Abstract: In a method for manufacturing a multilayer substrate, conductive patterns to define mounting electrodes are formed on a principal surface of a first base layer, and conductive patterns are formed on principal surfaces of other base layers. The base layers are stacked such that the principal surface of the first base layer is the outermost surface. The stacked base layers are laminated by pressing an elastic body to the side of the first base layer to form a multilayer body. In the multilayer body, the conductive patterns are arranged such that the proportion of the conductive patterns in regions overlapping the conductive patterns on the first base layer as viewed in the stacking direction is lower than that in a region surrounding the regions overlapping the conductive patterns.

Abstract: An electromagnet includes a stacked body formed by stacking and thermocompression-bonding a plurality of insulating base materials having thermoplasticity and including wound linear conductors which define a spiral coil. In a region of each of the insulating base materials surrounded by each of the wound linear conductors, each of low mobility members is formed of a material having mobility lower than that of the insulating base materials at a temperature upon thermocompression-bonding of the insulating base materials.

Abstract: In a linear conductor forming step, a wide portion having a relatively large line width and a narrow portion having a relatively small line width are formed in each of a plurality of linear conductors. In addition, in a multilayer board, in base material layers adjacent to each other in a stacking direction, the wide portion overlaps the narrow portion on the adjacent base material layer, and end portions of the wide portions at both sides of the narrow portion in a line width direction, in a planar view. The wide portions are disposed such that the end portions thereof overlap each other in the stacking direction and resistance of a fluid thermoplastic resin increases. The narrow portion is located between the wide portions in the stacking direction.

Abstract: An electromagnet that increases electromagnetic force involved with a current flowing through a coil includes a stacked body including a plurality of base material layers, a coil including an in-plane coil conductor on one main surface of each of the base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the in-plane coil conductor on each of the base material layers in a plan view.

Abstract: A process cartridge including a first frame member molded by pouring a resin from a gate; a conductive sheet adhered integrally to a sheet adhering portion of the first frame member by molding of the resin; and a second frame member configured to define a toner storage portion by being coupled with the first frame member, wherein, the first frame member includes a bent portion at the sheet adhering portion, and a portion of the first frame member different in thickness is provided at an adjacent position to the adhering portion.

Abstract: An electroconductive paste that contains an Ag powder, glass frit and an organic vehicle. The glass frit is of non-lead type and contains at least B, Bi and Si and the molar ratio of B to Si is 0.4 or less, and the molar content of Bi in the glass frit is 20 to 30 mol %, and a D90 diameter of the glass frits is 5 ?m or less. A light-receiving surface electrode is formed using this electroconductive paste on a surface of a semiconductor substrate to form a solar cell.

Abstract: A photosensitive glass paste that can be fired at a low temperature for a short period of time and that can suppress generation of voids and diffusion of Ag in glass layers formed by firing, and a high-performance multilayer wiring chip component manufactured by using the above photosensitive glass paste are provided. As a sintering aid glass which is combined with a ceramic aggregate and a primary glass, a glass having a contact angle to the ceramic aggregate smaller than that of the primary glass to the ceramic aggregate is used, and the content of the sintering aid glass is set to 5 to 10 percent by volume of the inorganic component. As the sintering aid glass, a glass containing SiO2, B2O3, CaO, Li2O, and ZnO at a predetermined ratio is preferably used. As the primary glass, a glass containing 70 to 90 percent by weight of SiO2, 15 to 20 percent by weight of B2O3, and 1 to 5 percent by weight of K2O can be used.

Abstract: A photosensitive glass paste that can be fired at a low temperature for a short period of time and that can suppress generation of voids and diffusion of Ag in glass layers formed by firing, and a high-performance multilayer wiring chip component manufactured by using the above photosensitive glass paste are provided. As a sintering aid glass which is combined with a ceramic aggregate and a primary glass, a glass having a contact angle to the ceramic aggregate smaller than that of the primary glass to the ceramic aggregate is used, and the content of the sintering aid glass is set to 5 to 10 percent by volume of the inorganic component. As the sintering aid glass, a glass containing SiO2, B2O3, CaO, Li2O, and ZnO at a predetermined ratio is preferably used. As the primary glass, a glass containing 70 to 90 percent by weight of SiO2, 15 to 20 percent by weight of B2O3, and 1 to 5 percent by weight of K2O can be used.