Abstract: Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet (1) contains a copper particle (2) and a solvent (3) having a boiling point of 150° C. or higher, in which the copper particle (2) has a surface covered with an organic protective film, the content ratio of the copper particle (2) to the solvent (3) is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle (2) is in the range of 50 nm to 300 nm both inclusive.

Abstract: This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

Abstract: A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150° C., gases generated in heating at 100° C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

Abstract: The joined structure of the present invention is a joined structure in which a substrate having a circuit pattern and a member to be joined including an electrode terminal are joined together via a conductive joining material. When a contact area between the circuit pattern and the conductive joining material is defined as X, a contact area between the electrode terminal and the conductive joining material is defined as Y, and a thermal conductivity of the conductive joining material is defined as ?, the joined structure satisfies the following Formula (1), SQRT(X)/SQRT(Y)?2.9209×??0.141??(1).

Abstract: The invention provides a power module substrate with a heat sink, which includes a power module substrate provided with an insulating substrate, a circuit layer provided on one surface of the insulating substrate and a metal layer provided on the other surface of the insulating substrate. The heat sink is bonded to the power module substrate via a bonding layer (30) to a surface on an opposite side to the insulating substrate of the metal layer. Bonding layer is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and having a thickness in a range of 10 ?m or more and 500 ?m or less.

Abstract: This sintered porous silver film is obtained by sintering silver particles, wherein a crystallite size is 60 nm to 150 nm, a ratio of a detected amount of C3H7+ ions to a detected amount of Ag+ ions which are measured by time-of-flight secondary ion mass spectrometry is 0.10 to 0.35, and a ratio of a detected amount of C2H? ions to the detected amount of Ag? ions which are measured by time-of-flight secondary ion mass spectrometry is 0.9 to 3.7.

Abstract: A power module substrate with a heat sink (10) includes a power module substrate (20) provided with an insulating substrate (21), a circuit layer (22) provided on one surface of the insulating substrate (21) and a metal layer (23) provided on the other surface of the insulating substrate (21); and a heat sink (40) bonded via a bonding layer (30) to a surface on an opposite side to the insulating substrate (21) of the metal layer (23) of the power module substrate (20), in which the bonding layer (30) is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and has a thickness in a range of 10 ?m or more and 500 ?m or less.

Abstract: A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150° C., gases generated in heating at 100° C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

Abstract: Selected is a composition containing a silver powder generating gaseous carbon dioxide, acetone vapor, and water vapor in a case where the silver powder is heated at 100° C., a stress relaxation body having a Young's modulus lower than a Young's modulus of a sintered body of the silver powder, and a solvent, in which a particle size distribution of primary particles of the silver powder has a first peak in a range of a particle size of 20 to 70 nm and a second peak in a range of a particle size of 200 to 500 nm, an organic substance in the silver powder is decomposed by 50% by mass or more at 150° C., and a mass ratio between the silver powder and the stress relaxation body is 99:1 to 60:40.

Abstract: The silver powder related to the present invention is produced by reducing silver carboxylate. The particle size distribution of primary particles includes the first peak of a particle size in the range of 20 nm to 70 nm and the second peak of a particle size in the range of 200 nm to 500 nm. The organic matters are decomposed in an extent of 50 mass % or more at 150° C., and gases generated in heating at 100° C. are gaseous carbon dioxide, evaporated acetone and evaporated water.