Abstract: A method for manufacturing an electronic device according to one embodiment includes forming a first electrode layer, forming a device functional portion, and forming a second electrode layer. At least one of the first electrode layer, one or a plurality of functional layers of the device functional portion, and the second electrode layer is formed by coating a base substrate containing a substrate with ink containing a material of the at least one layer from an inkjet printing device 24. The inkjet printing device includes an ink supply unit 30, an inkjet head 28, a flow path 38 of the ink, a drive unit 40, and a diaphragm type pressure adjusting mechanism 42 which is arranged between the drive unit and the inkjet head on the flow path. The ink satisfies at least one of a surface tension of 15 mN/m to 25 mN/m and a specific gravity of 1.5 or more.

Abstract: The present invention provides a positive resist composition comprising (A) at least one resin selected from the group consisting of {circle around (1)} resin which is itself insoluble or poorly soluble in an alkali aqueous solution but cause a chemical change by the action of an acid to become soluble in an alkali aqueous solution with a proviso that the resin is not novolak resin and {circle around (2)} alkali-soluble resin, (B) novolak resin containing protective group which can be dissociated by the action of an acid and (C) an acid generator.

Abstract: The present invention provides a resin which comprises a structural unit of the formula (I) wherein R1 represents alkylene having 1 to 4 carbon atoms, R2 represents alkyl having 1 to 4 carbon atoms, and R3 represents hydrogen or methyl, and also prvides a chemical amplification type positive resist composition comprising a resin defined above and an acid generator.

Abstract: An industrially excellent process for producing a poly(meth)acrylate having a reduced metal content which comprises contacting a mixture of a poly(meth)acrylate and an organic solvent with an acidic aqueous solution, such as an aqueous solution obtained by dissolving a polyprotic carboxylic acid having about 2 to 12 carbon atoms in water, is provided, and, by this invention, contents of metals such as sodium, potassium, iron and the like can be remarkably reduced.

Abstract: The present invention provides a chemical amplification type positive resist composition comprising (A) resin having a phenol skeleton wherein the phenol skeleton has protective group which can be dissociated by the action of an acid, the phenol skeleton itself is insoluble or poorly soluble in an alkali aqueous solution and the phenol skeleton becomes soluble in an alkali aqueous solution after dissociation of the protective group, (B) resin obtained by protecting a part of hydroxyl group in poly(p-hydroxystyrene) with pivaloyl group and (C) an acid generator.

Abstract: The present invention provides a positive resist composition comprising

Abstract: The present invention provides a chemical amplification type positive resist composition comprising

Abstract: An industrially excellent process for producing a poly(meth)acrylate having a reduced metal content which comprises contacting a mixture of a poly(meth)acrylate and an organic solvent with an acidic aqueous solution, such as an aqueous solution obtained by dissolving a polyprotic carboxylic acid having about 2 to 12 carbon atoms in water, is provided, and, by this invention, contents of metals such as sodium, potassium, iron and the like can be remarkably reduced.

Abstract: A photoresist composition which is particularly useful as a chemical amplification type photoresist is provided, wherein the photoresist composition contains a resin having a structural unit represented by the following formula (I): wherein R1, R2 ad R3 each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R4 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms and R5 represents a hydrogen atom, alkyl group or aryl group, or R4 and R5 join together to form a ring, which may be heterocyclic; and R6 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group.

Abstract: A photoresist composition comprising a resin having structural units represented by the following formulas (I), (II) and (III): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.11, R.sup.12, R.sup.13, R.sup.21, R.sup.22 and R.sup.23 each independently represents hydrogen or an alkyl; one of R.sup.14, R.sup.15 and R.sup.16 represents an aliphatic hydrocarbon residue and the rest each independently represents hydrogen or an aliphatic hydrocarbon residue, or two or three of R.sup.14, R.sup.15 and R.sup.16 form a hydrocarbon ring; and R represents a group cleavable by an action of an acid; and the photoresist composition affords excellent resolution, excellent profile and wide focus margin even on a substrate provided with an organic anti-reflective film.