Patents by Inventor Kosuke MIYAMOTO

Kosuke MIYAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939466
    Abstract: Provided is a thermoplastic polyester resin composition comprising 100 parts by weight of (A) a non-liquid crystal thermoplastic polyester resin, 45 to 150 parts by weight of (B) a thermoplastic resin that is different from the non-liquid crystal thermoplastic polyester resin and has a dielectric loss tangent of not more than 0.005 when measured at a frequency of 5.8 GHz by the cavity resonance perturbation method, 2 to 20 parts by weight of (C) a compatibilizer having at least one reactive functional group selected from epoxy, acid anhydride, oxazoline, isocyanate, and carbodiimide groups, and 0.2 to 5 parts by weight of (D) at least one compound selected from tertiary amines, amidine compounds, organic phosphines and salts thereof, imidazoles, and boron compounds, wherein the ratio of the sum of the thermoplastic resin (B) and the compatibilizer (C) is in the range of 50 to 150 parts by weight and the weight ratio (B)/(C) of the thermoplastic resin (B) to the compatibilizer (C) is in the range of 8 to 50.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: March 26, 2024
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kohei Miyamoto, Yusuke Tojo, Makito Yokoe, Kosuke Shirotani, Yasuo Maeda
  • Patent number: 11280301
    Abstract: An intake device of an engine comprises an intercooler, an intake passage including a downstream-side intake passage, and an EGR passage recirculating exhaust gas to the downstream-side intake passage. An intake-air supply opening having an opening area smaller than an area of a downstream-side face of an intercooler core is provided at a downstream side wall of a chamber. The downstream-side intake passage includes an extension passage portion extending upwardly along the downstream side wall. The intake-air supply opening includes an upper edge portion which separates the intake air flowing from an inside wall face of the extension passage portion and forms flowing main streams of the intake air inside the extension passage portion. EGR introduction ports are arranged at positions capable of supplying the EGR gas toward the flowing main streams.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 22, 2022
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Yoshihiro Hamazume, Takashi Yoshikawa, Jiro Kato, Taketoshi Yamauchi, Hirofumi Shinohara, Kazuhiro Nakamura, Yoko Inami, Shouichi Aiga, Tomoaki Fujiyama, Kosuke Miyamoto, Takuya Yamada
  • Publication number: 20210222653
    Abstract: An intake device of an engine comprises an intercooler, an intake passage including a downstream-side intake passage, and an EGR passage recirculating exhaust gas to the downstream-side intake passage. An intake-air supply opening having an opening area smaller than an area of a downstream-side face of an intercooler core is provided at a downstream side wall of a chamber. The downstream-side intake passage includes an extension passage portion extending upwardly along the downstream side wall. The intake-air supply opening includes an upper edge portion which separates the intake air flowing from an inside wall face of the extension passage portion and forms flowing main streams of the intake air inside the extension passage portion. EGR introduction ports are arranged at positions capable of supplying the EGR gas toward the flowing main streams.
    Type: Application
    Filed: November 9, 2020
    Publication date: July 22, 2021
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Yoshihiro HAMAZUME, Takashi YOSHIKAWA, Jiro KATO, Taketoshi YAMAUCHI, Hirofumi SHINOHARA, Kazuhiro NAKAMURA, Yoko INAMI, Shouichi AIGA, Tomoaki FUJIYAMA, Kosuke MIYAMOTO, Takuya YAMADA
  • Publication number: 20150053239
    Abstract: According to one embodiment, a wafer carrier cleaning method is provided. The wafer carrier cleaning method includes cleaning a wafer carrier with a chemical solution containing a weak acid that can dissolve metals, and cleaning the wafer carrier cleaned with the chemical solution, with pure water. The weak acid contained in the chemical solution is preferably citric acid that can dissolve heavy metals and does not damage the wafer carrier.
    Type: Application
    Filed: February 28, 2014
    Publication date: February 26, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yasushige ABE, Hidekazu TANIGUCHI, Masanobu KIBE, Kosuke MIYAMOTO