Abstract: An image display device includes an adapter, and a housing section that engages with the adapter. The adapter is attached to a cable electrically connected to the image display device by holding part of the cable in a longitudinal direction thereof. The housing section defines a housing space capable of housing at least part of the adapter holding the cable and at least part of the part of the cable that is held by the adapter, and engages with the adapter.

Abstract: An interposer has a connection electrode formed on the insulating substrate surface, and a solder bump connects with the connection electrode. The insulating substrate surface is made rough where unevenness is formed, and the connection electrode peelable from the insulating substrate surface in a region with which the solder bump is connected by coating surface low active agent.

Abstract: A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.

Abstract: An interposer has a connection electrode formed on a surface of an insulating substrate, and a solder bump of a semiconductor chip connects to the connection electrode. The surface of the insulating substrate is roughened, and the connection electrode easily peels off from the surface of the insulating substrate. When thermal stress occurs between the semiconductor chip and the interposer, the thermal stress allows the connection electrode to peel off from the surface of the insulating substrate at the connection area with the solder bump to bring it into a floating state, and the thermal stress is absorbed due to elastic deformation of the connection electrode.

Abstract: Disclosed herein is a semiconductor device in which a semiconductor chip is bonded at its pad to an electrode of a circuit substrate via a coil spring by solder-connecting both ends of the spring respectively to the pad and the electrode. There is provided a material having low solder wettability that covers at least part of the surface of the coil spring, so that the solder is prevented from being sucked into the Interior of the coil spring.

Abstract: An interposer has a connection electrode formed on the surface of the insulating substrate, and a solder bump of a semiconductor chip connects with the connection electrode. The surface of the insulating substrate is made become a rough surface where unevenness is formed, and the connection electrode has a structure that it is easily peeled off from the surface of the insulating substrate in a region with which the solder bump is connected by coating surface low active agent. When thermal stress occurs between the semiconductor chip and the interposer based on the difference of coefficient of thermal expansion, the thermal stress allows the connection electrode to peel off from the surface of the insulating substrate at the connection area with the solder bump to bring it into a floating state, and the thermal stress is absorbed due to elastic deformation of the connection electrode.

Abstract: An interposer has a connection electrode formed on the surface of the insulating substrate, and a solder bump of a semiconductor chip connects with the connection electrode. The surface of the insulating substrate is made become a rough surface where unevenness is formed, and the connection electrode has a structure that it is easily peeled off from the surface of the insulating substrate in a region with which the solder bump is connected by coating surface low active agent. When thermal stress occurs between the semiconductor chip and the interposer based on the difference of coefficient of thermal expansion, the thermal stress allows the connection electrode to peel off from the surface of the insulating substrate at the connection area with the solder bump to bring it into a floating state, and the thermal stress is absorbed due to elastic deformation of the connection electrode.

Abstract: A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.

Abstract: A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.

Abstract: A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.