Patents by Inventor Kotaro Tomeoka
Kotaro Tomeoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11404286Abstract: A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering only top faces on the upper surface side of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: GrantFiled: March 20, 2020Date of Patent: August 2, 2022Assignee: OHKUCHI MATERIALS CO., LTD.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Patent number: 11062983Abstract: A substrate for mounting a semiconductor element thereon has columnar terminal portions formed by concavities provided on an upper surface of a metal plate made of a copper-based material, and is provided with a roughened silver plating layer having acicular projections, applied, as the outermost plating layer, to top faces of the columnar terminal portions. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The substrate for mounting a semiconductor element thereon facilitates thin design of semiconductor packages produced by flip-chip mounting, can be manufactured with improved productivity owing to reduction in cost and operation time, achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: GrantFiled: March 20, 2020Date of Patent: July 13, 2021Assignee: OHKUCHI MATERIALS CO., LTD.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Patent number: 10903150Abstract: A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering top faces and faces that form concavities or a through hole between the top faces and bottom faces of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: GrantFiled: March 20, 2020Date of Patent: January 26, 2021Assignee: OHKUCHI MATERIALS CO., LTD.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Patent number: 10847451Abstract: A device for mounting a semiconductor element includes a metal plate serving as a base, a roughened silver plating layer with acicular projections, formed on at least either of: (a) top faces; and (b) faces that form concavities or through holes between the top faces and bottom faces; of the metal plate, and a reinforcing plating layer covering, as an outermost plating layer, an outer surface of the acicular projections in the roughened silver plating layer. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. An outer surface of the reinforcing plating layer is shaped to have acicular projections with a surface area ratio of 1.30 or more and 6.00 or less to the corresponding smooth surface, as inheriting the shape of the acicular projections in the roughened silver plating layer.Type: GrantFiled: March 27, 2020Date of Patent: November 24, 2020Assignee: OHKUCHI MATERIALS CO., LTD.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Patent number: 10811346Abstract: A lead frame includes a lead frame substrate made of a copper-based material, plating layers composed of nickel, palladium and gold layers laminated in this order on top faces and bottom faces of the lead frame substrate, and a roughened silver plating layer having acicular projections, provided as an outermost plating layer and covering faces of the lead frame substrate that form concavities or a through hole between the top faces and the bottom faces of the lead frame substrate. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: GrantFiled: March 20, 2020Date of Patent: October 20, 2020Assignee: OHKUCHI MATERIALS CO., LTD.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Publication number: 20200312752Abstract: A substrate for mounting a semiconductor element thereon includes a metal plate and columnar terminal portions composed only of plating layers and formed on one-side surface of the metal plate. The columnar terminal portions include, as an outermost plating layer, a roughened silver plating layer having acicular projections. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The substrate for mounting a semiconductor element thereon can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer, which are to serve as terminals and the like, to be thin.Type: ApplicationFiled: March 24, 2020Publication date: October 1, 2020Applicant: Ohkuchi Materials Co., Ltd.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Publication number: 20200312753Abstract: A device for mounting a semiconductor element includes a metal plate serving as a base, a roughened silver plating layer with acicular projections, formed on at least either of: (a) top faces; and (b) faces that form concavities or through holes between the top faces and bottom faces; of the metal plate, and a reinforcing plating layer covering, as an outermost plating layer, an outer surface of the acicular projections in the roughened silver plating layer. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. An outer surface of the reinforcing plating layer is shaped to have acicular projections with a surface area ratio of 1.30 or more and 6.00 or less to the corresponding smooth surface, as inheriting the shape of the acicular projections in the roughened silver plating layer.Type: ApplicationFiled: March 27, 2020Publication date: October 1, 2020Applicant: Ohkuchi Materials Co., Ltd.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Publication number: 20200303289Abstract: A substrate for mounting a semiconductor element thereon has columnar terminal portions formed by concavities provided on an upper surface of a metal plate made of a copper-based material, and is provided with a roughened silver plating layer having acicular projections, applied, as the outermost plating layer, to top faces of the columnar terminal portions. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The substrate for mounting a semiconductor element thereon facilitates thin design of semiconductor packages produced by flip-chip mounting, can be manufactured with improved productivity owing to reduction in cost and operation time, achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: ApplicationFiled: March 20, 2020Publication date: September 24, 2020Applicant: Ohkuchi Materials Co., Ltd.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Publication number: 20200303287Abstract: A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering the entire surface of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: ApplicationFiled: March 20, 2020Publication date: September 24, 2020Applicant: Ohkuchi Materials Co., Ltd.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Publication number: 20200303286Abstract: A lead frame includes a lead frame substrate made of a copper-based material, plating layers composed of nickel, palladium and gold layers laminated in this order on top faces and bottom faces of the lead frame substrate, and a roughened silver plating layer having acicular projections, provided as an outermost plating layer and covering faces of the lead frame substrate that form concavities or a through hole between the top faces and the bottom faces of the lead frame substrate. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: ApplicationFiled: March 20, 2020Publication date: September 24, 2020Applicant: Ohkuchi Materials Co., Ltd.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Publication number: 20200303288Abstract: A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering top faces and faces that form concavities or a through hole between the top faces and bottom faces of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: ApplicationFiled: March 20, 2020Publication date: September 24, 2020Applicant: Ohkuchi Materials Co., Ltd.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Publication number: 20200303210Abstract: A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering only top faces on the upper surface side of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: ApplicationFiled: March 20, 2020Publication date: September 24, 2020Applicant: Ohkuchi Materials Co., Ltd.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Patent number: 10777492Abstract: A substrate for mounting a semiconductor element thereon includes a metal plate and columnar terminal portions composed only of plating layers and formed on one-side surface of the metal plate. The columnar terminal portions include, as an outermost plating layer, a roughened silver plating layer having acicular projections. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The substrate for mounting a semiconductor element thereon can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer, which are to serve as terminals and the like, to be thin.Type: GrantFiled: March 24, 2020Date of Patent: September 15, 2020Assignee: OHKUCHI MATERIALS CO., LTD.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
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Patent number: 10763196Abstract: A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering the entire surface of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.Type: GrantFiled: March 20, 2020Date of Patent: September 1, 2020Assignee: OHKUCHI MATERIALS CO., LTD.Inventors: Kaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka