Abstract: Each of first electrode sections forming a transmission electrode includes a first main line and a plurality of first auxiliary lines. Each of second electrode sections forming a reception electrode includes a second main line and a plurality of second auxiliary lines. With the transmission and reception electrodes and overlapping each other, the first main line and the second main line intersect with each other at one point, and a cell region is unclosed. The cell region is surrounded by two or more types of thin wires selected from a group consisting of the first main line, the first auxiliary lines, the second main line, and the second auxiliary lines.

Abstract: In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

Abstract: A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.

Abstract: A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.

Abstract: A dedicated correction value related to the mounting position of an upper surface recognition component with a characteristic section on an upper surface thereof is memorized in correction value folder 43a of an HDD, and when performing mounting work of mounting the upper surface recognition component on a board, a position deviation amount of the characteristic section is acquired based on an image of the upper surface of the upper surface recognition component captured by a mark camera, and the component is mounted at the mounting position based on the acquired position deviation amount and the dedicated correction value. Accordingly, it is possible to mount the specific component at a corrected mounting position such that the position of the characteristic section is appropriate, thereby improving mounting accuracy for the upper surface recognition component.

Abstract: In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

Abstract: A dedicated correction value related to the mounting position of an upper surface recognition component with a characteristic section on an upper surface thereof is memorized in correction value folder 43a of an HDD, and when performing mounting work of mounting the upper surface recognition component on a board, a position deviation amount of the characteristic section is acquired based on an image of the upper surface of the upper surface recognition component captured by a mark camera, and the component is mounted at the mounting position based on the acquired position deviation amount and the dedicated correction value. Accordingly, it is possible to mount the specific component at a corrected mounting position such that the position of the characteristic section is appropriate, thereby improving mounting accuracy for the upper surface recognition component.