Patents by Inventor Koshi Maemura

Koshi Maemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-sealed semiconductor device and method of manufacturing the same
    Patent number: 8253238
    Abstract: In a resin-sealed semiconductor device, an inner lead including a bend portion formed by lifting has a protruding shape located on one side and an inclined vertical surface shape located on the other side (inside) in an external connection terminal direction. A cutaway portion is provided along the bend portion and an external connection terminal. A height of an upper surface portion of the inner lead is higher than a height of an upper surface of a semiconductor element. The inner lead is provided in a substantially central portion of a die pad so that the inclined vertical surface shape is parallel to a side of a die pad which includes a thin portion located in a side surface portion and an exposure portion located on a bottom surface.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: August 28, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Masayuki Satoh, Koshi Maemura
  • RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110068442
    Abstract: In a resin-sealed semiconductor device, an inner lead including a bend portion formed by lifting has a protruding shape located on one side and an inclined vertical surface shape located on the other side (inside) in an external connection terminal direction. A cutaway portion is provided along the bend portion and an external connection terminal. A height of an upper surface portion of the inner lead is higher than a height of an upper surface of a semiconductor element. The inner lead is provided in a substantially central portion of a die pad so that the inclined vertical surface shape is parallel to a side of a die pad which includes a thin portion located in a side surface portion and an exposure portion located on a bottom surface.
    Type: Application
    Filed: September 15, 2010
    Publication date: March 24, 2011
    Inventors: Masayuki Satoh, Koshi Maemura