Abstract: A temperature measuring device which measures a temperature of a heat treatment mechanism in a heat treatment apparatus which heat-treats a substrate with a predetermined temperature using the heat treatment mechanism, includes: a substrate and a Wheatstone bridge circuit which is disposed on the substrate and includes a plurality of temperature-measuring resistors whose resistance is varied depending on a change in temperature.

Abstract: Disclosed is a temperature measuring apparatus which is provided with: a substrate (2); a temperature sensor (3) disposed on one surface of the substrate (2); and a wire (8) disposed to electrically connect together a circuit, which detects a temperature using the temperature sensor (3), and the temperature sensor (3). In said surface of the substrate (2), a recessed section (7) having a heat capacity smaller than that of the material of the substrate (2) is formed on the periphery of the temperature sensor (3). The recessed section (7) is formed at a predetermined interval from the temperature sensor (3) such that the recessed section surrounds the temperature sensor (3) and has predetermined width and depth. Preferably, the low heat capacity zone is the recessed section (7), i.e., the groove having a recessed cross-section.

Abstract: A wafer-type temperature sensor may include a wafer for temperature detection; a circuit board bonded to one surface of the wafer for temperature detection; at least one temperature data detector provided on the one surface of the wafer for temperature detection and capable of detecting temperature data; and a temperature detecting unit mounted on the circuit board and capable of detecting a temperature of the wafer for temperature detection from the temperature data detected by the temperature data detector. Here, a difference between a linear expansion coefficient of the circuit board and a linear expansion coefficient of the wafer for temperature detection may be equal to or less than a predetermined value.