Filed: June 17, 2022
    Publication date: May 23, 2024
    Applicants: LG Chem, Ltd., LG Chem, Ltd.
    Inventors: Changsun Kong, Sunmin Kim, Kyu Hwang Lee
  • Patent number: 11990924
    Abstract: A transformer-based amplifier, an operating method thereof, and devices including the same are disclosed. A millimeter wave amplifier includes a first transformer positioned on an input side of the millimeter wave amplifier, a second transformer positioned on an output side of the millimeter wave amplifier, and one or more of amplification stages positioned between the first transformer and the second transformer.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: May 21, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hui Dong Lee, Sunwoo Kong, Bong Hyuk Park, Seunghyun Jang, Seok Bong Hyun
  • Publication number: 20240162109
    Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 16, 2024
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke
  • Publication number: 20240162731
    Abstract: A battery charger according to one embodiment of the present disclosure includes a charging space in which an inserted battery is charged and a support space that supports the inserted battery. The battery charger includes a seating part on which the battery inserted into the charging space is seated, and a guide part that guides the position of the battery seated on the seating part. The guide part extends into the charging space from the support space, and is movable from the charging space toward the support space by an external force.
    Type: Application
    Filed: September 26, 2022
    Publication date: May 16, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Taeki Um, Seungjin Kong, Jung Hoon Lee
  • Publication number: 20240136482
    Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(?0)/log(?28 )) of the logarithm of the viscosity ((log(?0)) of the composite encapsulation material at the shear rate of 1×10?3 s?1 to the logarithm of the viscosity (log(??)) of the composite encapsulation material at the shear rate of 1×102 s?1 is 1.1-2.5.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 25, 2024
    Inventors: Deng Kong SOH, Wen Wan TAI, Yu-Chun LEE
  • Publication number: 20240076788
    Abstract: Disclosed are an oxidizing electrode, a water electrolysis device including the same and a method for manufacturing the same. According to exemplary embodiments of the present disclosure, there is provided an oxidizing electrode with improved performance at low loadings of noble metals, especially, ruthenium (Ru) and iridium oxide, in which a ruthenium (Ru) layer and an iridium oxide layer formed on a substrate by electrodeposition in a sequential order are supported by electrochemical reaction rather than physical bonding.
    Type: Application
    Filed: January 18, 2023
    Publication date: March 7, 2024
    Inventors: Hyun S. PARK, Jong Hyun JANG, Hee-Young PARK, Su Ji LEE, Sung Jong YOO, Jin Young KIM, Jimin KONG, Jin-ho OH, So Young LEE
  • Patent number: 11855608
    Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: December 26, 2023
    Assignee: RF360 SINGAPORE PTE. LTD.
    Inventors: Huan En Ku, Joo Shan Yam, Chee Kong Lee
  • Publication number: 20230326463
    Abstract: Learning means 81 generates a speaker embedding extracting neural network by learning a weighting factor so as to minimize a loss function indicating an error between a speaker label indicating a speaker of a voice signal and an output value output from an output layer, with respect to a neural network including an input layer that receives an input of the voice signal and the output layer that outputs the output value indicating a speaker of the voice signal. The speaker embedding extracting neural network includes a network that calculates a first accuracy from a feature in units of frames and calculates an average and a second accuracy of a posterior distribution from an average and an accuracy of a prior distribution and the feature and the first accuracy.
    Type: Application
    Filed: August 28, 2020
    Publication date: October 12, 2023
    Applicant: NEC Corporation
    Inventors: Aik Kong LEE, Takafumi Koshinaka
  • Patent number: 11487555
    Abstract: A system is configured to run jobs in Kubernetes based on PBS job inputs. The system may convert a PBS input, such as in the form of a PBS job command line input and/or a PBS job script, to a Kubernetes job configuration file. A Kubernetes system may then perform a job according to the Kubernetes job configuration file. Through implementation of the conversion process, PBS users can leverage the capabilities of Kubernetes to have jobs performed without having to know how to use Kubernetes.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: November 1, 2022
    Assignee: TENCENT AMERICA LLC
    Inventors: Matthew Chan, Chee-Kong Lee, Qiming Sun
  • Patent number: 11314536
    Abstract: The present disclosure discloses a method for obtaining optimal variational parameters of a ground state wavefunction for a Hamiltonian system. The method includes initializing a plurality of variational parameters and sending the variational parameters to a quantum computing portion to output a plurality of measurement results. The method includes transmitting the measurement results to a classical computing portion to update the plurality of variational parameters based on the plurality of measurement results and an update rule, and determining whether a measured energy satisfies a convergence rule. When the measured energy does not satisfy the convergence rule, the method includes sending the plurality of updated variational parameters to the quantum computing portion for a next iteration; and when the measured energy satisfies the convergence rule, the method includes obtaining a plurality of optimal variational parameters for the Hamiltonian system.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 26, 2022
    Assignee: TENCENT AMERICA LLC
    Inventors: Chee Kong Lee, Qiming Sun
  • Patent number: 11227806
    Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: January 18, 2022
    Assignee: Materion Corporation
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
  • Publication number: 20210382728
    Abstract: A system is configured to run jobs in Kubernetes based on PBS job inputs. The system may convert a PBS input, such as in the form of a PBS job command line input and/or a PBS job script, to a Kubernetes job configuration file. A Kubernetes system may then perform a job according to the Kubernetes job configuration file. Through implementation of the conversion process, PBS users can leverage the capabilities of Kubernetes to have jobs performed without having to know how to use Kubernetes.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 9, 2021
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Matthew Chan, Chee-Kong Lee, Qiming Sun
  • Publication number: 20210313957
    Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.
    Type: Application
    Filed: August 31, 2020
    Publication date: October 7, 2021
    Inventors: Huan En Ku, Joo Shan Yam, Chee Kong Lee
  • Publication number: 20210011748
    Abstract: The present disclosure discloses a method for obtaining optimal variational parameters of a ground state wavefunction for a Hamiltonian system. The method includes initializing a plurality of variational parameters and sending the variational parameters to a quantum computing portion to output a plurality of measurement results. The method includes transmitting the measurement results to a classical computing portion to update the plurality of variational parameters based on the plurality of measurement results and an update rule, and determining whether a measured energy satisfies a convergence rule. When the measured energy does not satisfy the convergence rule, the method includes sending the plurality of updated variational parameters to the quantum computing portion for a next iteration; and when the measured energy satisfies the convergence rule, the method includes obtaining a plurality of optimal variational parameters for the Hamiltonian system.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 14, 2021
    Applicant: Tencent America LLC
    Inventors: Chee Kong LEE, Qiming SUN
  • Patent number: 10691169
    Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: June 23, 2020
    Assignee: APPLE INC.
    Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dale N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu
  • Patent number: 10479867
    Abstract: Method of producing super soft PAU core-shell copolymer dispersions is a solvent free process. The products have characteristics of both polyurethane and polyacrylate including being non-sticky, having a feeling of touching a peach when touching it by the hand, and having improved adhesion, tensile strength, and toughness.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: November 19, 2019
    Assignee: HO YU TEXTILE CO., LTD
    Inventors: Da-Kong Lee, Chin-Jen Jwo, Wun-Syu Zeng
  • Publication number: 20190298083
    Abstract: A furniture structure including: one or more generally vertical side panels; one or more shelf boards configured to extend from the one or more side panels; two electrical conductors coupled to a side panel of the furniture structure, to receive electrical power of differing polarity from a power supply; an electrical component coupled to a shelf board, wherein said electrical component includes two power terminals located at one end of the electrical component, the power terminals being accessible from a side surface of the shelf board; and wherein the electrical power is supplied to the electrical component via a direct physical contact between the power terminals of the electrical component and the two electrical conductors.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 3, 2019
    Inventors: Joshua Huang Min Lee, Jerry Wei Kong Lee, Chung Ming Chuo
  • Patent number: 10357841
    Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 23, 2019
    Assignee: MATERION CORPORATION
    Inventors: Ramesh Kothandapani, Chee Kong Lee
  • Publication number: 20190085135
    Abstract: Method of producing super soft PAU core-shell copolymer dispersions is a solvent free process. The products have characteristics of both polyurethane and polyacrylate including non-sticky, having a feeling of touching a peach when touching it by the hand, and improved adhesion, tensile strength, and toughness.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 21, 2019
    Applicant: HO YU TEXTILE CO., LTD.
    Inventors: Da-Kong Lee, Chin-Jen Jwo, Wun-Syu Zeng
  • Patent number: 10163743
    Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 25, 2018
    Assignee: MATERION CORPORATION
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin