Patents by Inventor Kotaro Hirayama

Kotaro Hirayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-bonding method
    Patent number: 5123989
    Abstract: Disclosed herein is a method for bonding a resin part, which comprises disposing a magnetic complex composed of a resin and magnetic particles as a heating-medium at the resin parts to be bonded, and applying an alternating magnetic field to the heating-medium by using a magnetic field generating means composed of an electromagnetic core and an exciting coil, thereby making said heating-medium generate heat for fuse-bonding said resins.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: June 23, 1992
    Assignees: Toda Kogyo Corporation, Dai-ichi High Frequency Company Limited
    Inventors: Nanao Horiishi, Kotaro Hirayama, Masanori Terasaki, Tetsuro Toda, Shigeru Takaragi