Abstract: A printed circuit board includes a first mark 2 formed by a thin conductor, a second mark 3 formed by a resist 8, a land 6 which is partially coated by the resist 8 and a land 7 which is not coated by the resist 8. The second mark 3 is formed when the land 6 is partially coated by the resist 8. A device 4, which corresponds to the land 6, is mounted at a position apart from a center 02 of the second mark 3 by a predetermined distance L1. A device 5, which corresponds to the land 7, is mounted at a position apart from a center 01 of the first mark 2 by a predetermined distance L2. Therefor, the devices 4, 5 can be properly mounted on the printed circuit board 1 in spite of a positional error of the resist 8.

Abstract: A printed circuit board includes a first mark 2 formed by a thin conductor, a second mark 3 formed by a resist 8, a land 6 which is partially coated by the resist 8 and a land 7 which is not coated by the resist 8. The second mark 3 is formed when the land 6 is partially coated by the resist 8. A device 4, which corresponds to the land 6, is mounted at a position apart from a center O2 of the second mark 3 by a predetermined distance L1. A device 5, which corresponds to the land 7, is mounted at a position apart from a center O1 of the first mark 2 by a predetermined distance L2. Therefor, the devices 4, 5 can be properly mounted on the printed circuit board 1 in spite of a positional error of the resist 8.

Abstract: A printed circuit board includes a plurality of lands thereon. The size D2 of the outer land 3 in the direction along the outside array is less than the size D1 of the inner land 1 in the direction along the inside array. Therefore, it is possible to pass the pattern 4 with enough clearance against the outer land 3. The outer lands 3 are formed with an oval, elliptical or oblong shape. Namely, the size D3 of the outer land 3 in the direction perpendicular to the direction of the outside array is greater than the size D2. Then, it is possible to ensure a sufficient reliability of a soldered part. Preferably, the connected area 5 between the inner land 1 and the pattern 4 and the connected area 7 between the outer land 3 and the pattern 6 are formed as a shape of a tear-drop. Then, the patterns 4, 6 cannot be easily cut by a thermal stock or a heat cycle. The solder resist 8 is coated, around the outer land 3, from an outer area to an inner area of the outer land 3, except for the central area 3A.

Abstract: A printed circuit board includes a first mark 2 formed by a thin conductor, a second mark 3 formed by a resist 8, a land 6 which is partially coated by the resist 8 and a land 7 which is not coated by the resist 8. The second mark 3 is formed when the land 6 is partially coated by the resist 8. A device 4, which corresponds to the land 6, is mounted at a position apart from a center 02 of the second mark 3 by a predetermined distance L1. A device 5, which corresponds to the land 7, is mounted at a position apart from a center 01 of the first mark 2 by a predetermined distance L2. Therefor, the devices 4, 5 can be properly mounted on the printed circuit board 1 in spite of a positional error of the resist 8.

Abstract: A multilayered substrate divisible into a plurality of parts at predetermined positions of division is configured such that intermittently formed perforation-like holes or slit-like holes are present at the positions of division of a core layer. Further, V-cut V-grooves are present at the positions of division of surface layers. The multilayered substrate, divisible at predetermined positions of division, is also configured such that first intermittently formed holes (perforation-like holes, slit-like holes, or widely spaced holes) are present at the positions of division of the core layer. Further, second intermittently formed holes (perforation-like holes, or slit-like holes) are present at the positions of division of the surface layers so as to pass through the multilayered substrate. At the positions of division of the core layer, each of the second holes is located between the adjacent first holes, whereby the first holes and the second holes are continuous with each other.

Abstract: A multilayered substrate divisible into a plurality of parts at predetermined positions of division is configured such that intermittently formed perforation-like holes or slit-like holes are present at the positions of division of a core layer, while V-cut V-grooves are present at the positions of division of surface layers. The multilayered substrate divisible at predetermined positions of division is also configured such that first intermittently formed holes (perforation-like holes, slit-like holes, or widely spaced holes) are present at the positions of division of the core layer, while second intermittently formed holes (perforation-like holes, or slit-like holes) are present at the positions of division of the surface layers so as to pass through the multilayered substrate, and at the positions of division of the core layer, each of the second holes is located between the adjacent first holes, whereby the first holes and the second holes are continuous with each other.