Abstract: A processor of an operation supporting device acquires pre-operation data including position information of a feature portion of an inside of a body cavity of a subject, which is generated before an operation, and a procedure in the operation, which is planned before the operation, and acquires an endoscope image generated in the operation. The processor generates real-time data including real-time position information of the feature portion of the inside of the body cavity, based at least on the pre-operation data and the endoscope image, and generates an image to be displayed on the endoscope image in a superimposed manner, based on the real-time data. The processor recognizes a real-time scene based at least on the procedure planned before the operation and the real-time data.

Abstract: A diaphragm valve includes a body (3) having a flow path (2), a seat (4) formed in the flow path (2), a metal diaphragm (5) for opening and closing the flow path (2), a pair of clamping parts (6) and (7) for claiming peripheral edge portions of the metal diaphragm (5) to fix the metal diaphragm (5) to the body (3), and an actuator (8) for abutting the metal diaphragm (5) to the seat (4) or separating the metal diaphragm from the seat (4), wherein a fluorine resin coating is formed on a seat side surface (5a) of the metal diaphragm (5) at least in a contact region (B-A) with the seat (4) in a region (C) surrounded by a clamping region (D-C) between the seat side surface (5a) and one of the pair of clamping portions (6, 7), excluding the clamping region (D-C).

Abstract: A developing roll for use in an image-forming apparatus using electrophotography includes a cylindrical core made of metal; an annular elastic layer made of rubber and arranged around the core; and an annular surface layer arranged around the elastic layer. The surface layer includes a central portion and end portions. The central portion is located at the center of the developing roll in the longitudinal direction, the end portions are located at opposite end portions of the developing roll in the longitudinal direction. A coefficient of kinetic friction of the outer peripheral surface of each end portion of the surface layer is less than or equal to 0.1, and a ten-point average roughness Rz of the outer peripheral surface of each end portion of the surface layer is less than or equal to 1.8 ?m.

Abstract: A refrigeration cycle apparatus includes a main circuit and a bypass circuit. The main circuit includes: a compressor; a first condenser; a first refrigerant-to-refrigerant heat exchanger; a first expansion device; a first branching portion; a first evaporator; a third branching; and a fourth branching portion. The bypass includes: a second expansion device; the first refrigerant-to-refrigerant heat exchanger; and a second branching portion. The second branching portion includes a liquid outflow pipe and a gas outflow pipe. The liquid outflow pipe defines one outlet for the refrigerant and is located below the gas outflow pipe. The gas outflow pipe defines another outlet for the refrigerant and is located above the liquid outflow pipe. The one outlet of the second branching portion communicates with the third branching portion. The other outlet of the second branching portion communicates with the fourth branching portion.

Abstract: An electronic device has a primary coil 10; a secondary coil 20 disposed to face the primary coil 10; a primary-side electronic element 110 electrically connected to the primary coil 10; and a secondary-side electronic element 210 electrically connected to the secondary coil 20. The primary coil 10 has a primary-side first coil 10a that is provided on another side of the secondary coil 20, and a primary-side second coil 10b that is provided on one side of the primary-side first coil 10a. A connecting part 19 connecting the primary-side first coil 10a and the primary-side second coil 10b is provided and passes through a space of the secondary coil 20.

Abstract: A developing roll has a metal core, an elastic layer, and a surface layer. A value X is 65.6 N/mm3 or more and a value Y is 229 ?m or more. The value X is P1/(D1×A)?P2/(D2×A). P1 is the load to displace the roll 100 ?m when a metal probe is pressed against the roll. D1 is the displacement of the roll caused by the probe under the load P1. A is the area of the probe. P2 is the load to displace a material roll by 100 ?m when the probe presses against the material roll with the core and the elastic layer and without the surface layer. D2 is the displacement of the material roll caused by the probe under the load P2. The value Y is the displacement of the roll when the probe pierces the surface layer.

Abstract: A refrigeration cycle device with a main circuit, a bypass circuit and a supercooling heat exchanger further includes: a controller to control an opening degree of the bypass expansion valve; a first sensor to detect a temperature at the refrigerant inflow side of the evaporator; and a second sensor to detect a pressure of the non-azeotropic mixed refrigerant flowing from the evaporator, wherein the controller controls the opening degree of the bypass expansion valve using temperatures of the evaporator, that is, the temperature at the refrigerant inflow side and a saturated gas temperature of the non-azeotropic mixed refrigerant calculated from the pressure so as to adjust a flow rate of the non-azeotropic mixed refrigerant flowing into the evaporator, to eliminate the temperature difference in the evaporator for suppressing uneven frost formation on the evaporator, and thus to prevent heat exchange performance from degrading.

Abstract: A developing roll used in an electrophotographic image forming apparatus has a metal core member, an elastic layer made of a rubber disposed around the core member, and a surface layer disposed around the elastic layer. The texture aspect ratio of the surface Str of the surface layer is equal to or greater than 0.55.

Abstract: A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that a tensile strength of the first insulating layer is higher than a tensile strength of each insulating layer other than the first insulating layer in the first build-up part, and the covering layer is formed such that the covering layer has opening entirely exposing an upper surface and a side surface of the first conductor pad.

Abstract: A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that an elongation rate of the first insulating layer is greater than an elongation rate of each insulating layer other than the first insulating layer in the build-up part, and the covering layer is formed such that the covering layer has an opening entirely exposing an upper surface and a side surface of the first conductor pad.

Abstract: An electronic module has a first substrate 11; a first electronic element 13 provided on one side of the first substrate 11; a first connection body 60 provided on the one side of the first electronic element 13; a second electronic element 23 provided on the one side of the first connection body 60; and a second connection body 70 provided on the one side of the second electronic element 23. The first electronic element 13 and the second electronic element 23 do not overlap in a plane direction.

Abstract: A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 ?m to 0.5 ?m, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.

Abstract: A wiring substrate includes an insulating layer including inorganic filler particles and resin, and a conductor layer including a metal film formed on a surface of the insulating layer and having a conductor pattern. The inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has a portion exposed on the surface of the insulating layer and is at least partially separated from the resin, the conductor layer is formed such that a part of the metal film is between the first inorganic filler particles and the resin from the surface of the insulating layer and that a distance between the surface of the insulating layer and the surface of the insulating layer at a deepest part of the part of the metal film is in the range of 0.1 ?m to 0.5 ?m.

Abstract: An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on a side of the first substrate 11 and a second terminal part 120 provided on a side of the second substrate 21. The first terminal part 110 has a first surface direction extending part 114 and a first normal direction extending part 113 extending toward one side or the other side. The second terminal part 120 has a second surface direction extending part 124 and a second normal direction extending part 123 extending toward one side or the other side. The second surface direction extending part 124 is provided on one side of the first surface direction extending part 114, and the first surface direction extending part 114 and the second surface direction extending part 124 overlap one another in a surface direction.

Abstract: An electronic module has an electronic element 210; a connection body 250 provided on a front face of the electronic element 210; and a detection part 100 having a winding wire part 10 provided so as to surround the connection body 250, and a winding return wire part 50 connected to a terminal end part of the winding wire part 10 and returns from the terminal end part toward a starting end part.

Abstract: There is provided a determination apparatus including: a result acquisition unit configured to acquire test results of tests on a plurality of items which are performed on a device under measurement; and a first determination unit configured to determine whether to retest a device under measurement that has failed the test, in which the first determination unit is configured to perform the determination based on reproducibility of the test results in a case where the tests have been performed on a plurality of devices under measurement multiple times in advance.

Abstract: An electronic module has a first substrate 11, an electronic element 13, 23 disposed on one side of the first substrate 11, a second substrate 21 disposed on one side of the electronic element 13, 23, a first coupling body 210 disposed between the first substrate 11 and the second substrate 21, a second coupling body 220 disposed between the first substrate 11 and the second substrate 21, and shorter than the first coupling body 210, and a sealing part 90 which seals at least the electronic element. The first coupling body 210 is not electrically connected to the electronic element. The second coupling body 220 is electrically connected to the electronic element 13, 23.

Abstract: An electronic module has a first electronic element 13, a first connector 60 provided in one side of the first electronic element 13, and having a first columnar part 62 extending to another side and a first groove part 64 provided in a one-side surface, and a second electronic element 23 provided in one side of the first connector 60 via a conductive adhesive agent provided inside a circumference of the first groove part 64. The first connector 60 has a first concave part 67 on one side at a position corresponding to the first columnar part 62.

Abstract: An electronic module has a first substrate 11; a second substrate 21 provided in one side of the first substrate 11; and a chip module 100 provided between the first substrate 11 and the second substrate 21. The chip module 100 has an electronic element 13, 23 and a connecting body 60, 70, 80 electrically connected to the electronic element 13, 23. The electronic element 13, 23 extends along a first direction that is a thickness direction of the electronic module.

Abstract: An electronic module has a first substrate 11; an electronic element 13, 23 provided on one side of the first substrate 11; a sealing part 90 that seals at least the electronic element 13, 23; a connection terminal 110 electrically connected to the electronic element 13, 23 and exposed from a side surface of the sealing part 90; and a stress relaxation terminal 150, which is not electrically connected to the electronic element 13, 23, exposed from the side surface of the sealing part 90.